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US3909678A Expired / Lapsed US ⏱️ 0.0 years remaining

Packaging structure for a plurality of wafer type integrated circuit elements

Assignee: STREETER MANUFACTURING Corp
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Filing: 1974-04-19
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Granted: 1975-09-30
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Expires: 1994-04-19
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Abstract

Abstract An electronic assembly for large wafer circuit elements. The assembly includes a plurality of wafers, each mounted on a wafer support element by means of conductive spring-like members. The support elements are held in a plane parallel silo-like stacked relationship by means of conductive rods which provide a means for connection to the wafers. The ''''silo'''' is mounted within a liquid light housing containing a coolant material. The mounting accommodates temperature induced expansion and contraction of the silo.

Inventors

  • 👤 Alfred A Rifkin
  • 👤 Robert Wallace Staats

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 15:21
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/20218; H05K7/20236; H10; H10W; H10W40/00; H10W40/30

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 159 words
An electronic wafer type assembly comprising: a plurality of wafer type circuit elements having pad portions adapted for electrical connection purposes, a corresponding plurality of annular wafer support elements disposed parallel and adjacent to said circuit elements, a plurality of electrical connection pads on each of said wafer support elements, a plurality of conductive, spring-like, support members affixed at one end to said pad portions on said circuit elements and at the other end to said pad portions on said wafer support elements to provide an electrical connection therebetween, mounting means comprising a plurality of conductive rod members for said wafer support elements holding said support elements in spaced parallel relationship to provide a silo-like assembly and each of said rod members engaging pads on said wafer support elements to establish electrical connections to said support elements, and a housing surrounding said support members and circuit elements and adapted to retain said circuit elements in a liquid coolant material.
Claim 2
Dependent Claim 159 words
An electronic wafer type assembly comprising: a plurality of wafer type circuit elements having pad portions adapted for electrical connection purposes, a corresponding plurality of annular wafer support elements disposed parallel and adjacent to said circuit elements, a plurality of electrical connection pads on each of said wafer support elements, a plurality of conductive, spring-like, support members affixed at one end to said pad portions on said circuit elements and at the other end to said pad portions on said wafer support elements to provide an electrical connection therebetween, mounting means comprising a plurality of conductive rod members for said wafer support elements holding said support elements in spaced parallel relationship to provide a silo-like assembly and each of said rod members engaging pads on said wafer support elements to establish electrical connections to said support elements, and a housing surrounding said support members and circuit elements and adapted to retain said circuit elements in a liquid coolant material.
Claim 3
Dependent Claim 102 words
An assembly according to claim 1 further including; means for rigidly fastening one end of said silo-like assembly to said housing, a cylindrical sleeve assembly extending inwardly from said housing in axial alignment with said silo-like assembly providing a telescoping confinement of the other end of said silo-like assembly by said sleeve, liquid tight connection means in the wall of said housing in proximity to said sleeve assembly, a plurality of flexible conductive elements connected at one end to said silo-like assembly and at the other end to said connection means, and means connecting said flexible conductive elements to said conductive rods.

References Cited (Backward Citations)

US3066367A Cited
US3210745A Cited
US3307087A Cited
US3418533A Cited
US3403300A Cited
US3798510A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1978-09-29 1979-03-31 1979-09-30 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1982-09-29 1983-03-31 1983-09-30 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1986-09-29 1987-03-31 1987-09-30 $7700.00 Window Closed / Lapsed

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