US5994784A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Die positioning in integrated circuit packaging
Assignee: Micron Technology Inc
•
Filing: 1997-12-18
•
Granted: 1999-11-30
•
Expires: 2017-12-18
Abstract
Abstract An integrated circuit die or chip may be positioned within an integrated circuit package by providing a spacer connected to the die and extending upwardly therefrom. When the die is overmolded, the spacer contacts the mold and spaces the die with respect to the mold. By forming the spacer using conventional wire bonding techniques, no additional process steps are necessary in forming the spacer and no additional parts are needed. The spacer wire bonds may be formed with wires which extend upwardly above the remaining wires, protecting the remaining wires from being contacted by the mold or from being positioned too close to the upper surface of the resulting molded package.
Inventors
- 👤 Syed Sajid Ahmad
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:02
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W76/00; H10W76/40; H10W72/00; H10W72/50; H10W72/541; H10W72/547; H10W72/5473; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
65 words
A packaged integrated circuit device comprising: a die; a plurality of leads; first wire bond wires connected between said leads and said die for electrical communication, said first wire bond wires having a highest part spaced above said die; and a second wire bond wire extending vertically above the highest part of the first wire bond wires, said second wire bond wire being electrically nonfunctional.
Claim 2
Dependent Claim
65 words
A packaged integrated circuit device comprising: a die; a plurality of leads; first wire bond wires connected between said leads and said die for electrical communication, said first wire bond wires having a highest part spaced above said die; and a second wire bond wire extending vertically above the highest part of the first wire bond wires, said second wire bond wire being electrically nonfunctional.
Claim 3
Dependent Claim
30 words
The device of claim 1 wherein said second wire bond wire is formed by wire bonding using the same process as is utilized for forming said first wire bond wires.
Claim 4
Dependent Claim
19 words
The device of claim 1 wherein said first wire bond wires are connected to bond pads on said die.
Claim 5
Dependent Claim
21 words
The device of claim 3 wherein said first and second wire bond wires are connected to said leads by wire bonding.
Claim 6
Dependent Claim
17 words
The device of claim 4 wherein said second wire bond wire is connected only to a lead.
Claim 7
Dependent Claim
20 words
The device of claim 5 wherein said second wire bond wire is connected to a lead at two spaced locations.
Claim 8
Dependent Claim
31 words
The device of claim 3 including a die paddle, said die mounted on said die paddle, said second wire bond wire is connected to said die paddle at two spaced locations.
Claim 9
Dependent Claim
31 words
The device of claim 3 including a die paddle, said die mounted on said die paddle, said second wire bond wire is connected to said lead and to said die paddle.
Claim 10
Dependent Claim
32 words
The device of claim 3 including a die paddle, said die mounted on said die paddle, said second wire bond wire is connected to a bond pad and to said die paddle.
Claim 11
Dependent Claim
47 words
A packaged integrated circuit device comprising: a die assembly including a die and a plurality of leads; and a bonded wire extending upwardly above said die assembly to space the die from a mold used for overmolding, said wire being connected to a lead at two points.
Claim 12
Dependent Claim
47 words
A packaged integrated circuit device comprising: a die assembly including a die and a plurality of leads; and a bonded wire extending upwardly above said die assembly to space the die from a mold used for overmolding, said wire being connected to a lead at two points.
Claim 13
Dependent Claim
55 words
A packaged integrated circuit device comprising: a die; a plurality of leads; wire bond wires connected between said leads and said die for electrical communication; and a spacer extending upwardly above said die and arranged to contact a mold utilized for overmolding said die, said spacer being connected to a lead at two spaced locations.
Claim 14
Dependent Claim
55 words
A packaged integrated circuit device comprising: a die; a plurality of leads; wire bond wires connected between said leads and said die for electrical communication; and a spacer extending upwardly above said die and arranged to contact a mold utilized for overmolding said die, said spacer being connected to a lead at two spaced locations.
Claim 15
Dependent Claim
14 words
The device of claim 11 wherein said spacer is connected only to a lead.
References Cited (Backward Citations)
JPH0547979A
Cited
JPH0684991A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-29 | 2003-05-31 | 2003-11-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-29 | 2007-05-31 | 2007-11-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-29 | 2011-05-31 | 2011-11-30 | $7700.00 | Window Closed / Lapsed |