US6403398B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device, manufacturing method thereof and aggregate type semiconductor device
Assignee: Lapis Semiconductor Co Ltd
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Filing: 2000-12-12
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Granted: 2002-06-11
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Expires: 2020-12-12
Abstract
Abstract A resin sealing type semiconductor device, a manufacturing method thereof and a packaging structure thereof are capable of downsizing the semiconductor device and attaining high-density packaging. For this, the resin sealing type semiconductor device with leads exposed in an outer surface, is provided with spot leads adhered to a circuit forming surface of a semiconductor element with an insulating adhesive tape interposed therebetween, each independently regularly arrayed, and exposed to outside with the semiconductor element disposed inside.
Inventors
- 👤 Shinji Ohuchi
- 👤 Yasushi Shiraishi
- 👤 Hiroshi Kawano
- 👤 Etsuo Yamada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:02
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/90; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/01; H10W70/04; H10W70/048; H10W72/20; H10W74/00; H10W74/01; H10W74/10; H10W74/111; H10W74/129; H10W74/131; H10W74/141; H10W72/071; H10W72/072; H10W72/07251; H10W72/251; H10W72/29; H10W72/60; H10W72/641; H10W72/646; H10W72/681; H10W72/685; H10W74/142
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
62 words
A method of manufacturing a resin sealing type semiconductor device, comprising: a step (a) of fixedly adhering a support member in a lead frame, together with a plurality of spot leads in said lead frame, to one surface of an insulating adhesive tape; and a step (b) of separating said support member and said plurality of spot leads from said lead frame.
Claim 2
Independent Claim
62 words
A method of manufacturing a resin sealing type semiconductor device, comprising: a step (a) of fixedly adhering a support member in a lead frame, together with a plurality of spot leads in said lead frame, to one surface of an insulating adhesive tape; and a step (b) of separating said support member and said plurality of spot leads from said lead frame.
Claim 3
Dependent Claim
42 words
A method of manufacturing a resin sealing type semiconductor device according to claim 1 , further comprising: a step (c) of adhering a semiconductor element to the other surface of said adhesive tape, and resin-sealing said semiconductor element with a mold resin.
Claim 4
Dependent Claim
45 words
A method of manufacturing a resin sealing type semiconductor device according to claim 1 , wherein each of the plurality of spot leads has a contact surface at each end, and step (a) is performed after metal plating the contact surfaces of the spot leads.
Claim 5
Independent Claim
91 words
A method of manufacturing a semiconductor device, comprising: a step (a) of fixedly adhering a plurality of spot leads in a lead frame to one surface of an insulating adhesive tape; a step (b) of adhering said semiconductor element to the other surface of said adhesive tape and sealing said semiconductor element with a resin; and a step (c) of separating said plurality of spot leads from said lead frame and bending front edges of said spot leads downward in an L-shape from outside the side portion of said semiconductor element.
Claim 6
Independent Claim
91 words
A method of manufacturing a semiconductor device, comprising: a step (a) of fixedly adhering a plurality of spot leads in a lead frame to one surface of an insulating adhesive tape; a step (b) of adhering said semiconductor element to the other surface of said adhesive tape and sealing said semiconductor element with a resin; and a step (c) of separating said plurality of spot leads from said lead frame and bending front edges of said spot leads downward in an L-shape from outside the side portion of said semiconductor element.
Claim 7
Dependent Claim
27 words
A method of manufacturing a semiconductor device according to claim 4 , wherein step (a) is performed after metal plating each of the plurality of spot leads.
Claim 8
Dependent Claim
38 words
A method of manufacturing a semiconductor device according to claim 4 , wherein step (a) further includes fixedly adhering a support member together with said plurality of spot leads to the one surface of said insulating adhesive tape.
Claim 9
Independent Claim
86 words
A method of packaging a semiconductor device, comprising: a step of disposing, in a side-by-side relationship, a plurality of semiconductor devices having a plurality of L-shaped leads exposed to outside from upper surfaces of semiconductor elements within mold resinous portions, front edges of which extend downward from outside the side portions of said semiconductor elements, and of connecting said L-shaped leads to each other; and a step of connecting connecting portions of said L-shaped leads to the same foot pattern provided on a printed circuit board.
Claim 10
Independent Claim
86 words
A method of packaging a semiconductor device, comprising: a step of disposing, in a side-by-side relationship, a plurality of semiconductor devices having a plurality of L-shaped leads exposed to outside from upper surfaces of semiconductor elements within mold resinous portions, front edges of which extend downward from outside the side portions of said semiconductor elements, and of connecting said L-shaped leads to each other; and a step of connecting connecting portions of said L-shaped leads to the same foot pattern provided on a printed circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-06-10 | 2005-12-10 | 2006-06-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-06-10 | 2009-12-10 | 2010-06-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-06-10 | 2013-12-10 | 2014-06-11 | $7700.00 | Window Closed / Lapsed |