Integrated circuit chip including superimposed upper and lower printed circuit boards

Claim 1

An integrated circuit chip comprising: a printed circuit board unit having a top surface, a plurality of conductive strips provided on said top surface, and a die-receiving cavity formed thereon, said cavity being accessible via said top surface; a die having an upper surface and a plurality of solder pads formed on said upper surface, said die being received in said die-receiving cavity of said printed circuit board unit such that said solder pads are exposed at said top surface of said printed circuit board unit; and a plurality of conductive wires interconnecting said solder pads of said die and said conductive strips of said printed circuit board unit wherein said printed circuit board unit includes superimposed upper and lower printed circuit boards, said upper printed circuit board having a top surface which serves as said top surface of said printed circuit board unit, and a bottom surface, said lower printed circuit board having a hole formed therethrough and being mounted to said upper printed circuit board, said lower printed circuit board further having an inner peripheral wall which confines said hole and a bottom surface, said bottom surface of said upper printed circuit board and said inner peripheral wall of said lower printed circuit board cooperatively defining said die-receiving cavity, said die having a lower surface which is substantially flush with said bottom surface of said lower printed circuit board, said upper printed circuit board further having a bore formed therethrough to access said cavity and expose said pads on said upper surface of said die, said conductive wires having first ends connected electrically to said strips and second ends which extend into said cavity via said bore and which are connected electrically to said pads of said die.