Integrated circuit package with overlapped die on a common lead frame

Claim 2

An integrated circuit package, comprising: a first integrated circuit die, said first die having a plurality of circuit interconnection pads on a major surface of said first die; a second integrated circuit die, said second die having a plurality of circuit interconnection pads on a major surface of said second die; wherein said first die and said second die are substantially the same in size and the layout of said integrated circuit of each said die is substantially the same; and a substantially planar lead frame comprised of a plurality of electrical conductor elements, wherein said major surfaces of said first die and said second die are mounted to opposite sides of said lead frame so as to position said plurality of circuit interconnection pads on each said die adjacent corresponding ones of said plurality of electrical conductor elements on said lead frame; wherein said lead frame substantially overlays each of said integrated circuit die, and wherein an adhesive layer is disposed between each said die and said lead frame.

Claim 3

The package of claim 1, wherein said circuit interconnection pads on each said die are located within an area near an outer edge on each said respective die.

Claim 4

The package of claim 1, further comprising a casing substantially surrounding said first and second die and said lead frame.

Claim 5

The package of claim 1, wherein said circuit interconnection pads are disposed along an edge of a major surface of each said die.

Claim 6

The package of claim 1, wherein said adhesive layer comprises a double-sided polyimide tape.

Claim 7

The package of claim 1, wherein said lead frame overlays a substantial portion of each said die.

Claim 8

The package of claim 1, wherein said circuit interconnection pads on each said die are disposed in a single row along an edge of a major surface of each said die.

Claim 9

The package of claim 3, wherein said casing is transfer molded plastic.

Claim 10

The package of claim 1, wherein said adhesive layer comprises a high temperature polymer adhesive.

Claim 11

The package of claim 1, wherein bonding wires are connected between each said circuit interconnection pad on each said die and said lead frame.

Claim 12

The package of claim 1, wherein said lead frame is 3.0 mils thick.

Claim 13

The package of claim 2, wherein said area on said first die is not overlaid by said second die.

Claim 14

The package of claim 1, wherein at least one said circuit interconnection pad on said first die and at least one said circuit interconnection pad on said second die are electrically connected to a common lead frame electrical conductor element.

Claim 15

The package of claim 3, further comprising a metal foil layer attached to at least one of the major surfaces of said package.

Claim 16

A high density integrated circuit package, comprising: a first integrated circuit die, wherein said first die includes a plurality of bonding pads disposed in close proximity to an edge of a major surface of said first die, wherein said first die is mounted to a first major surface of a lead frame and is electrically connected thereto; and wherein said lead frame comprises a plurality of substantially planar electrical conductors; a second integrated circuit die, wherein said second die includes a plurality of bonding pads disposed in close proximity to an edge of a major surface of said second die, and wherein said second die is mounted to a second major surface of said lead frame and is electrically connected thereto wherein said first die and said second die are substantially the same in size and the layout of said integrated circuit of each said die is substantially the same; wherein said lead frame is substantially planar and overlays each said integrated circuit die, an adhesive layer disposed between said first die and said first major surface of said lead frame and between said second die and said second major surface of said lead frame; and a casing substantially surrounding said first die, said second die and said lead frame, wherein electrical leads extend through said casing.

Claim 17

A high density integrated circuit package, comprising: a first integrated circuit die, wherein said first die includes a plurality of bonding pads disposed in close proximity to an edge of a major surface of said first die, wherein said first die is mounted to a first major surface of a lead frame and is electrically connected thereto; and wherein said lead frame comprises a plurality of substantially planar electrical conductors; a second integrated circuit die, wherein said second die includes a plurality of bonding pads disposed in close proximity to an edge of a major surface of said second die, and wherein said second die is mounted to a second major surface of said lead frame and is electrically connected thereto wherein said first die and said second die are substantially the same in size and the layout of said integrated circuit of each said die is substantially the same; wherein said lead frame is substantially planar and overlays each said integrated circuit die, an adhesive layer disposed between said first die and said first major surface of said lead frame and between said second die and said second major surface of said lead frame; and a casing substantially surrounding said first die, said second die and said lead frame, wherein electrical leads extend through said casing.

Claim 18

The package of claim 15, wherein said adhesive layer is a high temperature polymer adhesive.

Claim 19

The package of claim 15, wherein said adhesive layer comprises a double-sided polyimide tape.

Claim 20

The package of claim 15, wherein said lead frame is 3.0 mils thick.

Claim 21

The package of claim 15, further comprising bonding wires connected between said bonding pads on said first die and said lead frame and between said bonding pads on said second die and said lead frame.