Semiconductor device and display unit using the semiconductor device and notebook-size personal computer

Claim 1

A display unit comprising a display panel, a printed circuit board, and a semiconductor device electrically connected with the display panel and the printed circuit board; wherein the semiconductor device has a semiconductor chip having a rectangular principal plane, a plurality of first electrode pads arranged on the principal plane in a line along a first long side, and a plurality of second electrode pads arranged in a line along a second long side, a thin resin film having a surface and a back, and locally having an opening reaching the back from the surface in which first and second sides specifying the opening are included, wherein the first side is close to the first long side and the second side is close to the second long side, a plurality of first leads which are formed on the surface of the thin resin film and extend across the first side of the thin resin film, the first leads having one end extending into the opening, a plurality of second leads which are formed on the surface of the thin resin film and extend across the second side of the thin resin film, the second leads having one end extending into the opening, and a sealing resin for covering said first and second sides of said thin resin film, the principal plane of the semiconductor chip and a portion where the leads extend into the opening; wherein the thin resin film is located between the semiconductor chip and the leads, said thin resin film covers said first and second long sides of the semiconductor chip, and the opening of the thin resin film is formed at a position where the electrode pads on the principal plane of the semiconductor chip are exposed; wherein the first leads are electrically connected at one end with the first electrode pads and the second leads are electrically connected at one end with the second electrode pads; and wherein said first leads are electrically connected to said printed circuit board and positioned between said printed circuit board and said thin resin film, and said second leads are electrically connected to said display panel and positioned between said display panel and said thin resin film.