Transistor package

Claim 2

In a radio frequency transistor package, a transistor die having base, emitter and collector electrode structures thereon for making connection to respective underlying semiconductive regions of said transistor die, input, output and common conductive lead means for making electrical connection to said transistor die, said common lead means including a pair of terminal strip portions disposed on opposite sides of said transistor die means, an array of generally parallel input connector wires interconnecting said input lead and one of said emitter and base electrode structures, an array of generally parallel common connector wires interconnecting both of said terminal strip portions of said common lead means and the other one of said emitter and base electrode structures, an electrically insulative ceramic substrate structure, said input lead means including a conductive sheet disposed upon and interfacing with a first face of said ceramic substrate structure, said output lead means including a conductive sheet disposed upon and interfacing with said same first face of said same ceramic substrate structure, said transistor die being disposed overlaying a portion of said output lead with said collector electrode structure thereof disposed facing said output lead in mutually opposed relation therewith, said common lead means including a portion underlying said ceramic substrate structure, and wherein said array of common connEctor wires is connected to said underlying common lead means through openings in said ceramic substrate structure on opposite sides of said transistor die.

Claim 3

The apparatus of claim 1 wherein a substantial portion of said array of common connector wires are generally parallel to and interdigitated with said array of input connector wires.

Claim 4

The apparatus of claim 1 wherein said pair of terminal strip portions of said common lead project from said underlying common lead into respective openings in said ceramic substrate structure on opposite sides of said die to facilitate connection of said common connector wires to said terminal strip portions of said common lead.

Claim 5

The apparatus of claim 1 wherein said openings in said ceramic substrate structure are slots, a first one of said slots in said ceramic substrate being disposed between mutually opposed inner ends of said conductive sheet portions of said input and output leads, said conductive sheet portion of said output lead having a slot therein, and the second one of said slots in said ceramic substrate being disposed in registration with and underlying said slot in said output lead.

Claim 6

In a radio frequency transistor package, a transistor die having base, emitter and collector electrode structures thereon for making connection to respective underlying semiconductive regions of said transistor die, input, output and common conductive lead means for making electrical connection to said transistor die, said common lead means including a pair of terminal strip portions disposed on opposite sides of said transistor die means, an array of generally parallel input connector wires interconnecting said input lead and one of said emitter and base electrode structures, an array of generally parallel common connector wires interconnecting both of said terminal strip portions of said common lead means and the other one of said emitter and base electrode structure, an electrically insulative ceramic substrate structure, said input lead means including a conductive sheet disposed upon and interfacing with a first face of said ceramic substrate structure, said output lead means including a conductive sheet disposed upon and interfacing with said same first face of said ceramic substrate structure, said transistor die being disposed overlaying a portion of said output lead with said collector electrode structure thereof disposed facing said output lead in mutually opposed relation therewith, a first one of said pair of terminal strip portions of said common lead comprising a conductive strip disposed upon and interfacing with said first face of said ceramic substrate which is common to said input lead and output lead, said first terminal strip portion of said common lead being disposed between mutually opposed inner ends of said input and output leads, and wherein a second one of said pair of terminal strip portions of said common lead comprises a conductive bridge passing over said output lead in electrically insulative relation therewith.

Claim 7

In a radio frequency transistor package, a transistor die having base, emitter and collector electrode structures thereon for making connection to respective underlying semiconductive regions of said transistor die, input, output and common conductive lead means for making electrical connection to said transistor die, said common lead means including a pair of terminal strip portions disposed on opposite sides of said transistor die means, an array of generally parallel input connector wires interconnecting said input lead and one of said emitter and base electrode structures, an array of generally parallel common connector wires interconnecting both of said terminal strip portions of said common lead means and the other one of said emitter and base electrode structure, an electrically insulative ceramic substrate structure, said input lead means including a conductive sheet disposed upon and interfacing with a first face of said ceramic substrate structure, said output lead means including a conductive sheet disposed upon and interfacing with said same first face of said ceramic substrate structure, said transistor die being disposed overlaying a portion of said output lead with said collector electrode structure thereof disposed facing said output lead in mutually opposed relation therewith, a first one of said pair of terminal strip portions of said common lead comprising a conductive strip disposed upon and interfacing with said first face of said ceramic substrate which is common to said input lead and output lead, said first terminal strip portion of said common lead being disposed between mutually opposed inner ends of said input and output leads, and wherein a second one of said pair of terminal strip portions of said common lead comprises a conductive bridge passing over said output lead in electrically insulative relation therewith.

Claim 8

The apparatus of claim 5 wherein a substantial portion of said array of common connector wires are generally parallel to and interdigitated with said array of input connector wires.