US5585667A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead frame for handling crossing bonding wires
Assignee: National Semiconductor Corp
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Filing: 1994-12-23
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Granted: 1996-12-17
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Expires: 2014-12-23
Abstract
Abstract A method is disclosed for packaging for an integrated circuit having lead frames with closely spaced leads that are configured in such a way that the bonding wires must cross over other leads prior to bonding to the appropriate lead. The method includes the formation of a modified lead frame such that the likelihood of electrical contact between the bonding wires and leads crossed over by bonding wires is reduced. In one embodiment, insulating film is placed on an adjacent lead, or additionally on a number of crossed over leads, directly under the path of the bonding wire such that the potential for electrical contact is reduced. In a second embodiment, a depression is formed on an adjacent lead, or additionally on a number of crossed over leads, causing additional clearance is created between the bonding wire and the lead such that the likelihood of contact is reduced. In a third embodiment, a stepped depression is formed on the bonded lead such that the depression facilitates the bonding of the wire at an increased incline resulting in additional space between bonding wire and the crossed leads thereby reducing the likelihood of contact.
Inventors
- 👤 Chainarong Asanasavest
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 18:18
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W70/424; H10W70/456; H10W70/458; H10W90/00; H10W90/811; H10W72/00; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/581; H10W72/90; H10W72/931; H10W72/932; H10W72/951; H10W74/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
222 words
An integrated circuit package, comprising: an etched lead frame having a plurality of leads, said lead frame defining a die attach area, wherein the plurality of leads are arranged to form diagonal conductive strips through the die attach area. a die affixed in the die attach area, the die having a plurality of bond pads; a plurality of bonding wires for electrically coupling the die to the leads, a selected one of the bonding wire having a first end and a second end, the first end being bonded to an associated one of the bond pads on the die and the second end being bonded to an associated first lead on the lead frame, the selected bonding wire being arranged such that the selected bonding wire passes over a second lead of the lead frame that is positioned adjacent to the first lead; an insulating film applied to the second lead at a position directly fly under the path of the selected bonding wire such that the likelihood of electrical contact between the selected bonding wire and the second lead is reduced, wherein the insulating film is an etching mask applied prior to an etching of the lead frame; and an encapsulating material formed around the die, bonding wires, and an inner portion of the lead frame to provide a protective package.
Claim 2
Dependent Claim
222 words
An integrated circuit package, comprising: an etched lead frame having a plurality of leads, said lead frame defining a die attach area, wherein the plurality of leads are arranged to form diagonal conductive strips through the die attach area. a die affixed in the die attach area, the die having a plurality of bond pads; a plurality of bonding wires for electrically coupling the die to the leads, a selected one of the bonding wire having a first end and a second end, the first end being bonded to an associated one of the bond pads on the die and the second end being bonded to an associated first lead on the lead frame, the selected bonding wire being arranged such that the selected bonding wire passes over a second lead of the lead frame that is positioned adjacent to the first lead; an insulating film applied to the second lead at a position directly fly under the path of the selected bonding wire such that the likelihood of electrical contact between the selected bonding wire and the second lead is reduced, wherein the insulating film is an etching mask applied prior to an etching of the lead frame; and an encapsulating material formed around the die, bonding wires, and an inner portion of the lead frame to provide a protective package.
Claim 3
Dependent Claim
39 words
An integrated circuit package as recited in claim 1 wherein the die attach area is selected from a group consisting of: a die attach pad, a void area on a substrate, and a support area on a lead frame.
Claim 4
Dependent Claim
22 words
An integrated circuit package as recited in claim 1 wherein the insulating film is further applied to a plurality of crossed leads.
Claim 5
Dependent Claim
18 words
An integrated circuit package as recited in claim 1 wherein the encapsulating material is an injection molded plastic.
Claim 6
Dependent Claim
200 words
An integrated circuit package, comprising: a lead frame having a plurality of leads, said lead frame defining a die attach area, wherein the plurality of leads form diagonal conductive strips through the die attach area; a die affixed in the die attach area, the die having a plurality of bond pads; a plurality of bonding wires for electrically coupling the die to the leads, a selected one of the bonding wires having a first end and a second end, the first end being bonded to an association one of the bond pads on the die and the second end being bonded to an associated first lead on the lead frame, the selected bonding wire being arranged such that the selected bonding wire passes over a second lead of the lead frame that is positioned adjacent to the first lead; an insulating film applied to the second lead at a position directly under the path of the selected bonding wire such that the likelihood of electrical contact between the selected bonding wire and the second lead is reduced; and an encapsulating material formed around the die, bonding wires, and an inner portion of the lead frame to provide a protective package.
Claim 7
Dependent Claim
200 words
An integrated circuit package, comprising: a lead frame having a plurality of leads, said lead frame defining a die attach area, wherein the plurality of leads form diagonal conductive strips through the die attach area; a die affixed in the die attach area, the die having a plurality of bond pads; a plurality of bonding wires for electrically coupling the die to the leads, a selected one of the bonding wires having a first end and a second end, the first end being bonded to an association one of the bond pads on the die and the second end being bonded to an associated first lead on the lead frame, the selected bonding wire being arranged such that the selected bonding wire passes over a second lead of the lead frame that is positioned adjacent to the first lead; an insulating film applied to the second lead at a position directly under the path of the selected bonding wire such that the likelihood of electrical contact between the selected bonding wire and the second lead is reduced; and an encapsulating material formed around the die, bonding wires, and an inner portion of the lead frame to provide a protective package.
Claim 8
Dependent Claim
30 words
An integrated circuit package as recited in claim 5 wherein the insulating film is a photoresist defined by an etching mask applied prior to an etching of the lead frame.
Claim 9
Dependent Claim
219 words
An integrated circuit package, comprising: a lead frame having a plurality of leads, said lead frame defining a die attach area, wherein the plurality of leads form a diagonal conductive strips through the die attach area; a die affixed in the die attach area, the die having a plurality of bond pads; a plurality of bonding wires for electrically coupling the die to the leads, a selected one of the bonding wires having a first end and a second end, the first end being bonded to an associated one of the bond pads on the die and the second end being bonded to an associated first lead on the lead frame, the selected bonding wire being arranged such that the selected bonding wire passes over a second lead of the lead frame that is positioned adjacent to the first lead; a depression formed on the second lead directly under the path of the selected bonding wire such that additional clearance is created between the selected bonding wire and the second lead thereby reducing the likelihood of electrical contact; and an encapsulating material molded around the die, bonding wires, and inner portion of the lead frame to provide a protective package, wherein the encapsulation material is molded directly over the depression such that the encapsulation material directly contacts the depression.
Claim 10
Dependent Claim
219 words
An integrated circuit package, comprising: a lead frame having a plurality of leads, said lead frame defining a die attach area, wherein the plurality of leads form a diagonal conductive strips through the die attach area; a die affixed in the die attach area, the die having a plurality of bond pads; a plurality of bonding wires for electrically coupling the die to the leads, a selected one of the bonding wires having a first end and a second end, the first end being bonded to an associated one of the bond pads on the die and the second end being bonded to an associated first lead on the lead frame, the selected bonding wire being arranged such that the selected bonding wire passes over a second lead of the lead frame that is positioned adjacent to the first lead; a depression formed on the second lead directly under the path of the selected bonding wire such that additional clearance is created between the selected bonding wire and the second lead thereby reducing the likelihood of electrical contact; and an encapsulating material molded around the die, bonding wires, and inner portion of the lead frame to provide a protective package, wherein the encapsulation material is molded directly over the depression such that the encapsulation material directly contacts the depression.
Claim 11
Dependent Claim
18 words
An integrated circuit package as recited in claim 7 wherein the encapsulating material is an injection molded plastic.
Claim 12
Dependent Claim
20 words
An integrated circuit package as recited in claim 7 wherein further depressions are formed on a plurality of crossed leads.
Claim 13
Dependent Claim
215 words
An integrated circuit package, comprising: a lead frame having a plurality of leads, said lead frame defining a die attach area; a die affixed in the die attach area, the die having a plurality of bond pads; a plurality of bonding wires for electrically coupling the die to the leads, a selected one of the bonding wires having a first end and a second end, the first end being bonded to one of the bond pads on the die and the second end being bonded to an associated first lead on the lead frame, the selected bonding wire being arranged such that the selected bonding wire passes over a second lead of the lead frame that is positioned adjacent to the first lead, the bond between the second end of the selected bonding wire and the associated lead on the lead frame defining a lead bonding area; a depression formed on the lead bonding area thereby causing the selected bonding wire to be attached to the lead at an increased incline such that additional clearance is created between the selected bonding wire and the second lead thereby reducing the likelihood of electrical contact; and an encapsulating material formed around the die, bonding wires, and inner portion of the lead frame to provide a protective package.
Claim 14
Dependent Claim
215 words
An integrated circuit package, comprising: a lead frame having a plurality of leads, said lead frame defining a die attach area; a die affixed in the die attach area, the die having a plurality of bond pads; a plurality of bonding wires for electrically coupling the die to the leads, a selected one of the bonding wires having a first end and a second end, the first end being bonded to one of the bond pads on the die and the second end being bonded to an associated first lead on the lead frame, the selected bonding wire being arranged such that the selected bonding wire passes over a second lead of the lead frame that is positioned adjacent to the first lead, the bond between the second end of the selected bonding wire and the associated lead on the lead frame defining a lead bonding area; a depression formed on the lead bonding area thereby causing the selected bonding wire to be attached to the lead at an increased incline such that additional clearance is created between the selected bonding wire and the second lead thereby reducing the likelihood of electrical contact; and an encapsulating material formed around the die, bonding wires, and inner portion of the lead frame to provide a protective package.
Claim 15
Dependent Claim
18 words
An integrated circuit package as recited in claim 10 wherein a depression is formed on the second lead.
Claim 16
Dependent Claim
18 words
An integrated circuit package as recited in claim 10 wherein the encapsulating material is an injection molded plastic.
Claim 17
Dependent Claim
20 words
An integrated circuit package as recited in claim 11 wherein further depressions are formed on a plurality of crossed leads.
References Cited (Backward Citations)
US3518504A
Cited
JPS6064442A
Cited
US5072280A
Cited
JPH03191547A
Cited
JPH03255655A
Cited
EP0478240A2
Cited
JPH04267534A
Cited
US5229329A
Cited
US5086018A
Cited
GB2263815A
Cited
JPH05235245A
Cited
US5455452A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-17 | 2000-06-17 | 2000-12-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-17 | 2004-06-17 | 2004-12-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-17 | 2008-06-17 | 2008-12-17 | $7700.00 | Window Closed / Lapsed |