Semiconductor device

Abstract

Abstract PURPOSE:To eliminate the necessity of arranging peripheral components on a printed circuit board and facilitate a high density mounting of an electric machine by a method wherein the peripheral components are attached and connected to the surface of an insulating substrate in which a semiconductor element is incorporated. CONSTITUTION:A recessed part 11 is formed at the center of an insulating substrate 10 and a semiconductor element 12 is attached to the recessed part 11 by die-bonding. A plurality of connection terminals 13 are lead out radially from the inside of the recessed part 11 to the sides and further to the bottom of the substrate 10 through the surface of the substrate 10. One end of the terminal 13 is connected to an electrode of the element 12 by wire bonding with a fine gold wire. On the surface of an auxiliary substrate 20, connection terminals 21 are lead out. Peripheral components 22 are attached to the surface of the substrate 20. The substrate 20 is mounted on the substrate 10. With this constitution, a high density mounting of an electric machine can be realized.

Inventors

• 👤 Fumio Takeyama
• 👤 竹山　文雄

Bibliographic Details