US5583375A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device with lead structure within the planar area of the device
Assignee: Hitachi Microcomputer System Ltd
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Filing: 1992-12-14
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Granted: 1996-12-10
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Expires: 2012-12-14
Abstract
Abstract A semiconductor device having inner leads secured via insulating adhesive films to the principal surface of a semiconductor chip and electrically connected to the respective external terminals of the semiconductor chip. The semiconductor device that can be about the size of the chip is so configured that an outer lead is continuously extended from each inner lead up to the rear surface opposite to the principal surface of the semiconductor chip in order to hold the leads and an external device in conduction.
Inventors
- 👤 Kunihiro Tsubosaki
- 👤 Michio Tanimoto
- 👤 Kunihiko Nishi
- 👤 Masahiro Ichitani
- 👤 Shunji Koike
- 👤 Kazunari Suzuki
- 👤 Ryosuke Kimoto
- 👤 Ichiro Anjoh
- 👤 Taisei Jin
- 👤 Akihiko Iwaya
- 👤 Gen Murakami
- 👤 Masamichi Ishihara
- 👤 Junichi Arita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 07:56
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W90/00; H10W72/00; H10W72/071; H10W72/075; H10W72/20; H10W72/29; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/547; H10W72/5473; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/952; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 42
Claim 1
Independent Claim
226 words
A semiconductor device comprising: a semiconductor chip having a principal and a rear surface, said principal and rear surfaces each comprising a rectangular-shaped plane surface, and a plurality of external terminals formed on said principal surface; a plurality of leads, each including a first portion, which is electrically connected to an external terminal, arranged on and substantially parallel to said principal surface, said first portions of said leads being electrically connected with said external terminals by bonding wires, a second portion arranged over and substantially parallel to said principal surface, said second portion being positioned farther from said principal surface than the position of said first portion and having a portion for electrically connecting with an external device, and a third portion electrically connected between said first portion and said second portion; and a sealing material sealing said external terminals, said first portions of said leads and said bonding wires, wherein all of said first portions of leads in which said bonding wires are connected are positioned on said principal surface, wherein adjacent leads of said plurality of leads which are electrically connected with adjacent external terminals extend in the same direction as each other; wherein said first and third portions, and said portions of the second portions for electrically connecting with said external device are positioned in an area of said substantially rectangular-shaped plane surface.
Claim 2
Dependent Claim
226 words
A semiconductor device comprising: a semiconductor chip having a principal and a rear surface, said principal and rear surfaces each comprising a rectangular-shaped plane surface, and a plurality of external terminals formed on said principal surface; a plurality of leads, each including a first portion, which is electrically connected to an external terminal, arranged on and substantially parallel to said principal surface, said first portions of said leads being electrically connected with said external terminals by bonding wires, a second portion arranged over and substantially parallel to said principal surface, said second portion being positioned farther from said principal surface than the position of said first portion and having a portion for electrically connecting with an external device, and a third portion electrically connected between said first portion and said second portion; and a sealing material sealing said external terminals, said first portions of said leads and said bonding wires, wherein all of said first portions of leads in which said bonding wires are connected are positioned on said principal surface, wherein adjacent leads of said plurality of leads which are electrically connected with adjacent external terminals extend in the same direction as each other; wherein said first and third portions, and said portions of the second portions for electrically connecting with said external device are positioned in an area of said substantially rectangular-shaped plane surface.
Claim 3
Dependent Claim
25 words
A semiconductor device according to claim 1, wherein said first, second and third portions are positioned in an area of said substantially rectangular-shaped plane surface.
Claim 4
Dependent Claim
33 words
A semiconductor device according to claim 1, further comprising: a radiation fin for dissipating heat, said radiation fin being joined to said rear surface of said semiconductor chip with a heat conductive adhesive.
Claim 5
Dependent Claim
28 words
A semiconductor device according to claim 1, wherein side surfaces of said semiconductor chip between said principal surface and said rear surface are sealed with said sealing material.
Claim 6
Dependent Claim
42 words
A semiconductor device according to claim 1, wherein said external terminals are arranged in a central part of said rectangular-shaped principal surface of said semiconductor chip and are extended in a direction substantially parallel to longer sides of said rectangular-shaped principal surface.
Claim 7
Dependent Claim
15 words
A semiconductor device according to claim 1, wherein said sealing material is a sealing resin.
Claim 8
Dependent Claim
20 words
A semiconductor device according to claim 1, wherein said first portions are electrically connected to said external terminals by wires.
Claim 9
Dependent Claim
21 words
A semiconductor device according to claim 1, wherein said second portions of said leads are joined to a board with solder.
Claim 10
Dependent Claim
25 words
A semiconductor device according to claim 8, wherein said first, second and third portions are positioned in an area of said substantially rectangular-shaped plane surface.
Claim 11
Dependent Claim
33 words
A semiconductor device according to claim 8, further comprising: a radiation fin for dissipating heat, said radiation fin being joined to said rear surface of said semiconductor chip with a heat conductive adhesive.
Claim 12
Dependent Claim
28 words
A semiconductor device according to claim 8, wherein side surfaces of said semiconductor chip between said principal surface and said rear surface are sealed with said sealing material.
Claim 13
Dependent Claim
42 words
A semiconductor device according to claim 8, wherein said external terminals are arranged in a central part of said rectangular-shaped principal surface of said semiconductor chip and are extended in a direction substantially parallel to longer sides of said rectangular-shaped principal surface.
Claim 14
Dependent Claim
15 words
A semiconductor device according to claim 8, wherein said sealing material is a sealing resin.
Claim 15
Dependent Claim
20 words
A semiconductor device according to claim 8, wherein said first portions are electrically connected to said external terminals by wires.
Claim 16
Dependent Claim
25 words
A semiconductor device according to claim 1, wherein said second portions and second parts of said third portions are not sealed by said sealing material.
Claim 17
Dependent Claim
25 words
A semiconductor device according to claim 8, wherein said second portions and second parts of said third portions are not sealed by said sealing material.
Claim 18
Dependent Claim
32 words
A semiconductor device according to claim 1, wherein said external terminals are arranged in two rows, and wherein said adjacent external terminals are external terminals which adjoin each other in one row.
Claim 19
Dependent Claim
159 words
A semiconductor device comprising: a semiconductor chip having a first surface, a second surface opposing said first surface and external terminals formed on said first surface; and a plurality of leads arranged on said first surface of said semiconductor chip, each of said plurality of leads having a first end portion and a second end portion, said first end portions of said plurality of leads being electrically connected with said external terminals by bonding wires, each of said second portions including a portion for electrically connecting with an external device, wherein all of said first portions of said plurality of leads to which said bonding wires are connected are positioned on said first surface, wherein said first and second end portions are positioned in an area of said first surface of said semiconductor chip, and wherein adjacent leads of said plurality of leads which are electrically connected with adjacent external terminals extend in the same direction as each other.
Claim 20
Dependent Claim
159 words
A semiconductor device comprising: a semiconductor chip having a first surface, a second surface opposing said first surface and external terminals formed on said first surface; and a plurality of leads arranged on said first surface of said semiconductor chip, each of said plurality of leads having a first end portion and a second end portion, said first end portions of said plurality of leads being electrically connected with said external terminals by bonding wires, each of said second portions including a portion for electrically connecting with an external device, wherein all of said first portions of said plurality of leads to which said bonding wires are connected are positioned on said first surface, wherein said first and second end portions are positioned in an area of said first surface of said semiconductor chip, and wherein adjacent leads of said plurality of leads which are electrically connected with adjacent external terminals extend in the same direction as each other.
Claim 21
Dependent Claim
30 words
A semiconductor device according to claim 18, wherein said external terminals are arranged in two rows, and wherein said adjacent external terminals are arranged in one of said two rows.
Claim 22
Dependent Claim
53 words
A semiconductor device according to claim 18, wherein said first and second end portions of said plurality of leads are arranged substantially in parallel to said first surface of said semiconductor chip, and wherein said second end portions are positioned farther from said first surface than the position of said first end portions.
Claim 23
Dependent Claim
38 words
A semiconductor device according to claim 20, wherein a height of said second end portions from said first bonding surface is higher than a peak height of a wire loop of said bonding wires from said first surface.
Claim 24
Dependent Claim
50 words
A semiconductor device according to claim 20, further comprising an encapsulator sealing said first end portions of said plurality of leads and said bonding wires, and wherein a height of said encapsulator from said first surface is lower than a height of said second end portions from said first surface.
Claim 25
Dependent Claim
39 words
A semiconductor device according to claim 18, further comprising an insulating adhesive film formed between said first end portions and said first surface, wherein said first end portions are fixed on said first surface by said insulating adhesive film.
Claim 26
Dependent Claim
238 words
A semiconductor device comprising: a semiconductor chip having a principal and a rear surface, said principal and rear surfaces each comprising a rectangular-shaped plane surface, and a plurality of external terminals formed on said principal surface; a plurality of leads, each including a first portion, which is electrically connected to an external terminal, arranged on and substantially parallel to said principal surface, and fixed on said principal surface by an insulating adhesive film, said first portions of said leads being electrically connected with said external terminals by bonding wires, a second portion arranged over and substantially parallel to said principal surface, said second portion being positioned farther from said principal surface than the position of said first portion and having a portion for electrically connecting with an external device, and a third portion electrically connected between said first portion and said second portion wherein said plurality of leads are the only leads fixed to said semiconductor chip; and a sealing material sealed over said principal surface of said semiconductor chip, said first portions, a first part of said third portions and said insulating adhesive film, wherein all of said first portions of leads in which said bonding wires are connected are positioned on said principal surface, and wherein said first and third portions, and said portions of the second portions for electrically connecting with said external device are positioned in an area of said substantially rectangular-shaped plane surface.
Claim 27
Dependent Claim
238 words
A semiconductor device comprising: a semiconductor chip having a principal and a rear surface, said principal and rear surfaces each comprising a rectangular-shaped plane surface, and a plurality of external terminals formed on said principal surface; a plurality of leads, each including a first portion, which is electrically connected to an external terminal, arranged on and substantially parallel to said principal surface, and fixed on said principal surface by an insulating adhesive film, said first portions of said leads being electrically connected with said external terminals by bonding wires, a second portion arranged over and substantially parallel to said principal surface, said second portion being positioned farther from said principal surface than the position of said first portion and having a portion for electrically connecting with an external device, and a third portion electrically connected between said first portion and said second portion wherein said plurality of leads are the only leads fixed to said semiconductor chip; and a sealing material sealed over said principal surface of said semiconductor chip, said first portions, a first part of said third portions and said insulating adhesive film, wherein all of said first portions of leads in which said bonding wires are connected are positioned on said principal surface, and wherein said first and third portions, and said portions of the second portions for electrically connecting with said external device are positioned in an area of said substantially rectangular-shaped plane surface.
Claim 28
Dependent Claim
25 words
A semiconductor device according to claim 24, wherein said first, second and third portions are positioned in an area of said substantially rectangular-shaped plane surface.
Claim 29
Dependent Claim
33 words
A semiconductor device according to claim 24, further comprising: a radiation fin for dissipating heat, said radiation fin being joined to said rear surface of said semiconductor chip with a heat conductive adhesive.
Claim 30
Dependent Claim
28 words
A semiconductor device according to claim 24, wherein side surfaces of said semiconductor chip between said principal surface and said rear surface are sealed with said sealing material.
Claim 31
Dependent Claim
15 words
A semiconductor device according to claim 24, wherein said sealing material is a sealing resin.
Claim 32
Dependent Claim
20 words
A semiconductor device according to claim 24, wherein said first portions are electrically connected to said external terminals by wires.
Claim 33
Dependent Claim
21 words
A semiconductor device according to claim 24, wherein said second portions of said leads are joined to a board with solder.
Claim 34
Dependent Claim
25 words
A semiconductor device according to claim 30, wherein said first, second and third portions are positioned in an area of said substantially rectangular-shaped plane surface.
Claim 35
Dependent Claim
33 words
A semiconductor device according to claim 30, further comprising: a radiation fin for dissipating heat, said radiation fin being joined to said rear surface of said semiconductor chip with a heat conductive adhesive.
Claim 36
Dependent Claim
28 words
A semiconductor device according to claim 30, wherein side surfaces of said semiconductor chip between said principal surface and said rear surface are sealed with said sealing material.
Claim 37
Dependent Claim
15 words
A semiconductor device according to claim 30, wherein said sealing material is a sealing resin.
Claim 38
Dependent Claim
20 words
A semiconductor device according to claim 30, wherein said first portions are electrically connected to said external terminals by wires.
Claim 39
Dependent Claim
25 words
A semiconductor device according to claim 24, wherein said second portions and second parts of said third portions are not sealed by said sealing material.
Claim 40
Dependent Claim
25 words
A semiconductor device according to claim 30, wherein said second portions and second parts of said third portions are not sealed by said sealing material.
Claim 41
Dependent Claim
42 words
A semiconductor device according to claim 24, wherein said external terminals are arranged in a central part of said rectangular-shaped principal surface of said semiconductor chip and are extended in a direction substantially parallel to longer sides of said rectangular-shaped principal surface.
Claim 42
Dependent Claim
42 words
A semiconductor device according to claim 30, wherein said external terminals are arranged in a central part of said rectangular-shaped principal surface of said semiconductor chip and are extended in a direction substantially parallel to longer sides of said rectangular-shaped principal surface.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-10 | 2000-06-10 | 2000-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-10 | 2004-06-10 | 2004-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-10 | 2008-06-10 | 2008-12-10 | $7700.00 | Window Closed / Lapsed |