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US5672913A
Expired / Lapsed
US
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Semiconductor device having a layer of gallium amalgam on bump leads
Assignee: Nokia of America Corp
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Filing: 1996-06-13
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Granted: 1997-09-30
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Expires: 2016-06-13
Abstract
Abstract A semiconductor chip (10) has a plurality of metallized members (12) that are each advantageously bumped with a volume of gallium amalgam (18) to render the members wettable by a conventional solder.
Inventors
- 👤 Daniel Flanagan Baldwin
- 👤 Rajan D. Deshmukh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 19:23
CPC Classifications
H; H10; H10W; H10W72/00; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/01; H10W72/012; H10W72/01221; H10W72/01223; H10W72/071; H10W72/0711; H10W72/072; H10W72/07231; H10W72/07236; H10W72/20; H10W72/251; H10W72/252; H10W72/851; H10W72/853; H10W72/856
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
95 words
An apparatus comprising, in combination, an electronic device comprised of a planar surface having a plurality of non-solder wettable metallized members arrayed on said surface, and a circuit board having a plurality of solder-coated metallized areas arrayed the same as the metallized members on said electronic device for bonding thereto, the improvement wherein said electronic device comprises at least one layer of gallium amalgam on said metallized members and having a pattern corresponding to the array of metallized members to render said members wettable by the solder of the metallized areas on the circuit board.
Claim 2
Independent Claim
95 words
An apparatus comprising, in combination, an electronic device comprised of a planar surface having a plurality of non-solder wettable metallized members arrayed on said surface, and a circuit board having a plurality of solder-coated metallized areas arrayed the same as the metallized members on said electronic device for bonding thereto, the improvement wherein said electronic device comprises at least one layer of gallium amalgam on said metallized members and having a pattern corresponding to the array of metallized members to render said members wettable by the solder of the metallized areas on the circuit board.
Claim 3
Dependent Claim
25 words
The apparatus according to claim 1 wherein the metallized members have an aluminum metallization and wherein the gallium amalgam contains aluminum as well as gallium.
Claim 4
Dependent Claim
26 words
A device according to claim 1, wherein said at least one patterned layer of gallium amalgam comprises a surface barrier layer contiguous with said metallized members.
Claim 5
Dependent Claim
29 words
The apparatus according to claim 3, wherein the surface barrier layer comprises layers of chrome, chrome-copper, copper and gold, and wherein the gallium amalgam comprises gallium, copper and nickel.
Claim 6
Dependent Claim
14 words
The apparatus according to claim 1, wherein the gallium amalgam comprises a barrier compound.
Claim 7
Dependent Claim
15 words
The apparatus according to claim 5, wherein said barrier compound comprises titanium, platinum, or chromium.
Claim 8
Dependent Claim
14 words
The apparatus according to claim 2 wherein the gallium amalgam contains approximately 11% aluminum.
Claim 9
Dependent Claim
52 words
An electronic device comprising, a planar surface having a plurality of non-solder wettable metallized members arrayed on said surface; and at least one layer of gallium amalgam on said metallized members and having a pattern corresponding to the array of metallized members of said electronic device to render said members solder wettable.
Claim 10
Dependent Claim
52 words
An electronic device comprising, a planar surface having a plurality of non-solder wettable metallized members arrayed on said surface; and at least one layer of gallium amalgam on said metallized members and having a pattern corresponding to the array of metallized members of said electronic device to render said members solder wettable.
Claim 11
Dependent Claim
26 words
A device according to claim 8, wherein said at least one patterned layer of gallium amalgam comprises a surface barrier layer contiguous with said metallized members.
Claim 12
Dependent Claim
14 words
The apparatus according to claim 8, wherein the gallium amalgam comprises a barrier compound.
Claim 13
Dependent Claim
18 words
The apparatus according to claim 3, wherein the surface barrier layer comprises layers of titanium, platinum and gold.
Claim 14
Dependent Claim
22 words
The apparatus according to claim 4 wherein the gallium amalgam comprises at least 65% by weight gallium, 21.4% copper and 3.6% nickel.
Claim 15
Dependent Claim
15 words
The apparatus according to claim 10, wherein said barrier compound comprises titanium, platinum, or chromium.
Claim 16
Dependent Claim
12 words
An apparatus according to claim 6, wherein said barrier compound is titanium.
Claim 17
Dependent Claim
14 words
An apparatus according to claim 13, wherein the barrier compound or element is titanium.
Claim 18
Independent Claim
103 words
An apparatus comprising, in combination, an electronic device comprised of a planar surface having a plurality of non-solder wettable metallized members arrayed on said surface and a circuit board having a plurality of solder-coated metallized areas arrayed the same as the metallized members on said electronic device for bonding thereto, wherein said electronic device comprises at least one layer of gallium amalgam on said metallized members and having a pattern corresponding to the array of metallized members to render said members wettable by the solder of the metallized areas on said circuit board, and wherein the gallium amalgam contains a titanium barrier compound.
Claim 19
Independent Claim
103 words
An apparatus comprising, in combination, an electronic device comprised of a planar surface having a plurality of non-solder wettable metallized members arrayed on said surface and a circuit board having a plurality of solder-coated metallized areas arrayed the same as the metallized members on said electronic device for bonding thereto, wherein said electronic device comprises at least one layer of gallium amalgam on said metallized members and having a pattern corresponding to the array of metallized members to render said members wettable by the solder of the metallized areas on said circuit board, and wherein the gallium amalgam contains a titanium barrier compound.
Claim 20
Dependent Claim
25 words
An apparatus according to claim 16, wherein the at least one layer of gallium amalgam comprises a surface barrier layer contiguous with the metallized members.
Claim 21
Dependent Claim
14 words
An apparatus according to claim 1, wherein the electronic device is a semiconductor chip.
Claim 22
Dependent Claim
15 words
An electronic device according to claim 9, wherein the electronic device is a semiconductor chip.
Claim 23
Dependent Claim
14 words
An apparatus according to claim 16, wherein the electronic device is a semiconductor chip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-09-29 | 2001-03-31 | 2001-09-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-09-29 | 2005-03-31 | 2005-09-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-09-29 | 2009-03-31 | 2009-09-30 | $7700.00 | Window Closed / Lapsed |