Multi-layer molded plastic IC package

Claim 2

A plastic package for a high lead count integrated circuit, comprising: an opaque plastic encapsulating molded shell; an integrated circuit carrier encapsulated within said molded shell; a substantially planar leadframe comprised of a plurality of leads; said plurality of leads, which includes a power lead and a power return lead, extending into said molded shell and coupled to said carrier; said carrier comprising: (a) a first conducting plate, wherein said integrated circuit is disposed on and supported by said first plate; (b) a second conducting plate overlaying said first conducting plate and disposed about said integrated circuit; (c) a first insulator adhesive tape disposed between and bonded to said first and second conducting plates; (d) a second insulator adhesive tape disposed between and bonded to said second plate and said plurality of leads; (e) wherein power terminals of said integrated circuit and said power lead are electrically coupled to one of said conducting plates, and wherein power return terminals of said integrated circuit and said power return lead are electrically coupled to the other of said conducting plates.

Claim 3

The plastic package defined in claim 1, wherein said plates are comprised of copper.

Claim 4

The plastic package defined in claim 2, wherein said power terminals of said integrated circuit are coupled to said first plate and said ground terminals are coupled to said second plate.

Claim 5

The plastic package defined in claim 3, wherein said first and second plates further include angular extensions extending beyond the outer boundary of said insulators disposed on its outer edge for coupling said plates to various predetermined power and ground leads.

Claim 6

The plastic package defined in claim 4, wherein other terminals of said integrated circuit are selectively coupled directly to lead tips of various predetermined corresponding leads.

Claim 7

The plastic package defined in claim 5, wherein said carrier is substantially flat.

Claim 8

The plastic package defined in claim 6, wherein said carrier is rectangular in shape to hold a substantially rectangular-shaped integrated circuit.

Claim 9

The plastic package defined in claim 3, wherein a capacitor device is coupled between said first plate and said second plate for decoupling process.

Claim 10

A carrier for a high lead semiconductor device having a plurality of terminals, consisting of: an assembly consisting of: (a) a substantially planar leadframe comprised of a plurality of leads including power and ground leads and a substantially rectangular first center opening to accommodate said device; (b) a substantially planar first conducting plate having a substantially rectangular second center opening accommodating said device and correspondingly similar in dimensions to said first opening in said leadframe; (c) a first insulator tape having a substantially rectangular third center opening disposed on the upper surface of said first conducting plate bonding said upper surface of said first conducting plate to the bottom surface of said leadframe; (d) a substantially planar second conducting plate; (e) a second insulator tape disposed on the upper surface of said second conducting plate bonding said upper surface of second conducting plate to the bottom surface of said first conducting plate; (f) said device bonded to the upper surface of said second conducting plate such that said first, second and third center openings are aligned and the corresponding said leadframe, said first conducting plate and said first insulator tape of said first, second and third center openings are disposed on top of said second insulator tape and surround said device; (g) said device having a first terminal of said plurality of terminals coupled to said first conducting plate and having a second terminal of said plurality of terminals coupled to said second conducting plate; (h) said device having the remaining terminals of said plurality of terminals electrically coupled to one end of the corresponding plurality of leads of said leadframe; a molded plastic shell encapsulating said assembly such that the other end of said plurality of leads of said leadframe not coupled to remaining terminals of said plurality of terminals extends external to said plastic shell.

Claim 11

A carrier for a high lead semiconductor device having a plurality of terminals, consisting of: an assembly consisting of: (a) a substantially planar leadframe comprised of a plurality of leads including power and ground leads and a substantially rectangular first center opening to accommodate said device; (b) a substantially planar first conducting plate having a substantially rectangular second center opening accommodating said device and correspondingly similar in dimensions to said first opening in said leadframe; (c) a first insulator tape having a substantially rectangular third center opening disposed on the upper surface of said first conducting plate bonding said upper surface of said first conducting plate to the bottom surface of said leadframe; (d) a substantially planar second conducting plate; (e) a second insulator tape disposed on the upper surface of said second conducting plate bonding said upper surface of second conducting plate to the bottom surface of said first conducting plate; (f) said device bonded to the upper surface of said second conducting plate such that said first, second and third center openings are aligned and the corresponding said leadframe, said first conducting plate and said first insulator tape of said first, second and third center openings are disposed on top of said second insulator tape and surround said device; (g) said device having a first terminal of said plurality of terminals coupled to said first conducting plate and having a second terminal of said plurality of terminals coupled to said second conducting plate; (h) said device having the remaining terminals of said plurality of terminals electrically coupled to one end of the corresponding plurality of leads of said leadframe; a molded plastic shell encapsulating said assembly such that the other end of said plurality of leads of said leadframe not coupled to remaining terminals of said plurality of terminals extends external to said plastic shell.

Claim 12

The carrier defined in claim 9, wherein said plates and said leadframe are comprised of copper.