US6020629A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stacked semiconductor package and method of fabrication
Assignee: Micron Technology Inc
•
Filing: 1998-06-05
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Granted: 2000-02-01
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Expires: 2018-06-05
Abstract
Abstract A semiconductor package and a method for fabricating the package are provided. The package includes multiple substrates in a stacked configuration, each having a semiconductor die mounted thereon. Each substrate includes matching patterns of external contacts and contact pads formed on opposing sides of the substrate, and interconnected by interlevel conductors through the substrate. In the package, the external contacts on a first substrate are bonded to the contact pads on an adjacent second substrate, so that all of the dice in the package are interconnected. The fabrication process includes forming multiple substrates on a panel, mounting the dice to the substrates, stacking and bonding the panels to one another, and then separating the substrates from the stacked panels to form the packages.
Inventors
- 👤 Warren M. Farnworth
- 👤 Alan G. Wood
- 👤 Mike Brooks
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 17:52
CPC Classifications
H; H10; H10W; H10W90/00; H10W72/00; H10W72/01; H10W72/0198; H10W72/20; H10W72/29; H10W72/50; H10W72/59; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W90/701; H10W90/721; H10W90/722; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
187 words
A semiconductor package comprising: a substrate comprising a plurality of first contacts on a first side thereof, a plurality of second contacts on an opposing second side thereof having a same pattern as the first contacts, a plurality of holes through the substrate at least partially filled with a conductive material electrically connecting the first contacts and the second contacts, a first cavity on the first side, a plurality of first pads within the first cavity in electrical communication with the first contacts, a second cavity on the second side, and an opening between the first cavity and the second cavity; a semiconductor die in the second cavity comprising a plurality of second Dads aligned with the opening; a plurality of wires extending through the opening and bonded to the first pads and the second Dads; an encapsulant within the first cavity encapsulating the wires; and a second substrate having a substantially same configuration as the substrate with a second semiconductor die mounted thereon, the second substrate stacked on the substrate with the second contacts on the second substrate bonded to the first contacts on the substrate.
Claim 2
Dependent Claim
187 words
A semiconductor package comprising: a substrate comprising a plurality of first contacts on a first side thereof, a plurality of second contacts on an opposing second side thereof having a same pattern as the first contacts, a plurality of holes through the substrate at least partially filled with a conductive material electrically connecting the first contacts and the second contacts, a first cavity on the first side, a plurality of first pads within the first cavity in electrical communication with the first contacts, a second cavity on the second side, and an opening between the first cavity and the second cavity; a semiconductor die in the second cavity comprising a plurality of second Dads aligned with the opening; a plurality of wires extending through the opening and bonded to the first pads and the second Dads; an encapsulant within the first cavity encapsulating the wires; and a second substrate having a substantially same configuration as the substrate with a second semiconductor die mounted thereon, the second substrate stacked on the substrate with the second contacts on the second substrate bonded to the first contacts on the substrate.
Claim 3
Dependent Claim
22 words
The package of claim 1 wherein a death of the second cavity is approximately equal to a thickness of the semiconductor die.
Claim 4
Dependent Claim
18 words
The package of claim 1 wherein the first contacts comprise pads and the second contacts comprise metal bumps.
Claim 5
Dependent Claim
19 words
The package of claim 1 wherein the first contacts comprise pads and the second contacts comprise conductive elastomeric bumps.
Claim 6
Dependent Claim
13 words
The package of claim 1 wherein the substrate comprises a glass filled resin.
Claim 7
Dependent Claim
183 words
A semiconductor package comprising: a first substrate comprising a plurality of conductors and first contacts on a first side thereof, a plurality of second contacts on an opposing second side thereof having a same pattern as the first contacts, a plurality of holes through the substrate at least partially filled with a conductive material electrically connecting the first contacts and the second contacts, a first cavity on the first side, a second cavity on the second side, and an opening between the first cavity and the second cavity; a first semiconductor die in the second cavity comprising a plurality of bond pads aligned with the opening; a plurality of electrical paths extending through the opening in electrical communication with the conductors and the bond pads; an encapsulant within the first cavity substantially planar to the first side encapsulating the electrical paths; and a second substrate and a second semiconductor die substantially identical to the first substrate and the first semiconductor die stacked on the first substrate with the second contacts on the second substrate bonded to the first contacts on the first substrate.
Claim 8
Dependent Claim
183 words
A semiconductor package comprising: a first substrate comprising a plurality of conductors and first contacts on a first side thereof, a plurality of second contacts on an opposing second side thereof having a same pattern as the first contacts, a plurality of holes through the substrate at least partially filled with a conductive material electrically connecting the first contacts and the second contacts, a first cavity on the first side, a second cavity on the second side, and an opening between the first cavity and the second cavity; a first semiconductor die in the second cavity comprising a plurality of bond pads aligned with the opening; a plurality of electrical paths extending through the opening in electrical communication with the conductors and the bond pads; an encapsulant within the first cavity substantially planar to the first side encapsulating the electrical paths; and a second substrate and a second semiconductor die substantially identical to the first substrate and the first semiconductor die stacked on the first substrate with the second contacts on the second substrate bonded to the first contacts on the first substrate.
Claim 9
Dependent Claim
20 words
The package of claim 6 wherein the second contacts comprise solder bumps and the first contacts comprise solder wettable pads.
Claim 10
Dependent Claim
17 words
The package of claim 6 wherein the first contacts or the second contacts comprise a conductive elastomer.
Claim 11
Dependent Claim
16 words
The package of claim 6 wherein the conductive material comprises a metal or a conductive elastomer.
Claim 12
Dependent Claim
14 words
The package of claim 6 wherein the first substrate comprises a glass filled resin.
Claim 13
Dependent Claim
144 words
A semiconductor package comprising: a panel comprising a plurality of substrates configured for separation into separate packages, each substrate comprising a plurality of conductors and first contacts on a first side thereof, a plurality of second contacts on an opposing second side thereof having a same pattern as the first contacts, a plurality of holes through the substrate at least partially filled with a conductive material electrically connecting the first contacts and the second contacts, a first cavity on the first side, a second cavity on the second side, and an opening between the first cavity and the second cavity; a semiconductor die in the second cavity of each substrate; a plurality of wires extending through the opening and bonded to the conductors and to the bond Dads of each substrate; and an encapsulant within the first cavity encapsulating the wires of each substrate.
Claim 14
Dependent Claim
144 words
A semiconductor package comprising: a panel comprising a plurality of substrates configured for separation into separate packages, each substrate comprising a plurality of conductors and first contacts on a first side thereof, a plurality of second contacts on an opposing second side thereof having a same pattern as the first contacts, a plurality of holes through the substrate at least partially filled with a conductive material electrically connecting the first contacts and the second contacts, a first cavity on the first side, a second cavity on the second side, and an opening between the first cavity and the second cavity; a semiconductor die in the second cavity of each substrate; a plurality of wires extending through the opening and bonded to the conductors and to the bond Dads of each substrate; and an encapsulant within the first cavity encapsulating the wires of each substrate.
Claim 15
Dependent Claim
24 words
The package of claim 11 wherein the panel comprises a material selected from the group consisting of glass filled resin, silicon, ceramic, and plastic.
Claim 16
Dependent Claim
13 words
The package of claim 11 wherein the panel comprises a glass filled resin.
Claim 17
Dependent Claim
200 words
A semiconductor package comprising: a first substrate comprising a first side and an opposing second side: a first cavity in the first side; a second cavity in the second side; a plurality of first contacts on the first side in electrical communication with a plurality of first bond pads within the first cavity; an opening in the substrate extending from the first cavity to the second cavity; a first die in the second cavity comprising a plurality of second bond pads aligned with the opening; a plurality of wires within the first cavity extending through the opening and bonded to the first bond pads and to the second bond pads; an encapsulant within the first cavity substantially planar to the first side encapsulating the wires; a plurality of second contacts on the second side; a plurality of holes in the substrate at least partially filled with a conductive material electrically connecting the first contacts and the second contacts; and a second substrate having a substantially same configuration as the first substrate and having a second die mounted thereto, the second substrate stacked on the first substrate with the second contacts thereon bonded to the first contacts on the first substrate.
Claim 18
Dependent Claim
200 words
A semiconductor package comprising: a first substrate comprising a first side and an opposing second side: a first cavity in the first side; a second cavity in the second side; a plurality of first contacts on the first side in electrical communication with a plurality of first bond pads within the first cavity; an opening in the substrate extending from the first cavity to the second cavity; a first die in the second cavity comprising a plurality of second bond pads aligned with the opening; a plurality of wires within the first cavity extending through the opening and bonded to the first bond pads and to the second bond pads; an encapsulant within the first cavity substantially planar to the first side encapsulating the wires; a plurality of second contacts on the second side; a plurality of holes in the substrate at least partially filled with a conductive material electrically connecting the first contacts and the second contacts; and a second substrate having a substantially same configuration as the first substrate and having a second die mounted thereto, the second substrate stacked on the first substrate with the second contacts thereon bonded to the first contacts on the first substrate.
Claim 19
Dependent Claim
15 words
The package of claim 14 wherein the second contacts comprise metal or conductive elastomeric bumps.
Claim 20
Dependent Claim
25 words
The package of claim 14 wherein the encapsulant comprises a material selected from the group consisting of epoxy, silicone, room temperature vulcanizing material, and polyimide.
Claim 21
Dependent Claim
21 words
The package of claim 14 wherein the second cavity has a depth substantially equal to a thickness of the first die.
Claim 22
Dependent Claim
21 words
The package of claim 14 wherein the first substrate comprises a plurality of separate layers laminated to form a unitary structure.
Claim 23
Dependent Claim
14 words
The package of claim 14 wherein the first substrate comprises a glass filled resin.
Claim 24
Dependent Claim
177 words
A semiconductor package comprising: a substrate comprising a first side and an opposing second side; a plurality of first contacts on the first sides a first cavity on the first side; a plurality of pads within the first cavity in electrical communication with the first contacts; a die mounting cavity on the second side having a die mounted thereto; an opening in the substrate extending from the first cavity to the die mounting cavity; a plurality of electrical paths formed through the opening between the die and the pads; a plurality of second contacts on the second side having a pattern substantially matching the first contacts; a plurality of holes in the substrate at least partially filled with a conductive material electrically connecting the first contacts and the second contacts; a planarized encapsulant within the first cavity encapsulating the electrical paths; and a second substrate substantially identical to the substrate and having a second die mounted thereto, the second substrate stacked on the substrate with the second contacts thereon bonded to the first contacts on the substrate.
Claim 25
Dependent Claim
177 words
A semiconductor package comprising: a substrate comprising a first side and an opposing second side; a plurality of first contacts on the first sides a first cavity on the first side; a plurality of pads within the first cavity in electrical communication with the first contacts; a die mounting cavity on the second side having a die mounted thereto; an opening in the substrate extending from the first cavity to the die mounting cavity; a plurality of electrical paths formed through the opening between the die and the pads; a plurality of second contacts on the second side having a pattern substantially matching the first contacts; a plurality of holes in the substrate at least partially filled with a conductive material electrically connecting the first contacts and the second contacts; a planarized encapsulant within the first cavity encapsulating the electrical paths; and a second substrate substantially identical to the substrate and having a second die mounted thereto, the second substrate stacked on the substrate with the second contacts thereon bonded to the first contacts on the substrate.
Claim 26
Dependent Claim
13 words
The package of claim 20 wherein the electrical paths comprise wire bonded wires.
Claim 27
Dependent Claim
11 words
The package of claim 20 wherein the electrical paths comprise solder.
Claim 28
Dependent Claim
21 words
The package of claim 20 wherein the second cavity has a depth substantially equal to a thickness of the first die.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-01-31 | 2003-08-02 | 2004-02-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-01-31 | 2007-08-02 | 2008-02-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-01-31 | 2011-08-02 | 2012-02-01 | $7700.00 | Window Closed / Lapsed |