Method of making a multilayer molded plastic IC package

Claim 1

A method of encapsulated an integrated circuit in a plastic package comprising the steps of: preparing a leadframe having a plurality of leads disposed therein, said leadframe having a central opening for placement of said integrated circuit; cutting a first adhesive coated insulation tape to fit over said opening; bonding said first insulation tape to the bottom side of said leadframe to form a leadframe assembly; stamping a center opening in said tape; cutting a first plate; bonding said first plate to the bottom of said first tape such that said first tape is disposed between said first plate and said leadframe; cutting a second adhesive coated insulation tape; bonding said second insulation tape to the bottom of said first plate; stamping out a center opening in said second tape and said first plate; cutting a second plate; bonding said second plate to the bottom of said second insulation tape such that said second tape is disposed between the bottom of said first plate and the top of said second plate; bonding said integrated circuit to the top of said second plate; bonding wires to various terminal pads on said integrated circuit; terminating other end of said wires to various leads of said leadframe and to said first and second plates; coupling ground and power terminals of said integrated circuit to ground and power leads by said first and second plates; encapsulating in a plastic shell.

Claim 2

A method of encapsulated an integrated circuit in a plastic package comprising the steps of: preparing a leadframe having a plurality of leads disposed therein, said leadframe having a central opening for placement of said integrated circuit; cutting a first adhesive coated insulation tape to fit over said opening; bonding said first insulation tape to the bottom side of said leadframe to form a leadframe assembly; stamping a center opening in said tape; cutting a first plate; bonding said first plate to the bottom of said first tape such that said first tape is disposed between said first plate and said leadframe; cutting a second adhesive coated insulation tape; bonding said second insulation tape to the bottom of said first plate; stamping out a center opening in said second tape and said first plate; cutting a second plate; bonding said second plate to the bottom of said second insulation tape such that said second tape is disposed between the bottom of said first plate and the top of said second plate; bonding said integrated circuit to the top of said second plate; bonding wires to various terminal pads on said integrated circuit; terminating other end of said wires to various leads of said leadframe and to said first and second plates; coupling ground and power terminals of said integrated circuit to ground and power leads by said first and second plates; encapsulating in a plastic shell.

Claim 3

A method of encapsulating an integrated circuit die in a plastic package comprising the steps of: preparing a leadframe from a substantially planar metal sheet and having a plurality of leads disposed therein and held in position by an inner ring, said leadframe having a central opening for placement of said integrated circuit; silver-plating the upper surface of the tips of said plurality of leads; cutting a first adhesive coated insulation tape larger than said opening and extending to the outer edge of said inner ring; bonding said first insulation tape to the non-silvered side of said leadframe to form a leadframe assembly; stamping a center opening in said tape simultaneously removing said inner ring; cutting a first plate dimensionally similar to the external dimensions of said first installation tape and having a pair of angular extensions opposed from one another; bonding said first plate to the bottom of said first tape such that said first tape is disposed between said first plate and the non-silvered side of said leadframe; cutting a second adhesive coated insulation tape dimensionally similar to said first plate; bonding the upper surface of said second insulation tape to the bottom surface of said first plate; stamping out a center opening dimensionally similar to said integrated circuit die in said second tape and said first plate; cutting a second plate equivalent to said first plate; bonding the upper surface of said second plate to the bottom surface of said second insulation tape such that said second insulation tape is dispose between said the bottom surface of first plate and the upper surface of second plate; bonding said integrated circuit to the upper surface of said second plate; bonding wires to various terminal pads on said integrated circuit die; terminating other end of said wires to various corresponding leads of said leadframe and to said first and second plates; coupling ground and power terminals of said integrated circuit to ground and power leads by said angular extensions of said first and second plates; encapsulating said lead frame assembly, said first and second plates and said integrated circuit die in a molded plastic shell.

Claim 4

A method of encapsulating an integrated circuit die in a plastic package comprising the steps of: preparing a leadframe from a substantially planar metal sheet and having a plurality of leads disposed therein and held in position by an inner ring, said leadframe having a central opening for placement of said integrated circuit; silver-plating the upper surface of the tips of said plurality of leads; cutting a first adhesive coated insulation tape larger than said opening and extending to the outer edge of said inner ring; bonding said first insulation tape to the non-silvered side of said leadframe to form a leadframe assembly; stamping a center opening in said tape simultaneously removing said inner ring; cutting a first plate dimensionally similar to the external dimensions of said first installation tape and having a pair of angular extensions opposed from one another; bonding said first plate to the bottom of said first tape such that said first tape is disposed between said first plate and the non-silvered side of said leadframe; cutting a second adhesive coated insulation tape dimensionally similar to said first plate; bonding the upper surface of said second insulation tape to the bottom surface of said first plate; stamping out a center opening dimensionally similar to said integrated circuit die in said second tape and said first plate; cutting a second plate equivalent to said first plate; bonding the upper surface of said second plate to the bottom surface of said second insulation tape such that said second insulation tape is dispose between said the bottom surface of first plate and the upper surface of second plate; bonding said integrated circuit to the upper surface of said second plate; bonding wires to various terminal pads on said integrated circuit die; terminating other end of said wires to various corresponding leads of said leadframe and to said first and second plates; coupling ground and power terminals of said integrated circuit to ground and power leads by said angular extensions of said first and second plates; encapsulating said lead frame assembly, said first and second plates and said integrated circuit die in a molded plastic shell.