US6344976B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Interdigitated leads-over-chip lead frame device and method for supporting an integrated circuit die
Assignee: Micron Technology Inc
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Filing: 1999-11-29
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Granted: 2002-02-05
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Expires: 2019-11-29
Abstract
Abstract An inventive Leads-Over-Chip (LOC) lead frame includes an assembly of interdigitated leads constructed to overlie double-sided adhesive tape on the front-side surface of an integrated circuit (IC) die. An attachment surface of each lead is adhesively attachable to the tape, and at least some of the leads are constructed to extend across the front-side surface of the die from one edge substantially to another edge, such as an adjacent or opposing edge. As a result, a substantial area of the front-side surface of the die is adhesively attachable to the leads through the tape, so the die is supportable in an IC package in an improved manner, and the heat may be conducted away from the die through the lead frame in an improved manner.
Inventors
- 👤 Aaron Schoenfeld
- 👤 Jerry M. Brooks
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:42
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/411; H10W70/415; H10W72/00; H10W72/851; H10W72/853; H10W72/865; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
117 words
An electronic system having a memory device connected to a processor device, one of the memory device and processor device including an integrated circuit package comprising: a semiconductor device having an active surface having a first edge, a second edge, a third edge, and a fourth edge; and a lead frame including a plurality of leads overlying the active surface of the semiconductor device and providing support for said semiconductor device, a first portion of the plurality of leads extending across the active surface from the first edge thereof to substantially the second edge thereof and a second portion of the plurality of leads extending across the active surface from the second edge to the first edge.
Claim 2
Dependent Claim
117 words
An electronic system having a memory device connected to a processor device, one of the memory device and processor device including an integrated circuit package comprising: a semiconductor device having an active surface having a first edge, a second edge, a third edge, and a fourth edge; and a lead frame including a plurality of leads overlying the active surface of the semiconductor device and providing support for said semiconductor device, a first portion of the plurality of leads extending across the active surface from the first edge thereof to substantially the second edge thereof and a second portion of the plurality of leads extending across the active surface from the second edge to the first edge.
Claim 3
Dependent Claim
114 words
An electronic system having a memory device and a processor device, one of the memory device and processor device including an integrated circuit package comprising: a semiconductor device having an active surface; tape overlying the active surface of the semiconductor device and in adhesive contact therewith; and a lead frame including a plurality of leads overlying the tape and the front-side surface of the semiconductor die with at least some of the plurality of leads extending across the active surface from one edge thereof substantially to another edge thereof and with at least some of the plurality of leads extending across the active surface from the another edge thereof to the one edge thereof.
Claim 4
Dependent Claim
114 words
An electronic system having a memory device and a processor device, one of the memory device and processor device including an integrated circuit package comprising: a semiconductor device having an active surface; tape overlying the active surface of the semiconductor device and in adhesive contact therewith; and a lead frame including a plurality of leads overlying the tape and the front-side surface of the semiconductor die with at least some of the plurality of leads extending across the active surface from one edge thereof substantially to another edge thereof and with at least some of the plurality of leads extending across the active surface from the another edge thereof to the one edge thereof.
Claim 5
Dependent Claim
144 words
A computer system comprising a memory device and a processor device, one of the memory device and processor device including an integrated circuit package comprising: a semiconductor device having an active surface; adhesive tape overlying the active surface of the semiconductor device in adhesive attachment therewith; and a lead frame including a plurality of leads overlying the tape and the active surface of the semiconductor device having an attachment surface of at least one lead of the plurality of leads adhesively attached to the tape having at least some of the plurality of leads extending across the active surface from one edge thereof substantially to another edge thereof and some of the plurality of leads extending across the active surface from the another edge thereof to the one edge thereof so a substantial area thereof is adhesively attached to the leads through the tape.
Claim 6
Dependent Claim
144 words
A computer system comprising a memory device and a processor device, one of the memory device and processor device including an integrated circuit package comprising: a semiconductor device having an active surface; adhesive tape overlying the active surface of the semiconductor device in adhesive attachment therewith; and a lead frame including a plurality of leads overlying the tape and the active surface of the semiconductor device having an attachment surface of at least one lead of the plurality of leads adhesively attached to the tape having at least some of the plurality of leads extending across the active surface from one edge thereof substantially to another edge thereof and some of the plurality of leads extending across the active surface from the another edge thereof to the one edge thereof so a substantial area thereof is adhesively attached to the leads through the tape.
Claim 7
Dependent Claim
18 words
The electronic system of claim 1 , further comprising tape overlying the active surface of the semiconductor device.
Claim 8
Dependent Claim
27 words
The electronic system of claim 4 , wherein the tape is in adhesive contact with at least a portion of the active surface of the semiconductor device.
Claim 9
Dependent Claim
15 words
The electronic system of claim 5 , wherein the tape is a double-sided adhesive tape.
Claim 10
Dependent Claim
23 words
The electronic system of claim 6 , wherein the tape is in adhesive contact with at least some of the plurality of leads.
Claim 11
Dependent Claim
45 words
The electronic system of claim 1 , wherein the active surface of the semiconductor device includes a plurality of bond pads thereon, and wherein at least some of the plurality of leads are electrically connected to at least some of the plurality of bond pads.
Claim 12
Dependent Claim
50 words
The electronic system of claim 1 , wherein at least some of the first portion of the leads extending across the active surface from the first edge thereof to substantially the second edge thereof extend across at least 60% of a distance between the first edge and the second edge.
Claim 13
Dependent Claim
23 words
The electronic system of claim 2 , wherein at least some of the plurality of leads are structurally supportive of the semiconductor device.
Claim 14
Dependent Claim
22 words
The electronic system of claim 2 , wherein at least some of the plurality of leads are adhesively attached to the tape.
Claim 15
Dependent Claim
15 words
The electronic system of claim 11 , wherein the tape is a double-sided adhesive tape.
Claim 16
Dependent Claim
26 words
The electronic system of claim 2 , wherein at least some of the plurality of leads are configured in heat conducting relation to the semiconductor device.
Claim 17
Dependent Claim
45 words
The electronic system of claim 2 , wherein the active surface of the semiconductor device includes a plurality of bond pads thereon, and wherein at least some of the plurality of leads are electrically connected to at least some of the plurality of bond pads.
Claim 18
Dependent Claim
16 words
The computer system of claim 3 , wherein the adhesive tape is a double-sided adhesive tape.
Claim 19
Dependent Claim
23 words
The computer system of claim 3 , wherein at least some of the plurality of leads are structurally supportive of the semiconductor device.
Claim 20
Dependent Claim
15 words
The computer system of claim 3 , wherein the tape is a double-sided adhesive tape.
Claim 21
Dependent Claim
26 words
The computer system of claim 3 , wherein at least some of the plurality of leads are configured in heat conducting relation to the semiconductor device.
Claim 22
Dependent Claim
45 words
The computer system of claim 3 , wherein the active surface of the semiconductor device includes a plurality of bond pads thereon, and wherein at least some of the plurality of leads are electrically connected to at least some of the plurality of bond pads.
Claim 23
Dependent Claim
47 words
The computer system of claim 3 , wherein the at least some of the plurality of leads extending across the active surface from one edge thereof substantially to another edge thereof extend across at least 60% of a distance between the one edge and the another edge.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-02-04 | 2005-08-06 | 2006-02-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-02-04 | 2009-08-06 | 2010-02-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-02-04 | 2013-08-06 | 2014-02-05 | $7700.00 | Window Closed / Lapsed |