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US4396900A Expired / Lapsed US ⏱️ 0.0 years remaining

Thin film microstrip circuits

Assignee: NAVY United States, AS REPRESENTED BY
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Filing: 1982-03-08
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Granted: 1983-08-02
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Expires: 2002-03-08
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Abstract

Abstract A four layer thin film metallization system is comprised of layers of tantalum, chromium, copper and gold and is useful in high resolution, low loss microstrip circuits. The metallization system is compatible with lead-tin solder and, in addition, provides low insertion losses at X-band frequencies.

Inventors

  • 👤 Ronald D. Hall

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 22:04
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/38; H05K3/388; H10; H10D; H10D86/00; H10D86/80; H10D86/85; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49082; Y10T29/49099; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 83 words
A thin film microstrip circuit having low insertion loss at X-band frequency and being highly solderable with lead-tin solder comprising, a non-metallic substrate, a layer of tantalum fused onto said substrate, a layer of chromium having a thickness of about 200 Angstroms fused onto said layer of tantalum, a layer of copper having a thickness of about 50,000 Angstroms fused onto said layer of chromium, and a layer of gold having a thickness of about 7,000 Angstroms fused onto said layer of copper.
Claim 2
Dependent Claim 83 words
A thin film microstrip circuit having low insertion loss at X-band frequency and being highly solderable with lead-tin solder comprising, a non-metallic substrate, a layer of tantalum fused onto said substrate, a layer of chromium having a thickness of about 200 Angstroms fused onto said layer of tantalum, a layer of copper having a thickness of about 50,000 Angstroms fused onto said layer of chromium, and a layer of gold having a thickness of about 7,000 Angstroms fused onto said layer of copper.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-08-01 1987-01-31 1987-08-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-08-01 1991-01-31 1991-08-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-08-01 1995-01-31 1995-08-02 $7700.00 Window Closed / Lapsed

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