US5218229A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Inset die lead frame configuration lead frame for a semiconductor device having means for improved busing and die-lead frame attachment
Assignee: Micron Technology Inc
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Filing: 1991-08-30
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Granted: 1993-06-08
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Expires: 2011-08-30
Abstract
Abstract A lead frame design having a ring which encircles the die is described which provides a bus to the semiconductor die attached thereto. The bus would be most commonly used for power or ground, although other embodiments are possible. It is known that large buses designed around the periphery of a semiconductor die can cause the corners of the die to crack, causing a variety of problems including in-circuit failures, as well as using die surface area. The invention removes the need for having a large bus on the chip and places it as an element of the lead frame. A first inventive embodiment employs tape to secure the die to the lead frame, while in a second embodiment attachment of the die to the lead frame is accomplished with no glue, tape, or eutectic means, and instead uses friction between the die and flexible support pins which extend from the ring encircling the die.
Inventors
- 👤 Warren M. Farnworth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 15:22
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/411; H10W70/435; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
149 words
A semiconductor device having a lead frame for the passage of an electrical potential between a semiconductor die and a host into which the semiconductor device is installed, the die having first and second parallel major surfaces, and the lead frame comprising: a) first and second parallel major surfaces; b) lead fingers electrically coupled with said die; c) leads electrically coupled to said lead fingers, said leads allowing for electrical coupling with the host into which the semiconductor device is installed; d) a lead frame portion having a void therein for receiving the die such that said first major surface of said die is positioned inferiorly to said first major surface of said lead frame and said second major surface of said die is positioned superiorly to said second major surface of said lead frame wherein said lead frame portion is interposed between said die and said lead fingers.
Claim 2
Dependent Claim
149 words
A semiconductor device having a lead frame for the passage of an electrical potential between a semiconductor die and a host into which the semiconductor device is installed, the die having first and second parallel major surfaces, and the lead frame comprising: a) first and second parallel major surfaces; b) lead fingers electrically coupled with said die; c) leads electrically coupled to said lead fingers, said leads allowing for electrical coupling with the host into which the semiconductor device is installed; d) a lead frame portion having a void therein for receiving the die such that said first major surface of said die is positioned inferiorly to said first major surface of said lead frame and said second major surface of said die is positioned superiorly to said second major surface of said lead frame wherein said lead frame portion is interposed between said die and said lead fingers.
Claim 3
Dependent Claim
35 words
The semiconductor device of claim 1 wherein said die is attached to said lead frame by tape which contacts said first major surface of said die and said second major surface of said lead frame.
Claim 4
Dependent Claim
41 words
The semiconductor device of claim 2 wherein said tape comprises a plastic sheet coated on one side by a layer of thermoplastic, said thermoplastic contacting said first major surface of said die and said second major surface of said lead frame.
Claim 5
Dependent Claim
39 words
The semiconductor device of claim 1 wherein said die is attached to said lead frame by a plurality of support pins protruding from said lead frame portion having said void, said support pins applying lateral pressure to said die.
Claim 6
Dependent Claim
23 words
The semiconductor device of claim 1 wherein said die comprises bond pads which are electrically coupled to said lead fingers by bond wires.
Claim 7
Dependent Claim
34 words
The semiconductor device of claim 1 wherein said lead frame portion having said void is electrically coupled to one of said leads, and wherein said die is electrically coupled to said lead frame portion.
Claim 8
Dependent Claim
31 words
The semiconductor device of claim 1 wherein said lead frame portion having said void comprises a first segment which is electrically isolated from a second segment of said lead frame portion.
Claim 9
Dependent Claim
55 words
The semiconductor device of claim 6 wherein said lead frame portion having said void comprises a first segment which is electrically isolated from a second segment of said lead frame portion, and wherein said first and second segments are electrically coupled to a different lead, and wherein said die is electrically coupled to said segments.
Claim 10
Dependent Claim
145 words
A lead frame for the passage of an electrical potential between a semiconductor die and a host into which the semiconductor device is installed, the die having first and second parallel major surfaces, and the lead frame comprising: a) first and second parallel major surfaces; b) lead fingers electrically coupled with said die; c) leads electrically coupled to said lead fingers, said leads allowing for electrical coupling with the host into which the semiconductor device is installed; d) a lead frame portion having a void therein for receiving the die such that said first major surface of said die is positioned inferiorly to said first major surface of said lead frame and said second major surface of said die is positioned superiorly to said second major surface of said lead frame wherein said lead frame portion is interposed between said die and said lead fingers.
Claim 11
Dependent Claim
145 words
A lead frame for the passage of an electrical potential between a semiconductor die and a host into which the semiconductor device is installed, the die having first and second parallel major surfaces, and the lead frame comprising: a) first and second parallel major surfaces; b) lead fingers electrically coupled with said die; c) leads electrically coupled to said lead fingers, said leads allowing for electrical coupling with the host into which the semiconductor device is installed; d) a lead frame portion having a void therein for receiving the die such that said first major surface of said die is positioned inferiorly to said first major surface of said lead frame and said second major surface of said die is positioned superiorly to said second major surface of said lead frame wherein said lead frame portion is interposed between said die and said lead fingers.
Claim 12
Dependent Claim
35 words
The lead frame of claim 9 wherein said die is attached to said lead frame by tape which contacts said first major surface of said die and said second major surface of said lead frame.
Claim 13
Dependent Claim
41 words
The lead frame of claim 10 wherein said tape comprises a plastic sheet coated on one side by a layer of thermoplastic, said thermoplastic contacting said first major surface of said die and said second major surface of said lead frame.
Claim 14
Dependent Claim
39 words
The lead frame of claim 9 wherein said die is attached to said lead frame by a plurality of support pins protruding from said lead frame portion having said void, said support pins applying lateral pressure to said die.
Claim 15
Dependent Claim
23 words
The lead frame of claim 9 wherein said die comprises bond pads which are electrically coupled to said lead fingers by bond wires.
Claim 16
Dependent Claim
34 words
The lead frame of claim 9 wherein said lead frame portion having said void is electrically coupled to one of said leads, and wherein said die is electrically coupled to said lead frame portion.
Claim 17
Dependent Claim
31 words
The lead frame of claim 9 wherein said lead frame portion having said void comprises a first segment which is electrically isolated from a second segment of said lead frame portion.
Claim 18
Dependent Claim
55 words
The lead frame of claim 14 wherein said lead frame portion having said void comprises a first segment which is electrically isolated from a second segment of said lead frame portion, and wherein said first and second segments are electrically coupled to a different lead, and wherein said die is electrically coupled to said segments.
Claim 19
Dependent Claim
166 words
A lead frame for the passage of an electrical potential between a semiconductor die and a host into which the semiconductor die is installed, the die having first and second parallel major surfaces, the lead frame comprising: a) first and second parallel major surfaces; b) lead fingers electrically coupled with said die; c) leads electrically coupled to said lead fingers, said leads allowing for electrical coupling with the host into which the semiconductor device is installed; d) a lead frame portion having a void therein for receiving the die, the lead frame having a ring which encircles the die thereby providing a bus to the die when the die is attached to the lead frame, said first major surface of said die being positioned inferiorly to said first major surface of said lead frame and said second major surface of said die being positioned superiorly to said second major surface of said lead frame wherein said ring is interposed between said die and said lead fingers.
Claim 20
Dependent Claim
166 words
A lead frame for the passage of an electrical potential between a semiconductor die and a host into which the semiconductor die is installed, the die having first and second parallel major surfaces, the lead frame comprising: a) first and second parallel major surfaces; b) lead fingers electrically coupled with said die; c) leads electrically coupled to said lead fingers, said leads allowing for electrical coupling with the host into which the semiconductor device is installed; d) a lead frame portion having a void therein for receiving the die, the lead frame having a ring which encircles the die thereby providing a bus to the die when the die is attached to the lead frame, said first major surface of said die being positioned inferiorly to said first major surface of said lead frame and said second major surface of said die being positioned superiorly to said second major surface of said lead frame wherein said ring is interposed between said die and said lead fingers.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-06-07 | 1996-12-07 | 1997-06-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-06-07 | 2000-12-07 | 2001-06-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-06-07 | 2004-12-07 | 2005-06-08 | $7700.00 | Window Closed / Lapsed |