US5666272A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Detachable module/ball grid array package
Assignee: STMicroelectronics lnc USA
•
Filing: 1996-06-03
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Granted: 1997-09-09
•
Expires: 2016-06-03
Abstract
Abstract A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component, such as a data acquisition device, a wireless communications device, an output device or driving devices for a clock circuit. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device.
Inventors
- 👤 Dale Thomas Moore
- 👤 Frank Sigmund
- 👤 Fred Chevreton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 16:34
CPC Classifications
B; B81; B81B; B81B7/00; B81B7/0032; B81B7/007; H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/55; H01R12/57; H01R13/00; H01R13/02; H01R13/04; H01R13/05; H01R13/052; H10; H10W; H10W40/00; H10W42/00; H10W90/00; H10W90/701; H01R13/15; H01R13/187; H10W74/00
Claims Analysis
Total Claims: 41
Claim 1
Independent Claim
112 words
An integrated circuit package comprising: an upper module comprising: a housing; a data acquisition component disposed within said housing for acquiring environmental data; and upper module connection circuitry for providing electrical connections to said data acquisition component; and a lower module comprising: a substrate; an array of connectors on a surface of said substrate, to provide physical and electrical connections between said lower module and a circuit board when soldered to said circuit board; a processing circuit coupled to said substrate; and lower module connection circuitry electrically coupled to said processing circuit for providing detachable connections with said upper module connection circuitry, such that said processing circuitry can process the environmental data.
Claim 2
Dependent Claim
112 words
An integrated circuit package comprising: an upper module comprising: a housing; a data acquisition component disposed within said housing for acquiring environmental data; and upper module connection circuitry for providing electrical connections to said data acquisition component; and a lower module comprising: a substrate; an array of connectors on a surface of said substrate, to provide physical and electrical connections between said lower module and a circuit board when soldered to said circuit board; a processing circuit coupled to said substrate; and lower module connection circuitry electrically coupled to said processing circuit for providing detachable connections with said upper module connection circuitry, such that said processing circuitry can process the environmental data.
Claim 3
Dependent Claim
17 words
The integrated circuit package of claim 1 wherein said data acquisition component comprises an temperature sensitive device.
Claim 4
Dependent Claim
15 words
The integrated circuit package of claim 2 wherein the temperature sensitive device comprises a thermistor.
Claim 5
Dependent Claim
15 words
The integrated circuit package of claim 2 wherein the temperature sensitive device comprises a thermo-coupler.
Claim 6
Dependent Claim
17 words
The integrated circuit package of claim 1 wherein the data acquisition component comprises a humidity sensitive device.
Claim 7
Dependent Claim
22 words
The integrated circuit package of claim 5 wherein the processing circuitry comprises control circuitry for generating control signals responsive to ambient humidity.
Claim 8
Dependent Claim
16 words
The integrated circuit package of claim 1 wherein the processing circuitry comprises a pressure sensitive device.
Claim 9
Dependent Claim
23 words
The integrated circuit package of claim 7 wherein the processing circuitry comprises control circuitry for generating control signals responsive to ambient air pressure.
Claim 10
Dependent Claim
23 words
The integrated circuit package of claim 7 wherein the processing circuitry comprises control circuitry for generating control signals responsive to a magnetic field.
Claim 11
Dependent Claim
17 words
The integrated circuit package of claim 1 wherein the processing circuitry comprises a magnetic field sensitive device.
Claim 12
Dependent Claim
16 words
The integrated circuit package of claim 1, wherein said array of connectors is a ball-grid array.
Claim 13
Dependent Claim
98 words
An integrated circuit package comprising: an upper module comprising: a housing; a wireless communications device disposed within said housing; and upper module connection circuitry for providing electrical connections to said wireless communications device; and a lower module comprising: a substrate; an array of connectors on a surface of said substrate, to provide physical and electrical connections between said lower module and a circuit board when soldered to said circuit board; a processing circuit coupled to said substrate; and lower module connection circuitry electrically coupled to said processing circuit for providing detachable connections with said upper module connection circuitry.
Claim 14
Dependent Claim
98 words
An integrated circuit package comprising: an upper module comprising: a housing; a wireless communications device disposed within said housing; and upper module connection circuitry for providing electrical connections to said wireless communications device; and a lower module comprising: a substrate; an array of connectors on a surface of said substrate, to provide physical and electrical connections between said lower module and a circuit board when soldered to said circuit board; a processing circuit coupled to said substrate; and lower module connection circuitry electrically coupled to said processing circuit for providing detachable connections with said upper module connection circuitry.
Claim 15
Dependent Claim
15 words
The integrated circuit package of claim 12 wherein said wireless communications device comprises an antenna.
Claim 16
Dependent Claim
21 words
The integrated circuit package of claim 13 wherein said processing circuit comprises analog circuitry for processing signals received by said antenna.
Claim 17
Dependent Claim
22 words
The integrated circuit package of claim 14 wherein said processing circuit further comprises digital circuitry for processing signals from said analog circuits.
Claim 18
Dependent Claim
15 words
The integrated circuit package of claim 15 wherein said digital circuitry comprises geostationary positioning circuitry.
Claim 19
Dependent Claim
23 words
The integrated circuit package of claim 13 wherein said processing circuit comprises analog circuitry for processing signals to be transmitted by said antenna.
Claim 20
Dependent Claim
25 words
The integrated circuit package of claim 17 wherein said processing circuit further comprises digital circuitry for processing signals to be sent to said analog circuitry.
Claim 21
Dependent Claim
16 words
The integrated circuit package of claim 12, wherein said array of connectors is a ball-grid array.
Claim 22
Dependent Claim
117 words
An integrated circuit package comprising: an upper module comprising: a housing; an output device disposed within said housing, said output device comprising a user interface device; and upper module connection circuitry for providing electrical connections to said output device; and a lower module comprising; a substrate; an array of connectors on a surface of said substrate, to provide physical and electrical connections between said lower module and a circuit board when soldered to said circuit board; a processing circuit coupled to said substrate; and a lower module connection circuitry electrically coupled to said processing circuit for providing detachable connections with said upper module connection circuitry, said connections allowing said processing circuit to communicate through said output device.
Claim 23
Dependent Claim
117 words
An integrated circuit package comprising: an upper module comprising: a housing; an output device disposed within said housing, said output device comprising a user interface device; and upper module connection circuitry for providing electrical connections to said output device; and a lower module comprising; a substrate; an array of connectors on a surface of said substrate, to provide physical and electrical connections between said lower module and a circuit board when soldered to said circuit board; a processing circuit coupled to said substrate; and a lower module connection circuitry electrically coupled to said processing circuit for providing detachable connections with said upper module connection circuitry, said connections allowing said processing circuit to communicate through said output device.
Claim 24
Dependent Claim
14 words
The integrated circuit package of claim 20 wherein said output device comprises a speaker.
Claim 25
Dependent Claim
14 words
The integrated circuit package of claim 20 wherein said output device comprises a display.
Claim 26
Dependent Claim
19 words
The integrated circuit package of claim 20 wherein said output device comprises a device for providing a tactile signal.
Claim 27
Dependent Claim
19 words
The integrated circuit package of claim 23 wherein said device for providing a tactile signal comprises a vibrating device.
Claim 28
Dependent Claim
14 words
The integrated circuit package of claim 20 wherein said output device comprises a buzzer.
Claim 29
Dependent Claim
17 words
The integrated circuit package of claim 20 wherein the processing circuit comprises a digital signal processing device.
Claim 30
Dependent Claim
16 words
The integrated circuit package of claim 20, wherein said array of connectors is a ball-grid array.
Claim 31
Dependent Claim
122 words
An integrated circuit package comprising: an upper module comprising: a housing; a battery disposed within said housing; a first crystal for providing clock signals to a real time clock; a second crystal for providing clock signals for a system clock; and upper module connection circuitry for providing electrical connections to said battery and first and second crystal; and a lower module comprising: a substrate; an array of connectors on a surface of said substrate, to provide physical and electrical connections between said lower module and a circuit board when soldered to said circuit board; a processing circuit coupled to said substrate; and lower module connection circuitry electrically coupled to said processing circuit for providing detachable connections with said upper module connection circuitry.
Claim 32
Dependent Claim
122 words
An integrated circuit package comprising: an upper module comprising: a housing; a battery disposed within said housing; a first crystal for providing clock signals to a real time clock; a second crystal for providing clock signals for a system clock; and upper module connection circuitry for providing electrical connections to said battery and first and second crystal; and a lower module comprising: a substrate; an array of connectors on a surface of said substrate, to provide physical and electrical connections between said lower module and a circuit board when soldered to said circuit board; a processing circuit coupled to said substrate; and lower module connection circuitry electrically coupled to said processing circuit for providing detachable connections with said upper module connection circuitry.
Claim 33
Dependent Claim
32 words
The integrated circuit package of claim 28 wherein said processing circuit comprises real time clock circuitry for providing a time and date outputs and clock circuitry for providing a system clock signal.
Claim 34
Dependent Claim
16 words
The integrated circuit package of claim 28, wherein said array of connectors is a ball-grid array.
Claim 35
Dependent Claim
119 words
An integrated circuit package, comprising: an upper module and a lower module; wherein said lower module comprises: a substrate; a ball grid array, attached to a surface of said substrate, which, when reflowed, will provide connection to conductors on a printed circuit board; an integrated circuit coupled to said substrate; lower module connection circuitry electrically coupled to said processing circuit for providing detachable connections with said upper module; and wherein said upper module comprises: a housing; a component, disposed within said housing, which can be damaged by the temperatures to which said lower module is subjected when said ball grid array is reflowed; and upper module connection circuitry for providing electrical connections between said component and said lower module.
Claim 36
Dependent Claim
119 words
An integrated circuit package, comprising: an upper module and a lower module; wherein said lower module comprises: a substrate; a ball grid array, attached to a surface of said substrate, which, when reflowed, will provide connection to conductors on a printed circuit board; an integrated circuit coupled to said substrate; lower module connection circuitry electrically coupled to said processing circuit for providing detachable connections with said upper module; and wherein said upper module comprises: a housing; a component, disposed within said housing, which can be damaged by the temperatures to which said lower module is subjected when said ball grid array is reflowed; and upper module connection circuitry for providing electrical connections between said component and said lower module.
Claim 37
Dependent Claim
14 words
The integrated circuit package of claim 31, wherein said component comprises a temperature-sensitive device.
Claim 38
Dependent Claim
14 words
The integrated circuit package of claim 31, wherein said component comprises a humidity-sensitive device.
Claim 39
Dependent Claim
14 words
The integrated circuit package of claim 31, wherein said component comprises geostationary positioning circuitry.
Claim 40
Dependent Claim
13 words
The integrated circuit package of claim 31, wherein said component comprises a display.
Claim 41
Dependent Claim
13 words
The integrated circuit package of claim 31, wherein said component comprises a battery.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-09-08 | 2001-03-10 | 2001-09-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-09-08 | 2005-03-10 | 2005-09-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-09-08 | 2009-03-10 | 2009-09-09 | $7700.00 | Window Closed / Lapsed |