Abstract An electronic multichip module suitable for use in a hostile environment. The module includes a metallic base member and a metallic cover hermetically and metallically sealed to the base member, the base member and cover together forming an enclosure. Spaced metallic support members are located within the enclosure and a plurality of integrated circuit units are stacked, in sandwich fashion, between the support members. The integrated circuit units each include a metal plate extending between the support members and an integrated circuit chip mounted thereon in heat conductive relationship. The metal plate, the support members and the enclosure form a heat sink for the integrated circuit units and the enclosure provides a low cost hermetic seal for the entire assembly of integrated circuit units. Planar arrays of conductive elements may be utilized to interconnect the integrated circuit chip to the terminals of the integrated circuit units. Means, such as pin connectors penetrating through the enclosure and attached conductors, provide electrical access to the terminals of the integrated circuit units within the enclosure.
An electronic multichip module, which comprises, in combination: a metallic base member; a metallic cover hermetically sealed to said base member, said base member and said cover together forming an enclosure; at least one metallic support member within said enclosure and attached thereto; a plurality of integrated circuit units, each of said units comprising: a metal plate supported by said support member and in heat conductive relation with said support member; an integrated circuit chip mounted on said metal plate to permit heat transfer from said integrated circuit chip to said metal plate; an insulator on said metal plate; a plurality of electrically-conductive elements insulated from said metal plate by said insulator and having terminal portions extending beyond said insulator and metal plate, said conductive elements being electrically isolated from said metal plate by said insulator; and means for electrically connecting said conductive elements to said integrated circuit chip; means for electrically interconnecting said terminal portions of said conductive elements of said integrated circuit units; and electrically conductive means, extending through said enclosure and electrically isolated thereform, for permitting electrical connection of circuitry external of said enclosure to be made to said means for electrically interconnecting said terminal portions of said conductive elements of said integrated circuit units.
Claim 2
Dependent Claim
208 words
An electronic multichip module, which comprises, in combination: a metallic base member; a metallic cover hermetically sealed to said base member, said base member and said cover together forming an enclosure; at least one metallic support member within said enclosure and attached thereto; a plurality of integrated circuit units, each of said units comprising: a metal plate supported by said support member and in heat conductive relation with said support member; an integrated circuit chip mounted on said metal plate to permit heat transfer from said integrated circuit chip to said metal plate; an insulator on said metal plate; a plurality of electrically-conductive elements insulated from said metal plate by said insulator and having terminal portions extending beyond said insulator and metal plate, said conductive elements being electrically isolated from said metal plate by said insulator; and means for electrically connecting said conductive elements to said integrated circuit chip; means for electrically interconnecting said terminal portions of said conductive elements of said integrated circuit units; and electrically conductive means, extending through said enclosure and electrically isolated thereform, for permitting electrical connection of circuitry external of said enclosure to be made to said means for electrically interconnecting said terminal portions of said conductive elements of said integrated circuit units.
Claim 3
Dependent Claim
42 words
An electronic multichip module according to claim 1 wherein said plurality of electrically conductive elements comprises two planar lead sets insulated from each other, conductors of one lead set being connected to conductors of the other lead set at selected crossing points.
Claim 4
Dependent Claim
23 words
An electronic multichip module according to claim 2 wherein said planar interconnected lead sets are embedded in said insulator on said metal plate.
Claim 5
Dependent Claim
48 words
An electronic multichip module according to claim 1 wherein said integrated circuit units are stacked in sandwich fashion whereby said terminals thereof extending beyond said insulators and base plates and intended to have identical signals or supply voltages are arranged adjacent to each other in a straight line.