US6103547A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High speed IC package configuration
Assignee: Micron Technology Inc
•
Filing: 1997-01-17
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Granted: 2000-08-15
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Expires: 2017-01-17
Abstract
Abstract Devices and methods for reducing lead inductance in integrated circuit (IC) packages. More specifically to an integrated circuit package configuration for high speed applications where the inductance of the leads is reduced or minimized in high capacity semiconductor device packages. The integrated circuit package assembly comprises a substrate, semiconductor device, insulating covering or coating, if desired, a semiconductor device retainer, lead frame, and wire bond interconnections.
Inventors
- 👤 David J. Corisis
- 👤 Brent Keeth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:47
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W44/501; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/547; H10W72/5475; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 41
Claim 1
Independent Claim
177 words
A method of assembling a semiconductor device assembly, said method comprising the steps of: providing a substrate having a first side and a second side thereof; providing a semiconductor device having an active surface and at least one bond pad thereon; connecting the semiconductor device to the substrate; providing an insulation material for covering a portion of the active surface of the semiconductor device; providing a plurality of leads; placing the insulation material on a portion of the surface of the semiconductor device; providing a semiconductor retainer device; retaining the semiconductor device in relation to the substrate using the semiconductor retainer device, the semiconductor retainer device extending over a portion of the insulation material on the surface of the semiconductor device and a portion to the substrate; securing a portion of the at least one lead of the plurality of leads to the a portion of the substrate; and forming at least one wire bond interconnection between the at least one lead of the lead frame and the at least one bond pad of the semiconductor device.
Claim 2
Independent Claim
177 words
A method of assembling a semiconductor device assembly, said method comprising the steps of: providing a substrate having a first side and a second side thereof; providing a semiconductor device having an active surface and at least one bond pad thereon; connecting the semiconductor device to the substrate; providing an insulation material for covering a portion of the active surface of the semiconductor device; providing a plurality of leads; placing the insulation material on a portion of the surface of the semiconductor device; providing a semiconductor retainer device; retaining the semiconductor device in relation to the substrate using the semiconductor retainer device, the semiconductor retainer device extending over a portion of the insulation material on the surface of the semiconductor device and a portion to the substrate; securing a portion of the at least one lead of the plurality of leads to the a portion of the substrate; and forming at least one wire bond interconnection between the at least one lead of the lead frame and the at least one bond pad of the semiconductor device.
Claim 3
Dependent Claim
18 words
The method of claim 1, wherein the semiconductor device is mounted on the first side of the substrate.
Claim 4
Dependent Claim
12 words
The method of claim 1, wherein the substrate contains an aperture therein.
Claim 5
Dependent Claim
20 words
The method of claim 3, further comprising the step of: retaining the semiconductor device within the aperture in the substrate.
Claim 6
Dependent Claim
28 words
The method of claim 4, further comprising the step of: connecting the semiconductor device retainer to the portion of the semiconductor device and the portion of the substrate.
Claim 7
Dependent Claim
32 words
The method of claim 5, further comprising the step of: connecting the semiconductor device retainer to a portion of the semiconductor device and a portion of the second side of the substrate.
Claim 8
Dependent Claim
19 words
The method of claim 6, further comprising the step of: attaching the semiconductor device to the semiconductor device retainer.
Claim 9
Dependent Claim
27 words
The method of claim 1, wherein the insulating material for covering the portion of the active surface of the semiconductor device includes tape or an adhesive layer.
Claim 10
Dependent Claim
21 words
The method of claim 1, further comprising the step of: attaching the insulation material to the portion of the semiconductor device.
Claim 11
Dependent Claim
35 words
The method of claim 1, further comprising the step of: adhesively attaching a portion of the insulation material to the semiconductor device; and adhesively attaching a portion of the lead frame to the insulation material.
Claim 12
Dependent Claim
27 words
The method of claim 1, wherein the semiconductor device retainer engages the portion of the semiconductor device and the portion of the second side of the substrate.
Claim 13
Dependent Claim
31 words
The method of claim 1, wherein the semiconductor device retainer engages the portion of the semiconductor device and the portion of the first side and the second side of the substrate.
Claim 14
Dependent Claim
26 words
The method of claim 1, wherein the lead frame includes a first plurality of leads, a second plurality of leads, and a third plurality of leads.
Claim 15
Dependent Claim
37 words
The method of claim 1, wherein the lead frame includes a first plurality of leads, a second plurality of leads, and a third plurality of leads, the second plurality of leads having a portion thereof connected together.
Claim 16
Dependent Claim
37 words
The method of claim 1, wherein the lead frame includes a first plurality of leads, a second plurality of leads, and a third plurality of leads, the third plurality of leads having a portion thereof connected together.
Claim 17
Dependent Claim
38 words
The method of claim 1, wherein the lead frame includes a first plurality of leads, a second plurality of leads having a portion thereof connected together, and a third plurality of leads having a portion thereof connected together.
Claim 18
Dependent Claim
91 words
The method of claim 1, wherein the lead frame includes a first plurality of leads, a second plurality of leads having a portion thereof connected together to form a substantially unitary lead, and a third plurality of leads having a portion thereof connected together to form a substantially unitary lead, at least a portion of the unitary lead portion of the second plurality of leads and a portion of the unitary lead portion of the third plurality of leads extending over a portion of the active surface of the semiconductor device.
Claim 19
Dependent Claim
60 words
The method of claim 1, wherein the lead frame includes a first plurality of leads, a second plurality of leads having a portion thereof connected together to form a substantially unitary lead terminating adjacent the semiconductor device, and a third plurality of leads having a portion thereof connected together to form a substantially unitary lead terminating adjacent the semiconductor device.
Claim 20
Dependent Claim
99 words
The method of claim 1, wherein the lead frame includes a first plurality of leads, a second plurality of leads having a portion thereof connected together to form a substantially unitary lead, a portion of the unitary lead portion of the second plurality of leads extending over a portion of the semiconductor device and terminating thereover, and a third plurality of leads having a portion thereof connected together to form a substantially unitary lead, a portion of the unitary lead portion of the third plurality of leads extending over a portion of the active surface of the semiconductor device.
Claim 21
Dependent Claim
96 words
The method of claim 1, wherein the lead frame includes a first plurality of leads, a second plurality of leads having a portion thereof connected together to form a substantially unitary lead, the unitary lead portion of the second plurality of leads extending over a portion of the semiconductor device, and a third plurality of leads having a portion thereof connected together to form a substantially unitary lead, a portion of the unitary lead portion of the third plurality of leads extending over a portion of the active surface of the semiconductor device and terminating thereover.
Claim 22
Dependent Claim
52 words
The method of claim 1, wherein the lead frame includes a first plurality of leads, a second plurality of leads having a portion thereof connected together overlaying a portion of the semiconductor device, and a third plurality of leads having a portion thereof connected together overlaying a portion of the semiconductor device.
Claim 23
Dependent Claim
57 words
The method of claim 1, wherein the lead frame includes a first plurality of leads terminating adjacent the semiconductor device, a second plurality of leads having a portion thereof connected together overlaying a portion of the semiconductor device, and a third plurality of leads having a portion thereof connected together overlaying a portion of the semiconductor device.
Claim 24
Dependent Claim
15 words
The method of claim 1, further comprising: encapsulating the semiconductor device in an encapsulating material.
Claim 25
Dependent Claim
21 words
The method of claim 1, further comprising: encapsulating the semiconductor device and a portion of the substrate in an encapsulating material.
Claim 26
Dependent Claim
18 words
The method of claim 1, further comprising: encapsulating the semiconductor device and the substrate in an encapsulating material.
Claim 27
Dependent Claim
16 words
The method of claim 1, further comprising: deforming a portion of the at least one lead.
Claim 28
Independent Claim
201 words
A method of assembling a semiconductor device assembly, said method comprising the steps of: providing a substrate having a first side and a second side thereof; providing a semiconductor device having an active surface and an inactive surface, the active surface of the semiconductor device having at least one bond pad thereon; placing the inactive surface of the semiconductor device on the first side of the substrate; providing an insulation material for covering a portion of the active surface of the semiconductor device; providing a plurality of leads; placing the insulation material on a portion of the surface of the semiconductor device; providing a semiconductor retainer device; retaining the semiconductor device on the first side of the substrate using the semiconductor retainer device, the semiconductor retainer device extending over a portion of the insulation material on the surface of the semiconductor device and extending over a portion of the first side of the substrate; securing a portion of the at least one lead of the plurality of leads to a portion of the substrate; and forming at least one interconnection between at least one lead of the plurality of leads and the at least one bond pad of the semiconductor device.
Claim 29
Independent Claim
201 words
A method of assembling a semiconductor device assembly, said method comprising the steps of: providing a substrate having a first side and a second side thereof; providing a semiconductor device having an active surface and an inactive surface, the active surface of the semiconductor device having at least one bond pad thereon; placing the inactive surface of the semiconductor device on the first side of the substrate; providing an insulation material for covering a portion of the active surface of the semiconductor device; providing a plurality of leads; placing the insulation material on a portion of the surface of the semiconductor device; providing a semiconductor retainer device; retaining the semiconductor device on the first side of the substrate using the semiconductor retainer device, the semiconductor retainer device extending over a portion of the insulation material on the surface of the semiconductor device and extending over a portion of the first side of the substrate; securing a portion of the at least one lead of the plurality of leads to a portion of the substrate; and forming at least one interconnection between at least one lead of the plurality of leads and the at least one bond pad of the semiconductor device.
Claim 30
Dependent Claim
22 words
The method of claim 27, wherein the semiconductor retainer device further extends over a portion of the second side of the substrate.
Claim 31
Independent Claim
208 words
A method of assembling a semiconductor device assembly, said method comprising the steps of: providing a substrate having a first side and a second side thereof; providing a semiconductor device having an active surface and an inactive surface, the active surface of the semiconductor device having at least one bond pad thereon; connecting the inactive surface of the semiconductor device to the substrate; providing an insulation material for covering a portion of the active surface of the semiconductor device; providing a plurality of leads; providing the insulation material on a portion of the surface of the semiconductor device; providing a semiconductor retainer device; retaining the semiconductor device on the first side of the substrate using the semiconductor retainer device, the semiconductor retainer device extending over a portion of the insulation material on the surface of the semiconductor device, extending over a portion of the first side of the substrate, and extending over a portion of the second side of the substrate; securing a portion of the at least one lead of the plurality of leads to a portion of the substrate; and forming at least one interconnection between at least one lead of the plurality of leads and the at least one bond pad of the semiconductor device.
Claim 32
Independent Claim
208 words
A method of assembling a semiconductor device assembly, said method comprising the steps of: providing a substrate having a first side and a second side thereof; providing a semiconductor device having an active surface and an inactive surface, the active surface of the semiconductor device having at least one bond pad thereon; connecting the inactive surface of the semiconductor device to the substrate; providing an insulation material for covering a portion of the active surface of the semiconductor device; providing a plurality of leads; providing the insulation material on a portion of the surface of the semiconductor device; providing a semiconductor retainer device; retaining the semiconductor device on the first side of the substrate using the semiconductor retainer device, the semiconductor retainer device extending over a portion of the insulation material on the surface of the semiconductor device, extending over a portion of the first side of the substrate, and extending over a portion of the second side of the substrate; securing a portion of the at least one lead of the plurality of leads to a portion of the substrate; and forming at least one interconnection between at least one lead of the plurality of leads and the at least one bond pad of the semiconductor device.
Claim 33
Independent Claim
177 words
A method of assembling a semiconductor device assembly, said method comprising the steps of: providing a substrate having a first side and a second side thereof; providing a semiconductor device having an active surface and an inactive surface, the active surface of the semiconductor device having at least one bond pad thereon; connecting the inactive surface of the semiconductor device to the substrate; providing a plurality of leads; providing an insulation material on a portion of the surface of the semiconductor device; providing a semiconductor retainer device; retaining the semiconductor device on the first side of the substrate using the semiconductor retainer device, the semiconductor retainer device extending over a portion of the insulation material on the surface of the semiconductor device and extending over a portion of the substrate; securing a portion of the at least one lead of the plurality of leads to a portion of the substrate; and forming at least one interconnection between at least one lead of the plurality of leads and the at least one bond pad of the semiconductor device.
Claim 34
Independent Claim
177 words
A method of assembling a semiconductor device assembly, said method comprising the steps of: providing a substrate having a first side and a second side thereof; providing a semiconductor device having an active surface and an inactive surface, the active surface of the semiconductor device having at least one bond pad thereon; connecting the inactive surface of the semiconductor device to the substrate; providing a plurality of leads; providing an insulation material on a portion of the surface of the semiconductor device; providing a semiconductor retainer device; retaining the semiconductor device on the first side of the substrate using the semiconductor retainer device, the semiconductor retainer device extending over a portion of the insulation material on the surface of the semiconductor device and extending over a portion of the substrate; securing a portion of the at least one lead of the plurality of leads to a portion of the substrate; and forming at least one interconnection between at least one lead of the plurality of leads and the at least one bond pad of the semiconductor device.
Claim 35
Dependent Claim
22 words
The method of claim 29, wherein the semiconductor retainer device further extends over a portion of the second side of the substrate.
Claim 36
Independent Claim
170 words
A method of assembling a semiconductor device assembly, said method comprising the steps of: providing a substrate having a first side and a second side thereof; providing a semiconductor device having an active surface and an inactive surface, the active surface of the semiconductor device having at least one bond pad thereon and having an insulative material on at least a portion thereof; connecting the semiconductor device to the substrate; providing a plurality of leads; providing a semiconductor retainer device; retaining the semiconductor device on the first side of the substrate using the semiconductor retainer device, the semiconductor retainer device extending over a portion of the insulation material on the surface of the semiconductor device and extending over a portion of the substrate; securing a portion of the at least one lead of the plurality of leads to the portion of the substrate; and forming at least one interconnection between at least one lead of the plurality of leads and the at least one bond pad of the semiconductor device.
Claim 37
Independent Claim
170 words
A method of assembling a semiconductor device assembly, said method comprising the steps of: providing a substrate having a first side and a second side thereof; providing a semiconductor device having an active surface and an inactive surface, the active surface of the semiconductor device having at least one bond pad thereon and having an insulative material on at least a portion thereof; connecting the semiconductor device to the substrate; providing a plurality of leads; providing a semiconductor retainer device; retaining the semiconductor device on the first side of the substrate using the semiconductor retainer device, the semiconductor retainer device extending over a portion of the insulation material on the surface of the semiconductor device and extending over a portion of the substrate; securing a portion of the at least one lead of the plurality of leads to the portion of the substrate; and forming at least one interconnection between at least one lead of the plurality of leads and the at least one bond pad of the semiconductor device.
Claim 38
Dependent Claim
22 words
The method of claim 32, wherein the semiconductor retainer device further extends over a portion of the second side of the substrate.
Claim 39
Independent Claim
194 words
A method of assembling a semiconductor device assembly, said method comprising the steps of: providing a substrate having a first side and a second side thereof; providing a semiconductor device having an active surface and an inactive surface, the active surface of the semiconductor device having at least one bond pad thereon and having an insulative material on at least a portion thereof; connecting the semiconductor device to the substrate; providing a plurality of leads; providing a semiconductor retainer device; retaining the semiconductor device on the first side of the substrate using the semiconductor retainer device, the semiconductor retainer device extending over a portion of the insulation material on the surface of the semiconductor device and extending over a portion of the substrate; securing a portion of the at least one lead of the plurality of leads to the portion of the substrate; securing another lead of the plurality of leads to the substrate and having a portion thereof extending over a portion of the semiconductor device; and forming at least one interconnection between at least one lead of the plurality of leads and the at least one bond pad of the semiconductor device.
Claim 40
Independent Claim
194 words
A method of assembling a semiconductor device assembly, said method comprising the steps of: providing a substrate having a first side and a second side thereof; providing a semiconductor device having an active surface and an inactive surface, the active surface of the semiconductor device having at least one bond pad thereon and having an insulative material on at least a portion thereof; connecting the semiconductor device to the substrate; providing a plurality of leads; providing a semiconductor retainer device; retaining the semiconductor device on the first side of the substrate using the semiconductor retainer device, the semiconductor retainer device extending over a portion of the insulation material on the surface of the semiconductor device and extending over a portion of the substrate; securing a portion of the at least one lead of the plurality of leads to the portion of the substrate; securing another lead of the plurality of leads to the substrate and having a portion thereof extending over a portion of the semiconductor device; and forming at least one interconnection between at least one lead of the plurality of leads and the at least one bond pad of the semiconductor device.
Claim 41
Dependent Claim
22 words
The method of claim 34, wherein the semiconductor retainer device further extends over a portion of the second side of the substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-08-15 | 2004-02-14 | 2004-08-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-08-15 | 2008-02-14 | 2008-08-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-08-15 | 2012-02-14 | 2012-08-15 | $7700.00 | Window Closed / Lapsed |