US4989069A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package having leads that break-away from supports
Assignee: NXP USA Inc
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Filing: 1990-01-29
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Granted: 1991-01-29
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Expires: 2010-01-29
Abstract
Abstract A semiconductor package wherein a semiconductor die is disposed in packaging material and electrically coupled to leads having portions extending from the packaging material. The portions of the leads that extend from the packaging material are adhered to the outside of the packaging material and release therefrom when subjected to a predetermined amount thermal stress. The invention disclosed herein allows consistent alignment of flexible leads while adequately reducing stress caused by the differing coefficients of thermal expansion of the semiconductor package and a printed circuit or the like on which the package is mounted.
Inventors
- 👤 George W. Hawkins
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 17:06
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
74 words
A semiconductor package comprising: a semiconductor device; packaging material being disposed about said semiconductor device; and a plurality of leads having first portions electrically coupled to said semiconductor device, said plurality of leads further extending from said packaging material and at least some of said plurality of leads having second portions adhered to the outside of said packaging material so that they will release from said packaging material when subjected to a predetermined stress.
Claim 2
Dependent Claim
74 words
A semiconductor package comprising: a semiconductor device; packaging material being disposed about said semiconductor device; and a plurality of leads having first portions electrically coupled to said semiconductor device, said plurality of leads further extending from said packaging material and at least some of said plurality of leads having second portions adhered to the outside of said packaging material so that they will release from said packaging material when subjected to a predetermined stress.
Claim 3
Dependent Claim
19 words
The package of claim 1 wherein the packaging material is a member of the group comprising polymers and ceramics.
Claim 4
Dependent Claim
30 words
The package of claim 1 wherein the semiconductor device is a semiconductor die and the plurality of leads are part of a lead tape being adhered to said semiconductor die.
Claim 5
Dependent Claim
32 words
The package of claim 1 wherein at least some of the plurality of leads have their second portions adhered to protrusions extending from and comprising the same material as the packaging material.
Claim 6
Dependent Claim
26 words
The package of claim 1 wherein the adhered second portions of at least some of the plurality of leads are partially embedded in the packaging material.
Claim 7
Dependent Claim
110 words
A semiconductor package comprising: a semiconductor die having a first surface and a second surface; a protective frame disposed around said semiconductor die; a lead tape including a plurality of leads having first portions electrically coupled to said semiconductor die, said lead tape being adhered to said semiconductor die and said protective frame; and packaging material disposed about said semiconductor die, said protective frame and said lead tape including said first portions, at least some of said plurality of leads of said lead tape having second portions adhered to the outside of said packaging material so that they will release from said packaging material when subjected to a predetermined stress.
Claim 8
Dependent Claim
110 words
A semiconductor package comprising: a semiconductor die having a first surface and a second surface; a protective frame disposed around said semiconductor die; a lead tape including a plurality of leads having first portions electrically coupled to said semiconductor die, said lead tape being adhered to said semiconductor die and said protective frame; and packaging material disposed about said semiconductor die, said protective frame and said lead tape including said first portions, at least some of said plurality of leads of said lead tape having second portions adhered to the outside of said packaging material so that they will release from said packaging material when subjected to a predetermined stress.
Claim 9
Dependent Claim
20 words
The package of claim 6 wherein the protective frame has approximately the same thermal expansion coefficient as the semiconductor die.
Claim 10
Dependent Claim
22 words
The package of claim 6 wherein the lead tape is adhered to both the first and second surfaces of the semiconductor die.
Claim 11
Dependent Claim
19 words
The package of claim 6 wherein the packaging material is a member of the group comprising polymers and ceramics.
Claim 12
Dependent Claim
32 words
The package of claim 6 wherein at least some of the plurality of leads have their second portions adhered to protrusions extending from and comprising the same material as the packaging material.
Claim 13
Dependent Claim
26 words
The package of claim 6 wherein the adhered second portions of at least some of the plurality of leads are partially embedded in the packaging material.
Claim 14
Dependent Claim
145 words
A semiconductor comprising: a semiconductor die having a first surface and a second surface; a stress buffer frame disposed around said semiconductor die and having a substantially similar coefficient of thermal expansion; a lead tape comprising a polymer with metal leads disposed thereon, said metal leads having first portions electrically coupled to said semiconductor die, said lead tape being adhered to said semiconductor die and said stress buffer frame so that said metal leads extend from said semiconductor die and from said stress buffer frame; and packaging material comprising one of a polymer or ceramic disposed about said semiconductor die, said stress buffer frame and said lead tape including said first portions, at least some of said metal leads having second portions adhered to the outside of said packaging material so that they will release from said packaging material when subjected to a predetermined stress.
Claim 15
Dependent Claim
145 words
A semiconductor comprising: a semiconductor die having a first surface and a second surface; a stress buffer frame disposed around said semiconductor die and having a substantially similar coefficient of thermal expansion; a lead tape comprising a polymer with metal leads disposed thereon, said metal leads having first portions electrically coupled to said semiconductor die, said lead tape being adhered to said semiconductor die and said stress buffer frame so that said metal leads extend from said semiconductor die and from said stress buffer frame; and packaging material comprising one of a polymer or ceramic disposed about said semiconductor die, said stress buffer frame and said lead tape including said first portions, at least some of said metal leads having second portions adhered to the outside of said packaging material so that they will release from said packaging material when subjected to a predetermined stress.
Claim 16
Dependent Claim
22 words
The package of claim 12 wherein the lead tape is adhered to both the first and second surfaces of the semiconductor die.
Claim 17
Dependent Claim
31 words
The package of claim 12 wherein at least some of the metal leads have their second portions adhered to protrusions extending from and comprising the same material as the packaging material.
Claim 18
Dependent Claim
25 words
The package of claim 12 wherein the adhered second portions of at least some of the metal leads are partially embedded in the packaging material.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-01-28 | 1994-07-30 | 1995-01-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-01-28 | 1998-07-30 | 1999-01-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-01-28 | 2002-07-30 | 2003-01-29 | $7700.00 | Window Closed / Lapsed |