US5898224A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for packaging flip chip bare die on printed circuit boards
Assignee: Micron Technology Inc
•
Filing: 1997-10-22
•
Granted: 1999-04-27
•
Expires: 2017-10-22
Abstract
Abstract An apparatus and a method for providing a fully protective package for a flip chip with a protective shield plate and an underfill encapsulant material. The apparatus comprises a semiconductor chip electrically connected by flip chip attachment to a substrate. A shield plate is placed in contact with a back surface of the semiconductor chip. An underfill encapsulant is disposed between the semiconductor chip and the shield plate, and the substrate. A glob top encapsulant may be applied about the periphery of the upper surface of the shield plate that extends to the substrate for additional protection and/or adherence.
Inventors
- 👤 Salman Akram
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 21:24
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W42/00; H10W42/20; H10W72/00; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W76/00; H10W76/40; H10W72/071; H10W72/0711; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/07331; H10W72/851; H10W72/853; H10W72/856; H10W72/874; H10W72/877; H10W72/879; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/736
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
165 words
A semiconductor assembly comprising: a substrate having an upper surface and a lower surface, the upper surface of said substrate having at least one electrical connection thereon; a semiconductor chip having a first surface and a second surface, the first surface of said semiconductor chip attached to the upper surface of said substrate and in electrical communication with the at least one electrical connection on the upper surface of said substrate; a shield plate having a first surface, a second surface, and a periphery extending beyond a periphery of the semiconductor chip, the first surface of said shield plate contacting the second surface of said semiconductor chip; and an underfill encapsulant disposed between the first surface of said semiconductor chip and the upper surface of said substrate and between the periphery of the first surface of said shield plate extending beyond the periphery of the semiconductor chip and a portion of the first surface of said shield plate and the upper surface of said substrate.
Claim 2
Dependent Claim
165 words
A semiconductor assembly comprising: a substrate having an upper surface and a lower surface, the upper surface of said substrate having at least one electrical connection thereon; a semiconductor chip having a first surface and a second surface, the first surface of said semiconductor chip attached to the upper surface of said substrate and in electrical communication with the at least one electrical connection on the upper surface of said substrate; a shield plate having a first surface, a second surface, and a periphery extending beyond a periphery of the semiconductor chip, the first surface of said shield plate contacting the second surface of said semiconductor chip; and an underfill encapsulant disposed between the first surface of said semiconductor chip and the upper surface of said substrate and between the periphery of the first surface of said shield plate extending beyond the periphery of the semiconductor chip and a portion of the first surface of said shield plate and the upper surface of said substrate.
Claim 3
Dependent Claim
15 words
The semiconductor assembly of claim 1, wherein said shield plate includes polymer or plastic material.
Claim 4
Dependent Claim
19 words
The semiconductor assembly of claim 1, wherein said shield plate has a higher thermal conductivity than said semiconductor chip.
Claim 5
Dependent Claim
20 words
The semiconductor assembly of claim 3, wherein said shield plate includes metal, thermally conductive ceramic, or other thermally conductive material.
Claim 6
Dependent Claim
35 words
The semiconductor assembly of claim 1, further comprising a glob top material disposed on the second surface and the periphery of said shield plate, wherein said glob top material extends to and contacts said substrate.
Claim 7
Dependent Claim
23 words
The semiconductor assembly of claim 5, wherein said glob top material extends under a portion of the first surface of said shield plate.
Claim 8
Dependent Claim
30 words
The semiconductor assembly of claim 5, wherein said glob top material extends under a portion of the first surface of said shield plate to transfer heat from the semiconductor chip.
Claim 9
Dependent Claim
168 words
A semiconductor assembly comprising: a substrate having an upper surface and a lower surface, the upper surface having at least one electrical connector thereon; a semiconductor chip having a first surface and a second surface, the first surface attached to the upper surface of the substrate and in electrical communication with the at least one electrical connector on the upper surface of said substrate; a shield plate having a first surface, a second surface, and a periphery, the first surface of said shield plate contacting the second surface of the semiconductor chip; an underfill encapsulant disposed between the first surface of the semiconductor chip and the upper surface of said substrate and between the first surface of said shield plate and and the upper surface of said substrate; and a glob top material disposed on the second surface and the periphery of said shield plate, said glob top material extending to and in contact with the upper surface of said substrate and in contact with said underfill encapsulant.
Claim 10
Dependent Claim
168 words
A semiconductor assembly comprising: a substrate having an upper surface and a lower surface, the upper surface having at least one electrical connector thereon; a semiconductor chip having a first surface and a second surface, the first surface attached to the upper surface of the substrate and in electrical communication with the at least one electrical connector on the upper surface of said substrate; a shield plate having a first surface, a second surface, and a periphery, the first surface of said shield plate contacting the second surface of the semiconductor chip; an underfill encapsulant disposed between the first surface of the semiconductor chip and the upper surface of said substrate and between the first surface of said shield plate and and the upper surface of said substrate; and a glob top material disposed on the second surface and the periphery of said shield plate, said glob top material extending to and in contact with the upper surface of said substrate and in contact with said underfill encapsulant.
Claim 11
Dependent Claim
23 words
The semiconductor assembly of claim 8, wherein said glob top material extends under a portion of the first surface of said shield plate.
Claim 12
Dependent Claim
28 words
The semiconductor assembly of claim 9, wherein said glob top material extends under a portion of the first surface of said shield plate for the transfer heat therefrom.
References Cited (Backward Citations)
US4628406A
Cited
US4873615A
Cited
US5081067A
Cited
US5289346A
Cited
US5379191A
Cited
US5291064A
Cited
US5488254A
Cited
US5239200A
Cited
US5201866A
Cited
US5396403A
Cited
US5489801A
Cited
US5432675A
Cited
US5477082A
Cited
US5656857A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-04-26 | 2002-10-26 | 2003-04-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-04-26 | 2006-10-26 | 2007-04-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-04-26 | 2010-10-26 | 2011-04-27 | $7700.00 | Window Closed / Lapsed |