Technique to produce cavity-up HBGA packages

Claim 1

A high density ball-grid array package for packaging an integrated-circuit die comprising: a laminated structure consisting of a dielectric layer and a highly conductive layer disposed thereon; said dielectric layer having a plurality of first drilled holes to expose selective solderable areas on a bottom side of said conductive layer and said conductive layer being formed with a desired pattern wherein said dielectric layer is comprised of a material selected from the group consisting of a polyimide material and an epoxy material; an insulated substrate having a plurality of second drilled holes wherein said insulated substrate is comprised of an aluminum layer which is anodized so as to form an insulation layer thereon; said laminated structure being bonded to said insulated substrate so that said plurality of first drilled holes are aligned with corresponding ones of said plurality of second drilled holes in order to expose the selective solderable areas on the bottom side of the conductive layer of the high density ball-grid array package; said laminated structure having an open portion overlying a central region of said insulated substrate; an integrated-circuit die being mounted in the central region of said insulated substrate on a top side of said high density ball-grid array package; bonding wires interconnected between bonding pads formed on said integrated-circuit die and bonding fingers formed on said conductive layer of said laminated structure; a plastic material being molded over a top surface of said die, bonding fingers and bonding wires all located on the top side of said high density ball-grid array package; and solder balls being directly attached to said selective solderable areas exposed on the bottom side of the conductive layer of said high density ball-grid array package.

Claim 6

A method for fabricating a high density ball-grid array package for an integrated-circuit die, comprising the steps of: forming a laminated structure consisting of a dielectric layer and a high conductive layer disposed thereon; drilling a plurality of first holes in the dielectric layer to expose selective solderable area on a bottom side of said conductive layer, wherein said dielectric layer is comprised of a material selected from the group consisting of a polyimide material and an epoxy material; applying a desired pattern to the conductive layer; forming an insulated substrate having a plurality of second holes wherein said insulated substrate is comprised of an aluminum metallic layer which is anodized so as to form an insulation layer thereon; bonding the laminated structure to the insulated substrate so that the plurality of first holes are aligned with corresponding ones of the plurality of second holes in order to expose the selective solderable areas on the bottom side of said conductive layer of the high density ball-grid array package, the laminated structure having an open portion overlying a central region of the insulated substrate; mounting an integrated-circuit die in the central region of the insulated substrate on a top side of said high density ball-grid array package; interconnecting bonding wires between bonding pads formed on the integrated-circuit die and bonding fingers formed on the conductive layer of the laminated structure; molding a plastic material on the top side of said high density ball-grid array package and over a top surface of the die, bonding fingers and bonding wires; and attaching solder balls directly to the selective solderable areas exposed on the bottom side of the conductive layer.

Claim 7

A method for fabricating a high density ball-grid array package for an integrated-circuit die, comprising the steps of: forming a laminated structure consisting of a dielectric layer and a high conductive layer disposed thereon; drilling a plurality of first holes in the dielectric layer to expose selective solderable area on a bottom side of said conductive layer, wherein said dielectric layer is comprised of a material selected from the group consisting of a polyimide material and an epoxy material; applying a desired pattern to the conductive layer; forming an insulated substrate having a plurality of second holes wherein said insulated substrate is comprised of an aluminum metallic layer which is anodized so as to form an insulation layer thereon; bonding the laminated structure to the insulated substrate so that the plurality of first holes are aligned with corresponding ones of the plurality of second holes in order to expose the selective solderable areas on the bottom side of said conductive layer of the high density ball-grid array package, the laminated structure having an open portion overlying a central region of the insulated substrate; mounting an integrated-circuit die in the central region of the insulated substrate on a top side of said high density ball-grid array package; interconnecting bonding wires between bonding pads formed on the integrated-circuit die and bonding fingers formed on the conductive layer of the laminated structure; molding a plastic material on the top side of said high density ball-grid array package and over a top surface of the die, bonding fingers and bonding wires; and attaching solder balls directly to the selective solderable areas exposed on the bottom side of the conductive layer.