EP0461639A2
Expired / Lapsed
EP
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Plastic-molded-type semiconductor device
Assignee: Hitachi Ltd
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Filing: 1991-06-12
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Granted: —
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Expires: 2011-06-12
Abstract
Abstract A plastic-molded-type semiconductor device comprises two semiconductor chips (1a, 1b) having main surfaces on which electrodes and circuits are formed and which face each other; a lead frame (2) placed between these two semiconductor chips (1a, 1b) and electrically connected to their electrodes; a plastic package (6) formed by plastic-sealing the above components; and wiring patterns (4) provided on the main surfaces of the semiconductor chips (1a, 1b) through the intermediation of insulating films (3). The wiring patterns (4) are electrically connected to the electrodes of the semiconductor chips (1a, 1b) and to the lead frame (2). With this structure, it is possible for two large-sized semiconductor chips (1a, 1b) having electrodes in their middle sections to be encased in a single, relatively thin package (6).
Inventors
- 👤 Makoto Kitano
- 👤 Asao Nishimura
- 👤 Akihiro Yaguchi
- 👤 Ryuji Kohno
- 👤 Nae Yoneda
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 20:36
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W72/00; H10W72/50; H10W74/10; H10W74/111; H10W74/121; H10W74/131; H10W90/00; H10W90/811; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/381; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/851; H10W72/853; H10W72/865; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; H10W99/00
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
128 words
A plastic-molded-type semiconductor device comprising: two semiconductor chips (1a, 1b) having main surfaces on which electrodes (7) and circuits are formed and which are arranged to face each other; a lead frame (2) consisting of a set of leads and placed between said two semiconductor chips (1a, 1b); insulating films (3) which are provided on at least a part of the main surfaces of said semiconductor chips (1a, 1b) except for said electrodes (7) and on which metallic wiring patterns (4) are formed; said wiring patterns (4) being electrically connected to said electrodes (7) and said lead frame (2); and a plastic package (6) formed by plastic-sealing a part of said lead frame (2), said semiconductor chips (1a, 1b), said insulating films (3) and said wiring pattern (4).
Claim 2
Dependent Claim
68 words
The device of claim 1, wherein connecting portions (5) electrically connected said wiring pattern (4) to said semiconductor chips (1a, 1b) and those portions of the main surfaces of said semiconductor chips which are not covered with said insulating films (3) are at least partially sealed with a first resin (10a, 10b), and wherein said plastic package seals said first resin (10a, 10b) with a second resin (6).
Claim 3
Dependent Claim
22 words
The device of claim 1 or 2, wherein said electrodes (7) are electrically connected to said wiring patterns (4) through wires (5).
Claim 4
Dependent Claim
35 words
The device of claim 1 or 2, wherein certain metal portions (13) of said metallic wiring patterns (12) extend beyond said insulating films (3) and are electrically connected to said electrodes (7) by thermocompression bonding.
Claim 5
Independent Claim
24 words
The device of any of claims 1 to 4, wherein said wiring patterns (4) are electrically connected to said lead frame (2) by soldering.
Claim 6
Dependent Claim
21 words
The device of claim 5, wherein the melting point of the solder used in the soldering is not lower than 250°C.
Claim 7
Independent Claim
30 words
The device of any of claims 1 to 4, wherein said wiring patterns (4) are electrically connected to said lead frame (2) by means of an electrical conductive resin (9).
Claim 8
Independent Claim
45 words
The device of any of claims 1 to 7, wherein said semiconductor chips (1a, 1b) have a rectangular configuration, and wherein said electrodes (7) are arranged in the vicinity of at least one of the two center lines of the respective semiconductor chip (1a, 1b).
Claim 9
Independent Claim
18 words
The device of any of claims 1 to 8, wherein said semiconductor chips (1a, 1b) are memory LSIs.
Claim 10
Independent Claim
17 words
The device of any of claims 1 to 9, wherein said wiring patterns (12) are metallic foils.
References Cited (Backward Citations)
No citation records indexed.
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