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US3746934A
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Stack arrangement of semiconductor chips
Assignee: Siemens AG
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Filing: 1971-05-06
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Granted: 1973-07-17
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Expires: 1991-05-06
Abstract
Abstract A stack arrangement of at least two semiconductor bodies, preferably for arranging memory chips in which the individual semiconductor bodies are superimposed without casing and carrier plates. The edges of the semiconductor bodies have electrically conductive wires extending perpendicularly to the planes of the bodies.
Inventors
- 👤 K Stein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 05:01
CPC Classifications
H; H10; H10W; H10W90/00; H10W70/00; H10W70/60; H10W70/611; H10W90/401; H10W72/00; H10W72/60; H10W90/20; H10W90/297
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
112 words
A stock arrangement for semiconductor chips, comprising at least two semiconductor bodies superimposed on each other, at least two metallic bridges superimposed on each other, each metallic bridge having a thickened portion extending substantially perpendicularly to the planes of said semiconductor bodies and being disposed at the outer edges of said semiconductor bodies, said superimposed bridges being electrically and mechanically connected to one another at their thickened portions said metallic bridges each having tooth-like portions extending from said thickened portion generally parallel to said semiconductor bodies, each of said semiconductor bodies having contact surfaces making electrical and mechanical contact with the free end section of a corresponding one of said toothlike portions.
Claim 2
Dependent Claim
112 words
A stock arrangement for semiconductor chips, comprising at least two semiconductor bodies superimposed on each other, at least two metallic bridges superimposed on each other, each metallic bridge having a thickened portion extending substantially perpendicularly to the planes of said semiconductor bodies and being disposed at the outer edges of said semiconductor bodies, said superimposed bridges being electrically and mechanically connected to one another at their thickened portions said metallic bridges each having tooth-like portions extending from said thickened portion generally parallel to said semiconductor bodies, each of said semiconductor bodies having contact surfaces making electrical and mechanical contact with the free end section of a corresponding one of said toothlike portions.
Claim 3
Dependent Claim
17 words
A stack arrangement as claimed in claim 1, wherein each of the metallic bridges comprises two parts.
Claim 4
Dependent Claim
42 words
A stack arrangement according to claim 1 wherein said thickened portion of each said bridges has a thickness which is at least equal to the sum of the thicknesses of the free end section of said tooth-like portion and the semiconductor body.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-07-16 | 1977-01-15 | 1977-07-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-07-16 | 1981-01-15 | 1981-07-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-07-16 | 1985-01-15 | 1985-07-17 | $7700.00 | Window Closed / Lapsed |