US5489801A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Quad flat package heat slug composition
Assignee: Intel Corp
•
Filing: 1995-01-12
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Granted: 1996-02-06
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Expires: 2015-01-12
Abstract
Abstract An integrated circuit package which contains a heat slug that extends from an integrated circuit to a top surface of a surrounding housing. The heat slug has a coefficient of thermal expansion that matches the coefficients of thermal expansion of the housing and the integrated circuit to reduce thermal stresses in the package.
Inventors
- 👤 II Richard C. Blish
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 19:39
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W74/40; H10W74/47; H10W74/473; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
122 words
A semiconductor package, comprising: an integrated circuit that has a coefficient of thermal expansion of approximately 3.0 parts per million per degrees centigrade; a plastic housing that encapsulates said integrated circuit, said plastic housing having a top surface and a coefficient of thermal expansion of approximately 15.0 parts per million per degrees centigrade; a lead frame that is coupled to said integrated circuit and has leads which extend from said housing; and, a heat slug that is coupled to said integrated circuit and extends to said top surface of said housing, said heat slug being constructed from a composition of 70% copper and 30% molybdenum and which has a coefficient of thermal expansion of approximately 13.0 parts per million per degrees centigrade.
Claim 2
Dependent Claim
122 words
A semiconductor package, comprising: an integrated circuit that has a coefficient of thermal expansion of approximately 3.0 parts per million per degrees centigrade; a plastic housing that encapsulates said integrated circuit, said plastic housing having a top surface and a coefficient of thermal expansion of approximately 15.0 parts per million per degrees centigrade; a lead frame that is coupled to said integrated circuit and has leads which extend from said housing; and, a heat slug that is coupled to said integrated circuit and extends to said top surface of said housing, said heat slug being constructed from a composition of 70% copper and 30% molybdenum and which has a coefficient of thermal expansion of approximately 13.0 parts per million per degrees centigrade.
Claim 3
Dependent Claim
21 words
The package as recited in claim 1, wherein said heat slug has an outer rim that is embedded into said housing.
Claim 4
Dependent Claim
17 words
The package as recited in claim 1, wherein said heat slug is bonded to said lead free.
Claim 5
Dependent Claim
133 words
A semiconductor package, comprising: an integrated circuit that has a coefficient of thermal expansion of approximately 3.0 parts per million per degrees centigrade; a plastic housing that encapsulates said integrated circuit, said plastic housing having a top surface and a coefficient of thermal expansion of approximately 15.0 parts per million per degrees centigrade; a lead frame that is coupled to said integrated circuit and has leads which extend from said housing; and, a heat slug that is bonded to said lead frame and extends to said top surface of said housing, said heat slug having an outer rim embedded into said housing, said heat slug being constructed from a composition of 70% copper and 30% molybdenum, and which has a coefficient of thermal expansion of approximately 13.0 parts per million per degrees centigrade.
Claim 6
Dependent Claim
133 words
A semiconductor package, comprising: an integrated circuit that has a coefficient of thermal expansion of approximately 3.0 parts per million per degrees centigrade; a plastic housing that encapsulates said integrated circuit, said plastic housing having a top surface and a coefficient of thermal expansion of approximately 15.0 parts per million per degrees centigrade; a lead frame that is coupled to said integrated circuit and has leads which extend from said housing; and, a heat slug that is bonded to said lead frame and extends to said top surface of said housing, said heat slug having an outer rim embedded into said housing, said heat slug being constructed from a composition of 70% copper and 30% molybdenum, and which has a coefficient of thermal expansion of approximately 13.0 parts per million per degrees centigrade.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-02-05 | 1999-08-07 | 2000-02-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-02-05 | 2003-08-07 | 2004-02-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-02-05 | 2007-08-07 | 2008-02-06 | $7700.00 | Window Closed / Lapsed |