US5849608A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor chip package
Assignee: NEC Electronics Corp
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Filing: 1997-05-29
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Granted: 1998-12-15
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Expires: 2017-05-29
Abstract
Abstract A semiconductor chip package is produced using a lead frame which has an island where a plurality of through holes are formed corresponding to the electrodes of the semiconductor chip, respectively. After an insulating film is formed on the island, the semiconductor chip is fixed to one side of the island through an adhesive layer while aligning the electrodes of the semiconductor chip with the through holes of the island portion, respectively. After sealing the semiconductor chip with sealing resin, solder balls are formed on the other side of the island portion, the solder balls are connected to the electrodes of the semiconductor chip through the through holes of the island portion, respectively.
Inventors
- 👤 Masaaki Abe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:50
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
133 words
A method for producing a semiconductor chip package including a semiconductor chip having a plurality of electrodes arrayed in a predetermined pattern on one side thereof, comprising the steps of: insulating a metal film having an island portion where a plurality of through holes are formed corresponding to the electrodes of the semiconductor chip, respectively, such that at least the island portion having the through holes therein is insulated; bonding the semiconductor chip to one side of the island portion such that the electrodes of the semiconductor chip are aligned with the through holes of the island portion, respectively; and forming a plurality of terminals on the other side of the island portion, the terminals being connected to the electrodes of the semiconductor chip through the through holes of the island portion, respectively.
Claim 2
Independent Claim
133 words
A method for producing a semiconductor chip package including a semiconductor chip having a plurality of electrodes arrayed in a predetermined pattern on one side thereof, comprising the steps of: insulating a metal film having an island portion where a plurality of through holes are formed corresponding to the electrodes of the semiconductor chip, respectively, such that at least the island portion having the through holes therein is insulated; bonding the semiconductor chip to one side of the island portion such that the electrodes of the semiconductor chip are aligned with the through holes of the island portion, respectively; and forming a plurality of terminals on the other side of the island portion, the terminals being connected to the electrodes of the semiconductor chip through the through holes of the island portion, respectively.
Claim 3
Dependent Claim
22 words
The method according to claim 1, wherein at least the island portion having the through holes therein is coated with insulating material.
Claim 4
Dependent Claim
23 words
The method according to claim 1, wherein a plurality of island portions each having the through holes are formed in the metal film.
Claim 5
Dependent Claim
18 words
The method according to claim 1, wherein the island portion is supported by a plurality of supporting portions.
Claim 6
Dependent Claim
20 words
The method according to claim 3, wherein each of the island portions is supported by a plurality of supporting portions.
Claim 7
Dependent Claim
45 words
The method according to claim 1, wherein each of the terminals is a terminal ball protruding from a surface of the other side of the island portion, the terminal ball being connected to a corresponding electrode of the semiconductor chip through a corresponding through hole.
Claim 8
Independent Claim
149 words
A method for producing a semiconductor chip package including a semiconductor chip having a plurality of electrodes arrayed in a predetermined pattern on one side thereof, comprising the steps of: preparing a lead frame having an island portion where a plurality of through holes are formed corresponding to the electrodes of the semiconductor chip, respectively; forming an insulating film on at least the island portion having the through holes therein; fixing the semiconductor chip to one side of the island portion of the lead frame through an adhesive layer such that the electrodes of the semiconductor chip are aligned with the through holes of the island portion, respectively; sealing the semiconductor chip with sealing resin; and forming a plurality of terminals on the other side of the island portion, the terminals being connected to the electrodes of the semiconductor chip through the through holes of the island portion, respectively.
Claim 9
Independent Claim
149 words
A method for producing a semiconductor chip package including a semiconductor chip having a plurality of electrodes arrayed in a predetermined pattern on one side thereof, comprising the steps of: preparing a lead frame having an island portion where a plurality of through holes are formed corresponding to the electrodes of the semiconductor chip, respectively; forming an insulating film on at least the island portion having the through holes therein; fixing the semiconductor chip to one side of the island portion of the lead frame through an adhesive layer such that the electrodes of the semiconductor chip are aligned with the through holes of the island portion, respectively; sealing the semiconductor chip with sealing resin; and forming a plurality of terminals on the other side of the island portion, the terminals being connected to the electrodes of the semiconductor chip through the through holes of the island portion, respectively.
Claim 10
Dependent Claim
23 words
The method according to claim 7, wherein a plurality of island portions each having the through holes are formed in a metal film.
Claim 11
Dependent Claim
23 words
The method according to claim 8, wherein the adhesive layer is formed by placing an adhesive tape on each of the island portions.
Claim 12
Dependent Claim
20 words
The method according to claim 8, wherein each of the island portions is supported by a plurality of supporting portions.
Claim 13
Dependent Claim
19 words
The method according to claim 10, further comprising the step of removing a needless portion from each supporting portion.
Claim 14
Dependent Claim
45 words
The method according to claim 7, wherein each of the terminals is a solder ball protruding from a surface of the other side of the island portion, the solder ball being connected to a corresponding electrode of the semiconductor chip through a corresponding through hole.
Claim 15
Dependent Claim
18 words
The method according to claim 12, wherein the semiconductor chip package is a BGA (ball grid array) package.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-12-14 | 2002-06-15 | 2002-12-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-12-14 | 2006-06-15 | 2006-12-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-12-14 | 2010-06-15 | 2010-12-15 | $7700.00 | Window Closed / Lapsed |