Patent US3440521A successfully refreshed from Google Patents.
Patent US2078763A successfully refreshed from Google Patents.
US4089733A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming complex shaped metal-plastic composite lead frames for IC packaging
Assignee: TE Connectivity Corp
•
Filing: 1977-02-25
•
Granted: 1978-05-16
•
Expires: 1997-02-25
Abstract
Abstract A method is disclosed for forming complex shaped, metal-plastic composite lead frame structures for integrated circuit packaging. The lead frame pattern is formed on a metallic substrate having a profiled plastic member bonded thereto at such location as to hold the complexed shaped metal lead portions in a fixed spaced arrangement. The subject method results in substantial economies in reduced usage of plastics material and yet a high grade product having reliably positioned leads.
Inventors
- 👤 Richard Henry Zimmerman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 21:47
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/047; H10W70/40; H10W70/421; H10W70/435; H10W70/479; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H05K3/061; H05K3/064; H05K3/40; H05K3/4092; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
160 words
A method of producing a metal-plastic composite lead frame device for integrated circuit packaging, said lead frame device having a plurality of cantilever metal leads held in fixed alignment near their free ends by a member of plastics material, comprising the steps of: perforating a continuous web of metallic foil with a plurality accurately spaced registration apertures along at least one marginal edge thereof; depositing on a first side of said foil a pattern of thin, electrically insulating plastic material accurately aligned with respect to said apertures, said pattern having lesser overall dimensions than said web; coating the opposite side of said foil with a photo resist material; imaging a lead frame pattern on said photo resist at accurately aligned positions with respect to said apertures; developing said imaged lead frame pattern; and passing said strip through an etching bath whereby said strip will be etched away leaving only a lead frame with the leads supported by said plastics material.
Claim 2
Independent Claim
160 words
A method of producing a metal-plastic composite lead frame device for integrated circuit packaging, said lead frame device having a plurality of cantilever metal leads held in fixed alignment near their free ends by a member of plastics material, comprising the steps of: perforating a continuous web of metallic foil with a plurality accurately spaced registration apertures along at least one marginal edge thereof; depositing on a first side of said foil a pattern of thin, electrically insulating plastic material accurately aligned with respect to said apertures, said pattern having lesser overall dimensions than said web; coating the opposite side of said foil with a photo resist material; imaging a lead frame pattern on said photo resist at accurately aligned positions with respect to said apertures; developing said imaged lead frame pattern; and passing said strip through an etching bath whereby said strip will be etched away leaving only a lead frame with the leads supported by said plastics material.
Claim 3
Dependent Claim
32 words
A method according to claim 1 wherein said pattern of electrically insulating plastic material is printed on said metal foil and has a thickness in the range of 1 to 3 mils.
Claim 4
Dependent Claim
34 words
A method according to claim 1 wherein said pattern of electrically insulating plastic material is preformed and bonded to said metal foil and has a thickness in the range of 2 to 6 mils.
Claim 5
Dependent Claim
21 words
A method according to claim 1 wherein said plastic material is selected from the group including polyimides, photosensitive polymers and epoxes.
Claim 6
Dependent Claim
23 words
A method according to claim 1 wherein said metallic foil is copper having a thickness in the range of 0.7 to 2.8 mils.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-05-15 | 1981-11-14 | 1982-05-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-05-15 | 1985-11-14 | 1986-05-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-05-15 | 1989-11-14 | 1990-05-16 | $7700.00 | Window Closed / Lapsed |