Resin sealed semiconductor device

Claim 2

A resin sealed semiconductor device, comprising: a semiconductor element having an upper surface and a rectangular shape encircled by two long straight edges in parallel to each other and two short straight edges in parallel to each other, said semiconductor element including a plurality of bonding pads arranged in a line parallel with said long straight edges and formed on a peripheral section of said upper surface near one of said long straight edges; a lead frame of metal including a plurality of leads, said leads being fixedly attached to said upper surface of said semiconductor element through insulating adhesive, formed on a central section of said upper surface and extending on said peripheral section of said upper surface at portions remote from and between said bonding pads, and extracted from said one of said long straight edges outwardly, said leads having bonding areas positioned on said central section, said bonding areas of said leads being arranged on a line in parallel with said one of said long straight edges; a plurality of metal wires connecting said bonding areas of said leads and said bonding pads, respectively, a first metal wire among said plurality of metal wires being connected to said bonding area of a first lead among said plurality of leads, said first metal wire crosses above a second lead among said plurality of leads and connects to a first bonding pad among said plurality of bonding pads, said second lead being formed adjacent to said first lead and between said first lead and said first bonding pad; an insulating film having a strip shape, continuously extending in one direction in parallel with said long straight edges and attached to parts of an upper surface of said plurality of said leads, respectively, said part of said upper surface of said second lead being positioned under said first metal wire such that said first metal wire crosses above said second lead by interposing said insulating film; and resin for sealing said semiconductor element, said leads, said metal wires and said insulating film as a unit.

Claim 3

A resin sealed semiconductor device of claim 1, wherein said leads are terminated on said central section with a terminating part having a width wider than other parts of said leads and said bonding areas are positioned in said terminating parts, respectively.

Claim 4

A resin sealed semiconductor device of claim 1, further comprising a second bonding pad among said plurality of bonding pads and a second metal wire among said plurality of metal wires, where said second metal wire connects said bonding area of said second lead and said second bonding pad without crossing any other of said leads.

Claim 5

A resin sealed semiconductor device of claim 3, further comprising a third lead among said plurality of leads, said third lead being adjacent to said second lead, and said first and second bonding pads being formed between said second and third leads.

Claim 6

A resin sealed semiconductor device of claim 1, wherein said insulating film consists of a polyimide resin film coated with epoxy resin.

Claim 7

A resin sealed semiconductor device, comprising: a semiconductor element having an upper surface and a rectangular shape encircled by first and second long straight edges in parallel to each other and first and second short straight edges in parallel to each other, said semiconductor element including a first group of bonding pads arranged in a first row line parallel with said first long straight edge and positioned at a first peripheral section of said upper surface near said first long straight edge and a second group of bonding pads arranged in a second row line in parallel with said second long straight edge and positioned at a second peripheral section of said upper surface near said second long straight edge; first and second groups of leads each being fixedly attached to said upper surface of said semiconductor element through insulating adhesive, said first group leads being formed on said first peripheral section and positioned to avoid contact with said first group bonding pads, said first group leads extending inwardly beyond said first row line and forming bonding areas respectively, on a central section of said upper surface, said bonding areas of said first group leads being arranged in a third row line in parallel with said first long straight edge and more remote from said first long straight edge than said first row line, said second group leads being formed on said second peripheral section and positioned to avoid contact with said second group bonding pads, said second group leads extending inwardly beyond said second row line and forming bonding areas, respectively, on said central section of said upper surface, said bonding areas of said second group leads being arranged in a fourth row line in parallel with said second long straight edge and more remote from said second long straight edge than said second row line; first, second, third and fourth groups of bonding wires, each of said first group bonding wires being connected to said bonding area of one of said first group leads by crossing over one of said leads adjacent to said one of said first group leads and connected to one of said first group bonding pads, each of said second group bonding wires being connected to said bonding area of one of said first group leads and connected to one of said first group bonding pads without crossing any of said leads, each of said third group bonding wires being connected to said bonding area of one of said second group leads by crossing over one of said leads adjacent to said one of said second group leads and connected to one of said second group bonding pads, each of said fourth group bonding wires being connected to said bonding area of one of said second group leads and connected to one of said second group bonding pads without crossing any lead; insulating films attached to upper surfaces of said first and second group leads under said first and third group bonding wires crossing over said upper surfaces; and resin for sealing said semiconductor element, said first and second group leads, said first, second, third and fourth bonding wires and said insulating films as a unit.

Claim 8

A resin sealed semiconductor device, comprising: a semiconductor element having an upper surface and a rectangular shape encircled by first and second long straight edges in parallel to each other and first and second short straight edges in parallel to each other, said semiconductor element including a first group of bonding pads arranged in a first row line parallel with said first long straight edge and positioned at a first peripheral section of said upper surface near said first long straight edge and a second group of bonding pads arranged in a second row line in parallel with said second long straight edge and positioned at a second peripheral section of said upper surface near said second long straight edge; first and second groups of leads each being fixedly attached to said upper surface of said semiconductor element through insulating adhesive, said first group leads being formed on said first peripheral section and positioned to avoid contact with said first group bonding pads, said first group leads extending inwardly beyond said first row line and forming bonding areas respectively, on a central section of said upper surface, said bonding areas of said first group leads being arranged in a third row line in parallel with said first long straight edge and more remote from said first long straight edge than said first row line, said second group leads being formed on said second peripheral section and positioned to avoid contact with said second group bonding pads, said second group leads extending inwardly beyond said second row line and forming bonding areas, respectively, on said central section of said upper surface, said bonding areas of said second group leads being arranged in a fourth row line in parallel with said second long straight edge and more remote from said second long straight edge than said second row line; first, second, third and fourth groups of bonding wires, each of said first group bonding wires being connected to said bonding area of one of said first group leads by crossing over one of said leads adjacent to said one of said first group leads and connected to one of said first group bonding pads, each of said second group bonding wires being connected to said bonding area of one of said first group leads and connected to one of said first group bonding pads without crossing any of said leads, each of said third group bonding wires being connected to said bonding area of one of said second group leads by crossing over one of said leads adjacent to said one of said second group leads and connected to one of said second group bonding pads, each of said fourth group bonding wires being connected to said bonding area of one of said second group leads and connected to one of said second group bonding pads without crossing any lead; insulating films attached to upper surfaces of said first and second group leads under said first and third group bonding wires crossing over said upper surfaces; and resin for sealing said semiconductor element, said first and second group leads, said first, second, third and fourth bonding wires and said insulating films as a unit.

Claim 9

A resin sealed semiconductor device of claim 6, wherein each of said first and second group leads is terminated on said central section with a terminating part having a width wider than other parts of said leads and each of said bonding areas of said first and second group leads is positioned at said terminating part.

Claim 10

A resin sealed semiconductor device of claim 6, wherein said insulating films extend continuously in one direction in parallel with said first and second long straight edge of said semiconductor element such that they cover parts of said first and second group leads, respectively.

Claim 11

A resin sealed semiconductor device of claim 6, wherein said insulating films consist of polyimide resin films coated with epoxy resin.