US5729049A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Tape under frame for conventional-type IC package assembly
Assignee: Micron Technology Inc
•
Filing: 1996-03-19
•
Granted: 1998-03-17
•
Expires: 2016-03-19
Abstract
Abstract A semiconductor integrated circuit device, and method of manufacturing the same, having a conventional-type lead frame with the die paddle removed. In particular, the die paddle is replaced with a section of tape that is supported by the ends of the lead fingers. The semiconductor die is attached to the tape so that it may be wire bonded to the lead fingers. The tape contains at least one slot to allow for expansion and/or contraction of the tape due to various temperatures experienced during the manufacturing process so that the tape does not wrinkle or warp to alter the position of the die.
Inventors
- 👤 David J. Corisis
- 👤 Larry D. Kinsman
- 👤 Jerry M. Brooks
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:29
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/413; H10W70/421; H10W70/433; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 65
Claim 1
Independent Claim
106 words
A lead frame connected to a semiconductor device, the lead frame comprising: a lead frame including a plurality of lead fingers, the plurality of lead fingers each having a proximal end inwardly extending to define a semiconductor device opening in the lead frame, the lead frame having no die paddle for supporting said semiconductor device; and a section of tape having a periphery and a central portion, the section of tape attached to at least a portion of the proximate ends of the plurality of lead fingers of the lead frame, the section of tape having at least one slot therein extending across a portion thereof.
Claim 2
Dependent Claim
106 words
A lead frame connected to a semiconductor device, the lead frame comprising: a lead frame including a plurality of lead fingers, the plurality of lead fingers each having a proximal end inwardly extending to define a semiconductor device opening in the lead frame, the lead frame having no die paddle for supporting said semiconductor device; and a section of tape having a periphery and a central portion, the section of tape attached to at least a portion of the proximate ends of the plurality of lead fingers of the lead frame, the section of tape having at least one slot therein extending across a portion thereof.
Claim 3
Dependent Claim
16 words
The lead frame of claim 1, wherein said section of tape is substantially rectangular in shape.
Claim 4
Dependent Claim
25 words
The lead frame of claim 1, wherein the slot is positioned proximate a first portion of the proximal ends of the plurality of lead fingers.
Claim 5
Dependent Claim
26 words
The lead frame of claim 1, further comprising: a second slot positioned proximate a second portion of the proximal ends of the plurality of lead fingers.
Claim 6
Dependent Claim
20 words
The lead frame of claim 1, wherein said slot includes a slot substantially diagonally extending across the section of tape.
Claim 7
Dependent Claim
19 words
The lead frame of claim 1, wherein said slot comprises a slot extending transversely across the section of tape.
Claim 8
Dependent Claim
29 words
The lead frame of claim 1, wherein the slot includes a grid of slots in the section of tape in at least a portion of the semiconductor device opening.
Claim 9
Dependent Claim
20 words
The lead frame of claim 1, further including: a semiconductor device connected to and supported by the section of tape.
Claim 10
Dependent Claim
19 words
The lead frame of claim 8, wherein the semiconductor device extends over at least a portion of the slot.
Claim 11
Dependent Claim
35 words
The lead frame of claim 8, wherein the section of tape is substantially adhesively attached through the use of a thermosetting adhesive to portions of a the plurality of lead fingers and the semiconductor device.
Claim 12
Dependent Claim
20 words
The lead frame of claim 1, wherein the section of tape is formed of the group comprising plastic and polyamide.
Claim 13
Dependent Claim
18 words
The lead frame of claim 1, wherein the adhesive includes the group of epoxies, acrylics, silicones and polyamides.
Claim 14
Dependent Claim
28 words
The lead frame of claim 8, wherein the adhesive substantially bonding the semiconductor device to the section of tape includes the group of epoxies, acrylics, silicones and polyamides.
Claim 15
Dependent Claim
50 words
The lead frame of claim 1, further including: a semiconductor device connected to and supported by the section of tape by substantially bonding the semiconductor device to the tape through the use of an adhesive wherein the adhesive is heated to bond the semiconductor device to the section of tape.
Claim 16
Dependent Claim
36 words
The lead frame of claim 1, further including: a semiconductor device connected to and supported by the section of tape, the semiconductor connected to the section of tape using an adhesive including substantially an epoxy paste.
Claim 17
Dependent Claim
35 words
The lead frame of claim 1, further including: a semiconductor device connected to and supported by the section of tape, the semiconductor devices connected to the section of tape using an adhesive including substantially polyamide.
Claim 18
Dependent Claim
102 words
A lead frame for use with a semiconductor device, the lead frame comprising: a lead frame including a plurality of lead fingers, the plurality of lead fingers each having a proximal end inwardly extending to define an opening in the lead frame for said semiconductor device, the lead frame having no die paddle for the supporting of said semiconductor device; and a section of tape having a periphery, a central portion, and at least one slot formed therein, the section of tape attached to at least a portion of the proximate ends of the plurality of lead fingers of the lead frame.
Claim 19
Dependent Claim
102 words
A lead frame for use with a semiconductor device, the lead frame comprising: a lead frame including a plurality of lead fingers, the plurality of lead fingers each having a proximal end inwardly extending to define an opening in the lead frame for said semiconductor device, the lead frame having no die paddle for the supporting of said semiconductor device; and a section of tape having a periphery, a central portion, and at least one slot formed therein, the section of tape attached to at least a portion of the proximate ends of the plurality of lead fingers of the lead frame.
Claim 20
Dependent Claim
16 words
The lead frame of claim 17, wherein said section of tape is substantially rectangular in shape.
Claim 21
Dependent Claim
22 words
The lead frame of claim 18, further including at least one slot transversely extending across a portion of said section of tape.
Claim 22
Dependent Claim
46 words
The lead frame of claim 19, wherein a first slot is positioned proximate a first portion of the proximal ends of the plurality of lead fingers and a second slot is positioned proximate a second portion of the proximal ends of the plurality of lead fingers.
Claim 23
Dependent Claim
20 words
The lead frame of claim 18, wherein said at least one slot extends substantially diagonally across the section of tape.
Claim 24
Dependent Claim
20 words
The lead frame of claim 18, wherein said at least one slot extends substantially transversely across the section of tape.
Claim 25
Dependent Claim
32 words
The lead frame of claim 18, wherein the at least one slot includes a grid of slots in the section of tape in at least a portion of the semiconductor device opening.
Claim 26
Dependent Claim
20 words
The lead frame of claim 17, further including a semiconductor device connected to and supported by the section of tape.
Claim 27
Dependent Claim
22 words
The lead frame of claim 24, wherein the semiconductor device extends over at least a portion of the at least one slot.
Claim 28
Dependent Claim
26 words
The lead frame of claim 25, wherein the section of tape is adhesively attached to at least a portion of a the plurality of lead fingers.
Claim 29
Dependent Claim
20 words
The lead frame of claim 17, wherein the section of tape is formed of the group comprising plastic and polyamide.
Claim 30
Dependent Claim
21 words
The lead frame of claim 27, wherein the section of tape can withstand temperatures of substantially at least 250 degrees Centigrade.
Claim 31
Dependent Claim
28 words
The lead frame of claim 17, wherein the section of tape covers substantially at least 0.005 inches of the proximal ends of a portion of the lead fingers.
Claim 32
Dependent Claim
100 words
An assembly of a semiconductor integrated circuit device and a lead frame, said assembly comprising: a conventional-type lead frame including a periphery, central portion, a center axis and a plurality of lead fingers, the plurality of lead fingers each having a proximal end inwardly extending to define a semiconductor integrated circuit device opening in the conventional-type lead frame; and a section of tape having a periphery and a central portion, the section of tape attached to at least a portion of the proximate ends of the plurality of lead fingers, the section of tape having at least two slots therein.
Claim 33
Dependent Claim
100 words
An assembly of a semiconductor integrated circuit device and a lead frame, said assembly comprising: a conventional-type lead frame including a periphery, central portion, a center axis and a plurality of lead fingers, the plurality of lead fingers each having a proximal end inwardly extending to define a semiconductor integrated circuit device opening in the conventional-type lead frame; and a section of tape having a periphery and a central portion, the section of tape attached to at least a portion of the proximate ends of the plurality of lead fingers, the section of tape having at least two slots therein.
Claim 34
Dependent Claim
15 words
The assembly of claim 30, wherein the section of tape is substantially rectangular in shape.
Claim 35
Dependent Claim
20 words
The assembly of claim 30, wherein at least two slots extend transversely across a portion of the section of tape.
Claim 36
Dependent Claim
21 words
The assembly of claim 30, wherein at least two slots extend longitudinally extending across a portion of the section of tape.
Claim 37
Dependent Claim
45 words
The assembly of claim 30, wherein a first slot is positioned proximate a first portion of the proximal ends of the plurality of lead fingers and a second slot is positioned proximate a second portion of the proximal ends of the plurality of lead fingers.
Claim 38
Dependent Claim
19 words
The assembly of claim 30, wherein at least one slot extends substantially diagonally extends across the section of tape.
Claim 39
Dependent Claim
18 words
The assembly of claim 30, wherein at least one slot extends substantially transversely of the section of tape.
Claim 40
Dependent Claim
19 words
The assembly of claim 30, further including a semiconductor device attached to and supported by the section of tape.
Claim 41
Dependent Claim
22 words
The assembly of claim 36, wherein the integrated semiconductor device extends over at least a portion of the at least one slot.
Claim 42
Dependent Claim
20 words
The assembly of claim 30, wherein the section of tape is adhesively substantially attached to said plurality of lead fingers.
Claim 43
Dependent Claim
19 words
The assembly of claim 30, wherein the section of tape is formed of the group comprising plastic and polyamide.
Claim 44
Dependent Claim
20 words
The assembly of claim 30, wherein the section of tape can withstand temperatures of substantially at least 250 degrees Centigrade.
Claim 45
Dependent Claim
26 words
The assembly of claim 30, wherein the section of tape covers at least 0.005 inches of the proximal ends of a portion of the lead fingers.
Claim 46
Dependent Claim
97 words
An assembly of a semiconductor integrated circuit device and a lead frame, said assembly comprising: a conventional-type lead frame including a periphery, central portion, a center axis and a plurality of lead fingers, the plurality of lead fingers each having an end inwardly extending to define a semiconductor integrated circuit device opening in the conventional-type lead frame; and a section of tape having at least one slot formed therethrough, the section of tape attached proximate the periphery of the section of tape to at least a portion of the plurality of lead fingers at the ends thereof.
Claim 47
Dependent Claim
97 words
An assembly of a semiconductor integrated circuit device and a lead frame, said assembly comprising: a conventional-type lead frame including a periphery, central portion, a center axis and a plurality of lead fingers, the plurality of lead fingers each having an end inwardly extending to define a semiconductor integrated circuit device opening in the conventional-type lead frame; and a section of tape having at least one slot formed therethrough, the section of tape attached proximate the periphery of the section of tape to at least a portion of the plurality of lead fingers at the ends thereof.
Claim 48
Dependent Claim
15 words
The assembly of claim 43, wherein the section of tape is substantially rectangular in shape.
Claim 49
Dependent Claim
21 words
The assembly of claim 43, further including at least two slots transversely extending across a portion of the section of tape.
Claim 50
Dependent Claim
21 words
The assembly of claim 43, further including at least two slots longitudinally extending across a portion of the section of tape.
Claim 51
Dependent Claim
43 words
The assembly of claim 45, wherein a first slot is positioned proximate a first portion of the ends of the plurality of lead fingers and a second slot is positioned proximate a second portion of the ends of the plurality of lead fingers.
Claim 52
Dependent Claim
19 words
The assembly of claim 43, wherein the at least one slot substantially diagonally extends across the section of tape.
Claim 53
Dependent Claim
19 words
The assembly of claim 43, wherein the at least one slot extending substantially transversely of the section of tape.
Claim 54
Dependent Claim
33 words
The assembly of claim 43, wherein the at least one slot substantially forms a grid of slots in the section of tape in at least a portion of the integrated semiconductor device opening.
Claim 55
Dependent Claim
19 words
The assembly of claim 43, further including a semiconductor device attached to and supported by the section of tape.
Claim 56
Dependent Claim
23 words
The assembly of claim 51, wherein the integrated semiconductor device substantially extends over at least a portion of the at least one slot.
Claim 57
Dependent Claim
25 words
The assembly of claim 43, wherein the section of tape is adhesively attached to said at least a portion of the plurality of lead fingers.
Claim 58
Dependent Claim
19 words
The assembly of claim 43, wherein the section of tape is formed of the group comprising plastic and polyamide.
Claim 59
Dependent Claim
20 words
The assembly of claim 43, wherein the section of tape can withstand temperatures of substantially at least 250 degrees Centigrade.
Claim 60
Dependent Claim
26 words
The assembly of claim 43, wherein the section of tape substantially covers at least 0.005 inches of the ends of a portion of the lead fingers.
Claim 61
Dependent Claim
101 words
An assembly of a semiconductor integrated circuit device and a lead frame, said assembly comprising: a paddleless, conventional-type lead frame including a plurality of lead fingers and having an opening therein; and a plurality of tape segments, each tape segment of the plurality of tape segments having a periphery, each tape segment of the plurality of tape segments attached to a portion of the plurality of lead fingers, the plurality of tape segments being spaced apart to define an opening between the plurality of tape segments, wherein at least one of the plurality of tape segments has an aperture formed therein.
Claim 62
Dependent Claim
101 words
An assembly of a semiconductor integrated circuit device and a lead frame, said assembly comprising: a paddleless, conventional-type lead frame including a plurality of lead fingers and having an opening therein; and a plurality of tape segments, each tape segment of the plurality of tape segments having a periphery, each tape segment of the plurality of tape segments attached to a portion of the plurality of lead fingers, the plurality of tape segments being spaced apart to define an opening between the plurality of tape segments, wherein at least one of the plurality of tape segments has an aperture formed therein.
Claim 63
Dependent Claim
18 words
The assembly of claim 57, wherein each of the plurality of tape segments has an aperture formed therein.
Claim 64
Dependent Claim
17 words
The assembly of claim 57, wherein the plurality of tape segments includes at least two tape segments.
Claim 65
Dependent Claim
20 words
The assembly of claim 59, wherein the at least two tape segments are spaced apart to form a slit thereinbetween.
References Cited (Backward Citations)
JPS60105658A
Cited
US4089733A
Cited
US4033844A
Cited
US4279682A
Cited
US4862245A
Cited
US4891687A
Cited
US4835120A
Cited
US4894752A
Cited
JPH02156547A
Cited
JPH0335589A
Cited
US5227662A
Cited
JPH0435057A
Cited
JPH04150061A
Cited
US5140404A
Cited
US5304842A
Cited
US5177032A
Cited
US5142450A
Cited
US5231755A
Cited
US5218229A
Cited
US5252853A
Cited
US5352633A
Cited
US5331200A
Cited
US5536969A
Cited
JPH06216302A
Cited
US5471369A
Cited
US5475918A
Cited
JP3035589U
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-16 | 2001-09-15 | 2002-03-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-16 | 2005-09-15 | 2006-03-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-16 | 2009-09-15 | 2010-03-17 | $7700.00 | Window Closed / Lapsed |