US6072233A
Expired / Lapsed
US
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Stackable ball grid array package
Assignee: Round Rock Research LLC
•
Filing: 1998-05-04
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Granted: 2000-06-06
•
Expires: 2018-05-04
Abstract
Abstract A stackable fine ball grid array (FBGA) package is disclosed that allows the stacking of one array upon another. This stackable FBGA package is configured such that conductive elements are placed along the outside perimeter of an integrated circuit (IC) device mounted to the FBGA. The conductive elements also are of sufficient size so that they extend beyond the bottom or top surface of the IC device, including the wiring interconnect and encapsulate material, as the conductive elements make contact with the FBGA positioned below or above to form a stack. The IC device, such as a memory chip, is mounted upon a first surface of a printed circuit board substrate forming part of the FBGA. Lead wires are used to attach the IC device to the printed board substrate and encapsulant is used to contain the IC devices and wires within and below the matrix and profile of the conductive elements. Additionally, certain pins on the FBGA in the stack require an isolated connection to the PC board. Yet, this isolated connection should be able to be connected to an adjacent ball on a different FBGA stack above or below that particular isolated connection. This provides for a stair step connection from the bottom of the FBGA stacked array to the top. This allows IC devices to be stacked one upon the other while maintaining a unique pin out for each pin required in the stack.
Inventors
- 👤 David J. Corisis
- 👤 Jerry M. Brooks
- 👤 Walter L. Moden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 14:00
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W90/00; H10W70/00; H10W70/60; H10W72/00; H10W72/01; H10W72/071; H10W72/072; H10W72/07251; H10W72/075; H10W72/20; H10W72/29; H10W72/50; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W90/20; H10W90/22; H10W90/291; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 61
Claim 1
Independent Claim
169 words
A ball grid array package, comprising: a substrate having a first surface, a second surface, and a plurality of conductive element pads on said second surface; a semiconductor device having at least one bond pad thereon, said semiconductor device mounted on said first surface of said substrate; at least one wire bond connected to at least one of said plurality of conductive element pads on said second surface of said substrate and said at least one bond pad of said semiconductor device; a material placed on said at least one wire bond, said at least one conductive element pad of said substrate, and said at least one bond pad of said semiconductor device, said material forming a first profile height; and at least one conductive element located on said second surface of said substrate coupled to at least one conductive element pad of said plurality of conductive element pads of said substrate, said at least one conductive element having a second profile height greater than said first profile height.
Claim 2
Dependent Claim
169 words
A ball grid array package, comprising: a substrate having a first surface, a second surface, and a plurality of conductive element pads on said second surface; a semiconductor device having at least one bond pad thereon, said semiconductor device mounted on said first surface of said substrate; at least one wire bond connected to at least one of said plurality of conductive element pads on said second surface of said substrate and said at least one bond pad of said semiconductor device; a material placed on said at least one wire bond, said at least one conductive element pad of said substrate, and said at least one bond pad of said semiconductor device, said material forming a first profile height; and at least one conductive element located on said second surface of said substrate coupled to at least one conductive element pad of said plurality of conductive element pads of said substrate, said at least one conductive element having a second profile height greater than said first profile height.
Claim 3
Dependent Claim
16 words
The ball grid array package according to claim 1, wherein said substrate includes an aperture therein.
Claim 4
Dependent Claim
23 words
The ball grid array package according to claim 2, wherein said at least one wire bond extends through said aperture in said substrate.
Claim 5
Dependent Claim
21 words
The ball grid array package according to claim 3, wherein said material fills a portion of said aperture in said substrate.
Claim 6
Dependent Claim
28 words
The ball grid array package according to claim 1, wherein said at least one conductive element is located along a perimeter of said second surface of said substrate.
Claim 7
Dependent Claim
23 words
The ball grid array package according to claim 1, wherein said substrate includes a plurality of terminal pads on said first surface thereof.
Claim 8
Dependent Claim
191 words
A stackable ball grid array package, comprising: a substrate having a first surface, a second surface, and a plurality of conductive element pads on said second surface; a semiconductor device having a plurality of bond pads on a first surface thereof, said semiconductor device mounted on said first surface of said substrate; at least one wire bond connected to at least one of said plurality of conductive element pads on said second surface of said substrate and at least one bond pad of said plurality of bond pads of said semiconductor device; an encapsulant material placed on said at least one wire bond, said at least one conductive element pad of said substrate, and said at least one bond pad of said semiconductor device, said encapsulant material forming a first profile height; and a plurality of conductive elements located on said second surface of said substrate, at least one conductive element of said plurality of conductive elements coupled to at least one conductive element pad of said plurality of conductive element pads of said substrate, said plurality of conductive elements having a second profile height greater than said first profile height.
Claim 9
Dependent Claim
191 words
A stackable ball grid array package, comprising: a substrate having a first surface, a second surface, and a plurality of conductive element pads on said second surface; a semiconductor device having a plurality of bond pads on a first surface thereof, said semiconductor device mounted on said first surface of said substrate; at least one wire bond connected to at least one of said plurality of conductive element pads on said second surface of said substrate and at least one bond pad of said plurality of bond pads of said semiconductor device; an encapsulant material placed on said at least one wire bond, said at least one conductive element pad of said substrate, and said at least one bond pad of said semiconductor device, said encapsulant material forming a first profile height; and a plurality of conductive elements located on said second surface of said substrate, at least one conductive element of said plurality of conductive elements coupled to at least one conductive element pad of said plurality of conductive element pads of said substrate, said plurality of conductive elements having a second profile height greater than said first profile height.
Claim 10
Dependent Claim
17 words
The stackable ball grid array package according to claim 7, wherein said substrate includes an aperture therein.
Claim 11
Dependent Claim
24 words
The stackable ball grid array package according to claim 8, wherein said at least one wire bond extends through said aperture in said substrate.
Claim 12
Dependent Claim
23 words
The stackable ball grid array package according to claim 9, wherein said encapsulant material fills a portion of said aperture in said substrate.
Claim 13
Dependent Claim
28 words
The stackable ball grid array package according to claim 7, wherein said plurality of conductive elements is located along a perimeter of said second surface of said substrate.
Claim 14
Dependent Claim
24 words
The stackable ball grid array package according to claim 7, wherein said substrate includes a plurality of terminal pads on said first surface thereof.
Claim 15
Dependent Claim
43 words
The stackable ball grid array package according to claim 7, wherein said plurality of conductive elements includes a plurality of solder balls, a first portion of said plurality of solder balls aligning in a parallel row having a substantially uniform first pitch space.
Claim 16
Dependent Claim
33 words
The stackable ball grid array package according to claim 13, wherein a second portion of said plurality of solder balls aligns in a second parallel row having a substantially uniform second pitch space.
Claim 17
Dependent Claim
43 words
The stackable ball grid array package according to claim 14, wherein said first pitch space of said first portion of said plurality of solder balls and said second pitch space of said second portion of said plurality of solder balls are substantially equal.
Claim 18
Dependent Claim
44 words
The stackable ball grid array package according to claim 12, wherein at least one predetermined terminal pad of said plurality of terminal pads of said substrate is connected to at least one predetermined bond pad of said plurality of bond pads through said substrate.
Claim 19
Dependent Claim
29 words
The stackable ball grid array package according to claim 7, wherein at least one of said plurality of conductive elements is isolated from connection to a conductive element pad.
Claim 20
Dependent Claim
28 words
The stackable ball grid array package according to claim 7, wherein a portion of said plurality of conductive elements is isolated from connection to a conductive element pad.
Claim 21
Dependent Claim
36 words
The stackable ball grid array package according to claim 7, wherein a portion of said plurality of conductive elements on each of two edges of said substrate is isolated from connection to a conductive element pad.
Claim 22
Dependent Claim
195 words
A stackable ball grid array package, comprising: a printed circuit board substrate having a first surface, a second surface, and a plurality of conductive element pads on said second surface; a semiconductor device, mounted on said first surface of said printed circuit board substrate and having a plurality of bond pads on a first surface thereof; at least one wire bond, connected to at least one of said plurality of conductive element pads on said second surface of said printed circuit board substrate and at least one bond pad of said plurality of bond pads of said semiconductor device; an encapsulant material placed on said at least one wire bond, said at least one conductive element pad of said printed circuit board substrate, and said at least one bond pad of said semiconductor device, said encapsulant forming a first profile height; and a plurality of conductive elements located on said second surface of said printed circuit board substrate coupled to at least one conductive element pad of said plurality of conductive element pads of said printed circuit board substrate, said plurality of conductive elements having a second profile height greater than said first profile height.
Claim 23
Dependent Claim
195 words
A stackable ball grid array package, comprising: a printed circuit board substrate having a first surface, a second surface, and a plurality of conductive element pads on said second surface; a semiconductor device, mounted on said first surface of said printed circuit board substrate and having a plurality of bond pads on a first surface thereof; at least one wire bond, connected to at least one of said plurality of conductive element pads on said second surface of said printed circuit board substrate and at least one bond pad of said plurality of bond pads of said semiconductor device; an encapsulant material placed on said at least one wire bond, said at least one conductive element pad of said printed circuit board substrate, and said at least one bond pad of said semiconductor device, said encapsulant forming a first profile height; and a plurality of conductive elements located on said second surface of said printed circuit board substrate coupled to at least one conductive element pad of said plurality of conductive element pads of said printed circuit board substrate, said plurality of conductive elements having a second profile height greater than said first profile height.
Claim 24
Dependent Claim
20 words
The stackable ball grid array package according to claim 20, wherein said printed circuit board substrate includes an aperture therein.
Claim 25
Dependent Claim
27 words
The stackable ball grid array package according to claim 21, wherein said at least one wire bond extends through said aperture in said printed circuit board substrate.
Claim 26
Dependent Claim
26 words
The stackable ball grid array package according to claim 22, wherein said encapsulant material fills a portion of said aperture in said printed circuit board substrate.
Claim 27
Dependent Claim
31 words
The stackable ball grid array package according to claim 20, wherein said plurality of conductive elements is located along a perimeter of said second surface of said printed circuit board substrate.
Claim 28
Dependent Claim
27 words
The stackable ball grid array package according to claim 20, wherein said printed circuit board substrate includes a plurality of terminal pads on said first surface thereof.
Claim 29
Dependent Claim
43 words
The stackable ball grid array package according to claim 20, wherein said plurality of conductive elements includes a plurality of solder balls, a first portion of said plurality of solder balls aligning in a parallel row having a substantially uniform first pitch space.
Claim 30
Dependent Claim
31 words
The stackable ball grid array package according to claim 26, wherein a second portion of said plurality of solder balls aligns in a second parallel row having a second pitch space.
Claim 31
Dependent Claim
43 words
The stackable ball grid array package according to claim 27, wherein said first pitch space of said first portion of said plurality of solder balls and said second pitch space of said second portion of said plurality of solder balls are substantially equal.
Claim 32
Dependent Claim
50 words
The stackable ball grid array package according to claim 25, wherein at least one predetermined terminal pad of said plurality of terminal pads of said printed circuit board substrate is connected to at least one predetermined bond pad of said plurality of bond pads through said printed circuit board substrate.
Claim 33
Dependent Claim
29 words
The stackable ball grid array package according to claim 20, wherein at least one of said plurality of conductive elements is isolated from connection to a conductive pad element.
Claim 34
Dependent Claim
28 words
The stackable ball grid array package according to claim 20, wherein a portion of said plurality of conductive elements is isolated from connection to a conductive element pad.
Claim 35
Dependent Claim
39 words
The stackable ball grid array package according to claim 20, wherein a portion of said plurality of conductive elements on each of two edges of said printed circuit board substrate is isolated from connection to a conductive element pad.
Claim 36
Dependent Claim
193 words
A stackable ball grid array package, comprising: a printed circuit board substrate having a first surface, a second surface, an aperture therein, and a plurality of conductive element pads on said second surface; a semiconductor device, mounted within a first perimeter of said first surface of said printed circuit board substrate, said semiconductor device having a plurality of bond pads on a first surface thereof; a plurality of wire bonds, connected to at least some of said plurality of conductive element pads and some of said plurality of bond pads on said second surface of said printed circuit board substrate while extending through said aperture in said printed circuit board substrate; an encapsulant placed along a portion of said aperture, said plurality of bond pads, and said plurality of wire bonds, said encapsulant forming a first profile height; and a plurality of conductive elements, mounted along a second perimeter of said second surface, said second perimeter being greater than said first perimeter, and coupled to some of said plurality of conductive element pads on said second surface, said plurality of conductive elements having a second profile height greater than said first profile height.
Claim 37
Dependent Claim
193 words
A stackable ball grid array package, comprising: a printed circuit board substrate having a first surface, a second surface, an aperture therein, and a plurality of conductive element pads on said second surface; a semiconductor device, mounted within a first perimeter of said first surface of said printed circuit board substrate, said semiconductor device having a plurality of bond pads on a first surface thereof; a plurality of wire bonds, connected to at least some of said plurality of conductive element pads and some of said plurality of bond pads on said second surface of said printed circuit board substrate while extending through said aperture in said printed circuit board substrate; an encapsulant placed along a portion of said aperture, said plurality of bond pads, and said plurality of wire bonds, said encapsulant forming a first profile height; and a plurality of conductive elements, mounted along a second perimeter of said second surface, said second perimeter being greater than said first perimeter, and coupled to some of said plurality of conductive element pads on said second surface, said plurality of conductive elements having a second profile height greater than said first profile height.
Claim 38
Dependent Claim
27 words
The stackable ball grid array package according to claim 33, wherein said first surface of said printed circuit board substrate further includes a plurality of terminal pads.
Claim 39
Dependent Claim
31 words
The stackable ball grid array package according to claim 33, wherein a first portion of said plurality of conductive elements aligns in a substantially parallel row having a first pitch spacing.
Claim 40
Dependent Claim
31 words
The stackable ball grid array package according to claim 35, wherein a second portion of said plurality of conductive elements aligns in a second parallel row having a second pitch spacing.
Claim 41
Dependent Claim
38 words
The stackable ball grid array package according to claim 34, wherein a predetermined number of said plurality of terminal pads are connected to a predetermined number of said plurality of bond pads through said printed circuit board substrate.
Claim 42
Dependent Claim
96 words
A stackable ball grid array package, comprising: a printed circuit board substrate having a first surface, a second surface, and a plurality of conductive element pads on said first surface, and a plurality of terminal pads on said second surface; a plurality of conductive elements, mounted along a first perimeter of said first surface, and coupled to at least one conductive element pad of said plurality of conductive element pads on said first surface and at least one terminal pad of said plurality of terminal pads, said plurality of conductive elements having a first profile height.
Claim 43
Dependent Claim
96 words
A stackable ball grid array package, comprising: a printed circuit board substrate having a first surface, a second surface, and a plurality of conductive element pads on said first surface, and a plurality of terminal pads on said second surface; a plurality of conductive elements, mounted along a first perimeter of said first surface, and coupled to at least one conductive element pad of said plurality of conductive element pads on said first surface and at least one terminal pad of said plurality of terminal pads, said plurality of conductive elements having a first profile height.
Claim 44
Dependent Claim
69 words
The stackable ball grid array package according to claim 38, further comprising: a semiconductor device, mounted to said first surface, inside said first perimeter, said semiconductor device having a plurality of bond pads; and a plurality of wire bonds, at least one wire bond connected to at least one bond pad of said plurality of bond pads and at least one conductive element of said plurality of conductive elements.
Claim 45
Dependent Claim
33 words
The stackable ball grid array package according to claim 39, further comprising an encapsulant placed over said plurality of bond pads, said plurality of wire bonds, and a portion of said semiconductor device.
Claim 46
Dependent Claim
29 words
The stackable ball grid array package according to claim 39, wherein said first surface of said printed circuit board substrate further comprises a plurality of solder ball bump pads.
Claim 47
Dependent Claim
30 words
The stackable ball grid array package according to claim 38, wherein a first portion of said plurality of conductive elements aligns in a parallel row having a first pitch spacing.
Claim 48
Dependent Claim
31 words
The stackable ball grid array package according to claim 42, wherein a second portion of said plurality of conductive elements aligns in a second parallel row having a second pitch spacing.
Claim 49
Dependent Claim
24 words
The stackable ball grid array package according to claim 40, wherein said encapsulant has a second profile height less than said first profile height.
Claim 50
Dependent Claim
88 words
A stackable ball grid array package, comprising: a printed circuit board substrate having a first surface, a second surface, a plurality of terminal pads on said first surface, an aperture, and a plurality of conductive element pads on said second surface; a plurality of conductive elements, mounted along a first perimeter of said first surface, and coupled to some of said plurality of terminal pads on said first surface and some of said plurality of conductive element pads, said plurality of conductive elements having a first profile height.
Claim 51
Dependent Claim
88 words
A stackable ball grid array package, comprising: a printed circuit board substrate having a first surface, a second surface, a plurality of terminal pads on said first surface, an aperture, and a plurality of conductive element pads on said second surface; a plurality of conductive elements, mounted along a first perimeter of said first surface, and coupled to some of said plurality of terminal pads on said first surface and some of said plurality of conductive element pads, said plurality of conductive elements having a first profile height.
Claim 52
Dependent Claim
67 words
The stackable ball grid array package according to claim 45, further comprising: a semiconductor device, mounted to said second surface, inside said first perimeter, said semiconductor device having a plurality of bond pads mounted exposed to said aperture; and a plurality of wire bonds, connected to some of said plurality of bond pads and a portion of said plurality of terminal pads and passing through said aperture.
Claim 53
Dependent Claim
34 words
The stackable ball grid array package according to claim 46, further comprising an encapsulant placed over said plurality of bond pads, said plurality of terminal pads, said plurality of wire bonds, and said aperture.
Claim 54
Dependent Claim
28 words
The stackable ball grid array package according to claim 46, wherein said first surface of said printed circuit board substrate further comprises a plurality of conductive element pads.
Claim 55
Dependent Claim
30 words
The stackable ball grid array package according to claim 47, wherein said encapsulant has a second profile height less than said first profile height of said plurality of conductive elements.
Claim 56
Dependent Claim
227 words
A ball grid array assembly comprising: a plurality of stackable ball grid array packages, each comprising: a printed circuit board substrate having a first surface, a second surface, an aperture, and a plurality of conductive element pads on said second surface; a semiconductor device, mounted within a first perimeter of said first surface of said printed circuit board substrate and having a plurality of bond pads; a plurality of wire bonds, connected to at least some of said plurality of conductive element pads on said second surface of said printed circuit board substrate and some of said plurality of bond pads passing through said aperture; an encapsulant placed along said aperture, on said plurality of bond pads, and said plurality of wire bonds, forming a first profile height; and a plurality of conductive elements, mounted along a second perimeter of said second surface, said second perimeter being greater than said first perimeter, and coupled to some of said plurality of conductive element pads on said second surface, said plurality of conductive elements having a second profile height greater than said first profile height; each of said plurality of stackable ball grid array packages aligned one atop another such that a plurality of conductive elements on a first ball grid array aligns with and couples to a plurality of conductive element pads on a second ball grid array.
Claim 57
Dependent Claim
227 words
A ball grid array assembly comprising: a plurality of stackable ball grid array packages, each comprising: a printed circuit board substrate having a first surface, a second surface, an aperture, and a plurality of conductive element pads on said second surface; a semiconductor device, mounted within a first perimeter of said first surface of said printed circuit board substrate and having a plurality of bond pads; a plurality of wire bonds, connected to at least some of said plurality of conductive element pads on said second surface of said printed circuit board substrate and some of said plurality of bond pads passing through said aperture; an encapsulant placed along said aperture, on said plurality of bond pads, and said plurality of wire bonds, forming a first profile height; and a plurality of conductive elements, mounted along a second perimeter of said second surface, said second perimeter being greater than said first perimeter, and coupled to some of said plurality of conductive element pads on said second surface, said plurality of conductive elements having a second profile height greater than said first profile height; each of said plurality of stackable ball grid array packages aligned one atop another such that a plurality of conductive elements on a first ball grid array aligns with and couples to a plurality of conductive element pads on a second ball grid array.
Claim 58
Dependent Claim
40 words
The ball grid array assembly according to claim 50, wherein a first part of said plurality of conductive elements on each of said plurality of stackable ball grid array packages aligns in a parallel row having a first pitch spacing.
Claim 59
Dependent Claim
30 words
The ball grid array assembly according to claim 51, wherein a second part of said plurality of conductive elements aligns in a second parallel row having a second pitch spacing.
Claim 60
Dependent Claim
23 words
The ball grid array assembly according to claim 50, wherein said encapsulant has a second profile height less than said first profile height.
Claim 61
Dependent Claim
38 words
The ball grid array assembly according to claim 50, wherein a predetermined number of said plurality of conductive element pads are connected to a predetermined number of said plurality of bond pads through said printed circuit board substrate.
References Cited (Backward Citations)
US4371912A
Cited
US4638348A
Cited
US4761681A
Cited
US4868712A
Cited
US4841355A
Cited
US4956694A
Cited
US5231304A
Cited
US5012323A
Cited
US5299092A
Cited
US5311401A
Cited
US5239447A
Cited
US5128831A
Cited
US5313096A
Cited
US5373189A
Cited
US5400003A
Cited
US5266912A
Cited
US5637536A
Cited
US5642261A
Cited
US5384689A
Cited
US5625221A
Cited
US5675180A
Cited
US5668405A
Cited
US5648679A
Cited
US5639695A
Cited
US5616958A
Cited
US5677566A
Cited
US5639696A
Cited
US5804874A
Cited
US5844315A
Cited
US5835988A
Cited
US5883426A
Cited
US5994166A
Cited
US5815372A
Cited
US5903049A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-06 | 2003-12-06 | 2004-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-06 | 2007-12-06 | 2008-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-06 | 2011-12-06 | 2012-06-06 | $7700.00 | Window Closed / Lapsed |