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US5250840A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor lead frame with a chip having bonding pads in a cross arrangement

Assignee: Samsung Electronics Co Ltd
•
Filing: 1993-01-19
•
Granted: 1993-10-05
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Expires: 2013-01-19
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Abstract

Abstract A semiconductor lead frame is disclosed to improve the characteristics and reliability of a semiconductor device using lines of bonding pads in a cross-arrangement. The semiconductor lead frame comprises a rectangular semiconductor chip with a plurality of output terminals of associated circuits, a plurality of leads having inner and outer ends, bus bars extending around the inner ends of the leads, at least one insulator disposed between the semiconductor chip and the inner ends of the leads for electrically insulating the chip and the leads, metal wires electrically connecting the inner ends of the leads to selected and respective bonding pads and the bus bars to the pads in common. The leads are inclined relative to the lines of pads to form a line of outer terminals for the lead frame which extend over a distance exceeding the length of the chip. The semiconductor device can thereby accommodate a great number of bonding pads in response to the high density demand without increasing the size of the chip.

Inventors

  • 👤 Dong Y. Oh
  • 👤 Hyeon J. Jeong
  • 👤 Heung K. Kwon

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 11:24
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W90/00; H10W90/701; H10W90/751; H10W90/756

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 129 words
A semiconductor lead frame comprising a rectangular semiconductor chip having length and width dimensions, said chip including a plurality of bonding pads which enable external connection of circuits contained in said chip, said bonding pads being aranged in bands confined in central regions of said chip extending in the length and width directions of the chip at right angles to one another to form a cross-arrangement of said pads, a plurality of leads having inner and outer ends, a plurality of bus bars, insulator means for electrically insulating said chips and said leads, and a plurality of metal wires respectively electrically connecting said inner ends of said leads to selected ones of said bonding pads, and said bus bars, in common, to other selected ones of said bonding pads.
Claim 2
Dependent Claim 129 words
A semiconductor lead frame comprising a rectangular semiconductor chip having length and width dimensions, said chip including a plurality of bonding pads which enable external connection of circuits contained in said chip, said bonding pads being aranged in bands confined in central regions of said chip extending in the length and width directions of the chip at right angles to one another to form a cross-arrangement of said pads, a plurality of leads having inner and outer ends, a plurality of bus bars, insulator means for electrically insulating said chips and said leads, and a plurality of metal wires respectively electrically connecting said inner ends of said leads to selected ones of said bonding pads, and said bus bars, in common, to other selected ones of said bonding pads.
Claim 3
Dependent Claim 26 words
A semiconductor lead frame according to claim 1, wherein said leads extend at an angle of inclination relative to said bands at between 30° and 60°.
Claim 4
Dependent Claim 20 words
A semiconductor lead frame according to claim 1, wherein said bus bars are one of two and four in number.
Claim 5
Dependent Claim 18 words
A semiconductor lead frame according to claim 3, wherein said bus bars extend in proximity to said bands.
Claim 6
Dependent Claim 37 words
A semiconductor lead frame according to claim 1, wherein said bonding pads are arranged in a single line in each of said bands to form one row of pads and one column of pads on said chip.
Claim 7
Dependent Claim 30 words
A semiconductor lead frame according to claim 2, wherein said bands divide said chip into four adjoining quadrants, said leads extending at opposite angles of inclination in said adjoining quadrants.
Claim 8
Dependent Claim 40 words
A semiconductor lead frame according to claim 6, wherein said leads are inclined in said quadrants in directions so that said outer ends of the leads from terminals which extend over a length greater than the length of said chip.
Claim 9
Dependent Claim 31 words
A semiconductor lead frame according to claim 6, comprising separate leads connected to said bus bars and forming outlet terminals for the selected pads connected in common to the bus bars.

References Cited (Backward Citations)

JPH01205541A Cited
US5016082A Cited
JPH02246235A Cited
US4916519A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1996-10-04 1997-04-05 1997-10-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2000-10-04 2001-04-05 2001-10-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2004-10-04 2005-04-05 2005-10-05 $7700.00 Window Closed / Lapsed

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