Patent US6841423B2 successfully refreshed from Google Patents.
US6841423B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Methods for formation of recessed encapsulated microelectronic devices
Assignee: Micron Technology Inc
•
Filing: 2002-12-16
•
Granted: 2005-01-11
•
Expires: 2022-12-16
Abstract
Abstract A method for manufacturing microelectronic device packages. In one embodiment, the device package can include a support member having a first surface, a second surface facing opposite the first surface and a cavity extending through the support member from the first surface to the second surface. A microelectronic device is disposed in the cavity and is supported in the cavity with a removable retention member. The microelectronic device is electrically coupled to the support member and is partially surrounded with an encapsulating material. The removable retention member is then removed to expose a surface of the microelectronic device. Accordingly, the package can have a low profile because the encapsulating material does not surround one of the microelectronic device surfaces. In one embodiment, a heat conductive material can be engaged with the exposed surface of the microelectronic device to increase the rate at which heat is transferred away from the microelectronic device.
Inventors
- 👤 Warren M. Farnworth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:28
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/019; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W72/00; H10W72/071; H10W72/075; H10W72/07502; H10W72/07504; H10W72/50; H10W72/551; H10W72/90; H10W72/951; H10W74/131; H10W74/142
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
150 words
A method for packaging a microelectronic device having a first face and a second face opposite the first face, comprising: positioning the microelectronic device adjacent to a support member, the support member including a generally non-conductive substrate carrying conductive elements, the support member having a first surface, a second surface facing opposite the first surface and a cavity extending through the support member from the first surface to the second surface; disposing the microelectronic device in the cavity such that the second face is approximately flush with the second surface of the support member; encapsulating a portion of the microelectronic device in the cavity with an encapsulating material while temporarily covering the second face of the microelectronic device with a releasable cover adhesively attached to the microelectronic device to at least restrict contact between the encapsulating material and the second face of the microelectronic device; and removing the releasable cover.
Claim 2
Independent Claim
150 words
A method for packaging a microelectronic device having a first face and a second face opposite the first face, comprising: positioning the microelectronic device adjacent to a support member, the support member including a generally non-conductive substrate carrying conductive elements, the support member having a first surface, a second surface facing opposite the first surface and a cavity extending through the support member from the first surface to the second surface; disposing the microelectronic device in the cavity such that the second face is approximately flush with the second surface of the support member; encapsulating a portion of the microelectronic device in the cavity with an encapsulating material while temporarily covering the second face of the microelectronic device with a releasable cover adhesively attached to the microelectronic device to at least restrict contact between the encapsulating material and the second face of the microelectronic device; and removing the releasable cover.
Claim 3
Dependent Claim
111 words
The method of claim 1 , wherein the releasable cover includes an adhesive layer, and wherein the method further comprises: positioning the adhesive layer adjacent to the second surface of the support member with an adhesive portion of the adhesive layer extending over at least a portion of the cavity adjacent to the second surface of the support member; removably attaching the adhesive layer to the microelectronic device while the microelectronic device is positioned in the cavity and before at least partially surrounding the microelectronic device; and removing the adhesive layer from the support member and the microelectronic device after at least partially surrounding the microelectronic device with the encapsulating material.
Claim 4
Dependent Claim
20 words
The method of claim 1 , wherein removing the releasable cover includes exposing the second face of the microelectronic device.
Claim 5
Dependent Claim
77 words
The method of claim 1 , wherein the microelectronic device has a first face engaged with the encapsulating material and a second face facing opposite the first face, and the encapsulating material has a first heat transfer coefficient, and wherein the method further comprises disposing a heat conductive material in direct contact with the second face of the microelectronic device, the heat conductive material having a second heat transfer coefficient higher than the first heat transfer coefficient.
Claim 6
Dependent Claim
24 words
The method of claim 4 , wherein disposing a heat conductive material includes positioning silicon nitride against the second face of the microelectronic device.
Claim 7
Dependent Claim
26 words
The method of claim 1 wherein positioning the microelectronic device adjacent to a support member includes positioning the microelectronic device adjacent to a printed circuit board.
Claim 8
Independent Claim
154 words
A method for packaging a microelectronic device having a first face and a second face opposite the first face, comprising: positioning the microelectronic device adjacent to a support member, the support member having a first surface, a second surface facing opposite the first surface and a cavity extending through the support member from the first surface to the second surface; disposing the microelectronic device in the cavity such that the second face is approximately flush with the second surface of the support member; encapsulating a portion of the microelectronic device in the cavity with an encapsulating material while temporarily covering the second face of the microelectronic device with a releasable cover by applying an electrostatic charge to a releasable cover; supporting the microelectronic device relative to the cavity with the electrostatic charge to at least restrict contact between the encapsulating material and the second face of the microelectronic device; and removing the releasable cover.
Claim 9
Independent Claim
154 words
A method for packaging a microelectronic device having a first face and a second face opposite the first face, comprising: positioning the microelectronic device adjacent to a support member, the support member having a first surface, a second surface facing opposite the first surface and a cavity extending through the support member from the first surface to the second surface; disposing the microelectronic device in the cavity such that the second face is approximately flush with the second surface of the support member; encapsulating a portion of the microelectronic device in the cavity with an encapsulating material while temporarily covering the second face of the microelectronic device with a releasable cover by applying an electrostatic charge to a releasable cover; supporting the microelectronic device relative to the cavity with the electrostatic charge to at least restrict contact between the encapsulating material and the second face of the microelectronic device; and removing the releasable cover.
Claim 10
Independent Claim
140 words
A method for packaging a microelectronic device, comprising: positioning a microelectronic device proximate to a support member, the support member including a generally non-conductive substrate carrying conductive elements, the support member having a first surface, a second surface facing opposite the first surface, a cavity extending through the support member from the first surface to the second surface, and an adhesive film adjacent to the second surface of the support member; disposing a microelectronic device in the cavity, the microelectronic device having a first face and a second face facing opposite the first face; engaging the second face of the microelectronic device with a portion of the adhesive film accessible through the cavity; electrically coupling the microelectronic device to the support member; partially surrounding the microelectronic device with an encapsulating material; and removing the adhesive film from the support member.
Claim 11
Independent Claim
140 words
A method for packaging a microelectronic device, comprising: positioning a microelectronic device proximate to a support member, the support member including a generally non-conductive substrate carrying conductive elements, the support member having a first surface, a second surface facing opposite the first surface, a cavity extending through the support member from the first surface to the second surface, and an adhesive film adjacent to the second surface of the support member; disposing a microelectronic device in the cavity, the microelectronic device having a first face and a second face facing opposite the first face; engaging the second face of the microelectronic device with a portion of the adhesive film accessible through the cavity; electrically coupling the microelectronic device to the support member; partially surrounding the microelectronic device with an encapsulating material; and removing the adhesive film from the support member.
Claim 12
Dependent Claim
19 words
The method of claim 8 , wherein removing the film includes exposing the second face of the microelectronic device.
Claim 13
Dependent Claim
55 words
The method of claim 8 , wherein the encapsulating material has a first heat transfer coefficient, and wherein the method further comprises disposing a heat conductive material in direct contact with the second face of the microelectronic device, the heat conductive material having a second heat transfer coefficient higher than the first heat transfer coefficient.
Claim 14
Dependent Claim
24 words
The method of claim 10 , wherein disposing a heat conductive material includes positioning silicon nitride against the second face of the microelectronic device.
Claim 15
Dependent Claim
56 words
The method of claim 8 , further comprising disposing the microelectronic device in the cavity with the second face of the microelectronic device at least approximately flush with the second surface of the support member and the first face of the microelectronic device approximately flush with or recessed from the first surface of the support member.
Claim 16
Dependent Claim
52 words
The method of claim 8 , further comprising disposing the microelectronic device in the cavity with the second face of the microelectronic device at least approximately flush with the second surface of the support member and the first face of the microelectronic projecting outwardly from the first surface of the support member.
Claim 17
Dependent Claim
26 words
The method of claim 8 wherein positioning the microelectronic device adjacent to a support member includes positioning the microelectronic device adjacent to a printed circuit board.
Claim 18
Independent Claim
224 words
A method for transferring heat from a microelectronic device, comprising: positioning the microelectronic device adjacent to a support member, the support member including a generally non-conductive substrate carrying conductive elements, the support member having a first surface, a second surface facing opposite the first surface, and a cavity extending through the support member from the first surface to the second surface; disposing the microelectronic device in the cavity with a first face of the microelectronic device facing opposite a second face of the microelectronic device; supporting the microelectronic device relative to the cavity with a releasable adhesive member; electrically coupling the microelectronic device to the support member; removing the adhesive member; partially surrounding the microelectronic device and the support member with an encapsulating material by disposing the encapsulating material adjacent to the microelectronic device in a first region extending outwardly from the first surface of the microelectronic device without coupling the encapsulating material to the microelectronic device in a second region extending outwardly from the second surface of the support member; directly engaging the second face of the microelectronic device with a heat conductive material having a heat transfer coefficient higher than a heat transfer coefficient of the encapsulating material; and dissipating heat from the microelectronic substrate by transferring heat directly from the second face of the microelectronic device to the heat conductive material.
Claim 19
Independent Claim
224 words
A method for transferring heat from a microelectronic device, comprising: positioning the microelectronic device adjacent to a support member, the support member including a generally non-conductive substrate carrying conductive elements, the support member having a first surface, a second surface facing opposite the first surface, and a cavity extending through the support member from the first surface to the second surface; disposing the microelectronic device in the cavity with a first face of the microelectronic device facing opposite a second face of the microelectronic device; supporting the microelectronic device relative to the cavity with a releasable adhesive member; electrically coupling the microelectronic device to the support member; removing the adhesive member; partially surrounding the microelectronic device and the support member with an encapsulating material by disposing the encapsulating material adjacent to the microelectronic device in a first region extending outwardly from the first surface of the microelectronic device without coupling the encapsulating material to the microelectronic device in a second region extending outwardly from the second surface of the support member; directly engaging the second face of the microelectronic device with a heat conductive material having a heat transfer coefficient higher than a heat transfer coefficient of the encapsulating material; and dissipating heat from the microelectronic substrate by transferring heat directly from the second face of the microelectronic device to the heat conductive material.
Claim 20
Dependent Claim
24 words
The method of claim 15 , wherein disposing a heat conductive material includes positioning silicon nitride against the second face of the microelectronic device.
Claim 21
Dependent Claim
56 words
The method of claim 15 , further comprising disposing the microelectronic device in the cavity with the second face of the microelectronic device at least approximately flush with the second surface of the support member and the first face of the microelectronic device approximately flush with or recessed from the first surface of the support member.
Claim 22
Dependent Claim
52 words
The method of claim 15 , further comprising disposing the microelectronic device in the cavity with the second face of the microelectronic device at least approximately flush with the second surface of the support member and the first face of the microelectronic projecting outwardly from the first surface of the support member.
Claim 23
Dependent Claim
26 words
The method of claim 15 wherein positioning the microelectronic device adjacent to a support member includes positioning the microelectronic device adjacent to a printed circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-01-11 | 2008-07-12 | 2009-01-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-01-11 | 2012-07-12 | 2013-01-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-01-11 | 2016-07-12 | 2017-01-11 | $7700.00 | Window Closed / Lapsed |