← Back to Patent Explorer
US5903049A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor module comprising semiconductor packages

Assignee: Adeia Semiconductor Advanced Technologies Inc
•
Filing: 1998-05-06
•
Granted: 1999-05-11
•
Expires: 2018-05-06
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract Each of two semiconductor elements 1a or 1b is connected to wiring patterns 3a or 3b on an element substrate 2a or 2b via a bump 4a or 4b, respectively. These members are sealed off by sealing resin to form a semiconductor package 6a or 6b, and the same are disposed on a mounting substrate 8 one above the other with an adhesive agent 9 applied thereto. A portion of the wiring pattern 3a not covered by the sealing resin 5, which portion is connected to the semiconductor element 1a, a portion of the wiring pattern 3b connected to the semiconductor element 1b, and an electrode on the mounting substrate 8 are electrically interconnected by connecting wires 7.

Inventors

  • 👤 Ryuichiro Mori

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-06 06:37
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W90/00; H10W70/00; H10W70/60; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/20; H10W90/288; H10W90/701; H10W90/721; H10W90/724; H10W90/751; H10W90/752

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 124 words
A semiconductor module, comprising: a mounting substrate for mounting at least one semiconductor package thereon and having at least one electrode thereon; a plurality of semiconductor packages stacked and fixed onto said mounting substrate; each said semiconductor package including: an element substrate; a semiconductor element, having at least an electrode, fixed onto said element substrate; at least one wiring pattern formed on said element substrate and electrically connected with said electrode of said semiconductor element; and a sealing resin contacting and substantially encapsulating said semiconductor element, said sealing resin overlying said element substrate except at an end portion of said wiring pattern; and a plurality of connecting wires, each connecting said end portion of said wiring pattern and said electrode on said mounting substrate.
Claim 2
Dependent Claim 124 words
A semiconductor module, comprising: a mounting substrate for mounting at least one semiconductor package thereon and having at least one electrode thereon; a plurality of semiconductor packages stacked and fixed onto said mounting substrate; each said semiconductor package including: an element substrate; a semiconductor element, having at least an electrode, fixed onto said element substrate; at least one wiring pattern formed on said element substrate and electrically connected with said electrode of said semiconductor element; and a sealing resin contacting and substantially encapsulating said semiconductor element, said sealing resin overlying said element substrate except at an end portion of said wiring pattern; and a plurality of connecting wires, each connecting said end portion of said wiring pattern and said electrode on said mounting substrate.
Claim 3
Dependent Claim 33 words
The semiconductor module according to claim 1, further comprising a bump disposed on said element substrate for connecting said electrode of said semiconductor element with said wiring pattern formed on said element substrate.
Claim 4
Dependent Claim 24 words
The semiconductor module according to claim 1, further comprising a heat radiating mechanism interposed between adjoining semiconductor packages stacked up on said mounting substrate.

References Cited (Backward Citations)

US5631497A Cited
US5373189A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-05-10 2002-11-09 2003-05-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-05-10 2006-11-09 2007-05-11 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-05-10 2010-11-09 2011-05-11 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag