US5447888A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pins
Assignee: Kyushu Fujitsu Electronics Ltd
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Filing: 1994-02-08
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Granted: 1995-09-05
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Expires: 2014-02-08
Abstract
Abstract A process wherein the parts of a lead frame that are outside a cavity are directly supported by ejecting pins extending from above and from below when the lead frame is sandwiched between an upper die and a lower die. The ejecting pins eject the lead frame, on which a package is formed, after a resin mold process.
Inventors
- 👤 Akira Takashima
- 👤 Toshiyuki Honda
- 👤 Masaki Waki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:04
CPC Classifications
B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
170 words
A method of fabricating a semiconductor device comprising the steps of: mounting a semiconductor chip on a stage defined on a conductor medium; bonding terminal pads on said semiconductor chip to inner leads provided on said conductor medium by a conductor wire; placing said conductor medium, carrying said semiconductor chip on said stage thereof, such that said stage and said semiconductor chip are disposed in a cavity created by a movable upper die and a movable lower die, with portions of said conductor medium extending, laterally, outwardly from said cavity and such that said conductor medium is supported in said laterally, outwardly extending portions thereof by respective ejectors which are movably held in said upper and lower dies and extend therefrom toward and into engagement with the laterally, outwardly extending portions of said conductor medium, respectively on upper and lower sides thereof; filling said cavity with a molten resin; separating said upper die and said lower die from each other; and ejecting said conductor medium by actuating said ejecting members.
Claim 2
Independent Claim
170 words
A method of fabricating a semiconductor device comprising the steps of: mounting a semiconductor chip on a stage defined on a conductor medium; bonding terminal pads on said semiconductor chip to inner leads provided on said conductor medium by a conductor wire; placing said conductor medium, carrying said semiconductor chip on said stage thereof, such that said stage and said semiconductor chip are disposed in a cavity created by a movable upper die and a movable lower die, with portions of said conductor medium extending, laterally, outwardly from said cavity and such that said conductor medium is supported in said laterally, outwardly extending portions thereof by respective ejectors which are movably held in said upper and lower dies and extend therefrom toward and into engagement with the laterally, outwardly extending portions of said conductor medium, respectively on upper and lower sides thereof; filling said cavity with a molten resin; separating said upper die and said lower die from each other; and ejecting said conductor medium by actuating said ejecting members.
Claim 3
Dependent Claim
47 words
A method of fabricating a semiconductor device as claimed in claim 1, wherein said step of separating said upper die and said lower die from each other is conducted substantially simultaneously with said step of ejecting said conductor medium from said upper die and said lower die.
Claim 4
Dependent Claim
35 words
A method of fabricating a semiconductor device as claimed in claim 1, wherein said ejecting means comprises pins that are movably received in corresponding through holes provided in said upper die and said lower die.
Claim 5
Dependent Claim
37 words
A method of fabricating a semiconductor device as claimed in claim 1, wherein said step of placing is conducted such that said ejecting means support those portions of said conductor medium that are located outside said cavity.
Claim 6
Dependent Claim
65 words
A method of fabricating a semiconductor device as claimed in claim 1, wherein said upper die and said lower die can be moved to approach each other, and said step of ejecting is carried out such that said ejecting means provided on said lower die lifts up said conductor medium from said lower die after said lower die is moved away from said upper die.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-09-04 | 1999-03-06 | 1999-09-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-09-04 | 2003-03-06 | 2003-09-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-09-04 | 2007-03-06 | 2007-09-05 | $7700.00 | Window Closed / Lapsed |