US5266834A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and an electronic device with the semiconductor devices mounted thereon
Assignee: Hitachi Ltd
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Filing: 1992-07-21
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Granted: 1993-11-30
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Expires: 2012-07-21
Abstract
Abstract A package is provided for achieving higher packing density and higher circuit integration of memories, in particular, a structure is provided having a plurality of thin, surface mount packages which are stacked up. Each of the laminated packages includes a semiconductor pellet, leads fixed to the front surface of the pellet, a radiating plate fixed to the rear surface of the same, and a resin mold member. To achieve a stabilized laminated structure, the mold member is shaped into a convex form on the front side of the pellet and into a concave form on the rear side of the same, so that the concave portion of one package can engage with the convex portion of another package.
Inventors
- 👤 Kunihiko Nishi
- 👤 Michio Tanimoto
- 👤 Toshihiro Yasuhara
- 👤 Katsuhiro Tabata
- 👤 Yasuhiro Yoshikawa
- 👤 Isao Akima
- 👤 Souichi Kunito
- 👤 Toshio Nosaka
- 👤 Hideaki Nakamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 01:38
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/461; H10W90/00; H10W70/60; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/851; H10W72/853; H10W72/865; H10W74/00; H10W74/10; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
332 words
A semiconductor module with stacked semiconductor devices comprising: an upper and a lower semiconductor device, each of said semiconductor devices comprising: a substantially square-shaped pellet having a front surface with circuit elements and external terminals disposed thereon, a rear surface opposite to said front surface, and a side surface formed between said front and rear surfaces; a plurality of leads each having an inner portion and an outer portion, said outer portion comprising a first portion extending away from said pellet, a second portion extending from said first portion in a substantially parallel direction to said side surface of said pellet, and a third portion extending from said second portion toward said pellet; an insulating film inserted between said front surface of said pellet and a part of said inner portions of said leads wherein said inner portions of said leads are fixed to said front surface of said chip through said insulating film; a plurality of wires for electrically connecting said external terminals of said pellet with said inner portions of said leads; and a substantially square-shaped resin mold member having an upper surface located adjacent said front surface of said pellet and a lower surface located opposite to said upper surface and adjacent to said rear surface of said pellet, wherein said resin mold member seals said inner portions of said leads, said pellet and said wires, wherein a distance between a predetermined portion of said upper surface of said resin mold member and said first portions of said outer portions of said leads is less than a distance between a predetermined portion of said lower surface of said resin mold member and said third portions of said outer portions of said leads, and wherein said third portions of said leads of said upper semiconductor device are electrically connected to said first portions of said leads of said lower semiconductor device, and wherein said outer portions of said leads extend outwardly from only one side of said resin mold member.
Claim 2
Dependent Claim
332 words
A semiconductor module with stacked semiconductor devices comprising: an upper and a lower semiconductor device, each of said semiconductor devices comprising: a substantially square-shaped pellet having a front surface with circuit elements and external terminals disposed thereon, a rear surface opposite to said front surface, and a side surface formed between said front and rear surfaces; a plurality of leads each having an inner portion and an outer portion, said outer portion comprising a first portion extending away from said pellet, a second portion extending from said first portion in a substantially parallel direction to said side surface of said pellet, and a third portion extending from said second portion toward said pellet; an insulating film inserted between said front surface of said pellet and a part of said inner portions of said leads wherein said inner portions of said leads are fixed to said front surface of said chip through said insulating film; a plurality of wires for electrically connecting said external terminals of said pellet with said inner portions of said leads; and a substantially square-shaped resin mold member having an upper surface located adjacent said front surface of said pellet and a lower surface located opposite to said upper surface and adjacent to said rear surface of said pellet, wherein said resin mold member seals said inner portions of said leads, said pellet and said wires, wherein a distance between a predetermined portion of said upper surface of said resin mold member and said first portions of said outer portions of said leads is less than a distance between a predetermined portion of said lower surface of said resin mold member and said third portions of said outer portions of said leads, and wherein said third portions of said leads of said upper semiconductor device are electrically connected to said first portions of said leads of said lower semiconductor device, and wherein said outer portions of said leads extend outwardly from only one side of said resin mold member.
Claim 3
Dependent Claim
41 words
A semiconductor module with stacked semiconductor devices according to claim 1, further comprising: a radiating plate having a first surface portion thereof fixed to said rear surface of said pellet and a second surface portion opposite to said first surface portion.
Claim 4
Dependent Claim
48 words
A semiconductor module with stacked semiconductor devices according to claim 2, wherein an end portion of said radiating plate, including an extension of said first surface portion, an extension of said second surface portion, and an end face therebetween, is arranged to project from said resin mold member.
Claim 5
Dependent Claim
34 words
A semiconductor module with stacked semiconductor devices according to claim 2, wherein said radiating plate has through-holes formed in a region surrounding a region of the radiating plate where said pellet is fixed thereto.
Claim 6
Dependent Claim
29 words
A semiconductor module with stacked semiconductor devices according to claim 1, wherein a length of said first portions of said outer portions of said leads includes a widened portion.
Claim 7
Dependent Claim
82 words
A semiconductor module with stacked semiconductor devices according to claim 1, further comprising a radiating plate having a first surface portion thereof fixed to said rear surface of said pellet and a second surface portion opposite to said first surface portion of said radiating plate, wherein an end portion of said radiating plate, including an extension of said first surface portion, an extension of said second surface portion, and an end face therebetween, is arranged to project from said resin mold member.
Claim 8
Dependent Claim
69 words
A semiconductor device according to claim 1, further comprising: a mounting substrate having a main surface and a plurality of terminals on said main surface to be electrically connected to said outer portions of said leads; wherein said stacked semiconductor devices are mounted on said main surface of said substrate, and wherein the front surface of said pellet is substantially perpendicular to a said main surface of said substrate.
Claim 9
Dependent Claim
69 words
A semiconductor device according to claim 1, further comprising: a mounting substrate having a main surface and a plurality of terminals on said main surface to be electrically connected to said outer portions of said leads; wherein said stacked semiconductor devices are mounted on said main surface of said substrate, and wherein the front surface of said pellet is substantially parallel to a said main surface of said substrate.
Claim 10
Dependent Claim
28 words
A semiconductor module according to claim 1, wherein said predetermined portions of said upper and lower surfaces of said resin mold member are substantially parallel to one another.
Claim 11
Dependent Claim
34 words
A semiconductor module according to claim 9, wherein said predetermined portions of said upper and lower surfaces of said resin mold member are substantially parallel to said front and rear surfaces of said pellet.
Claim 12
Dependent Claim
154 words
A semiconductor module with stacked semiconductor devices comprising: an upper and a lower semiconductor device, each of said semiconductor devices comprising: an pellet having a main surface with circuits and external terminals arranged thereon, a rear surface opposite to said main surface, and a side surface formed between said main and rear surfaces; a plurality of leads each having an inner portion and an outer portion; means for electrically connecting said external terminals of said pellet and said inner portions of said leads; and a substantially square-shaped resin mold member having a convex portion located above said main surface of said pellet and a concave portion located under said rear surface of said pellet, wherein said resin mold member seals said pellet, said inner portions of said leads and said electrically connecting means; wherein said upper semiconductor device is stacked with its concave portion fit on the convex portion of said lower semiconductor device.
Claim 13
Dependent Claim
154 words
A semiconductor module with stacked semiconductor devices comprising: an upper and a lower semiconductor device, each of said semiconductor devices comprising: an pellet having a main surface with circuits and external terminals arranged thereon, a rear surface opposite to said main surface, and a side surface formed between said main and rear surfaces; a plurality of leads each having an inner portion and an outer portion; means for electrically connecting said external terminals of said pellet and said inner portions of said leads; and a substantially square-shaped resin mold member having a convex portion located above said main surface of said pellet and a concave portion located under said rear surface of said pellet, wherein said resin mold member seals said pellet, said inner portions of said leads and said electrically connecting means; wherein said upper semiconductor device is stacked with its concave portion fit on the convex portion of said lower semiconductor device.
Claim 14
Dependent Claim
54 words
A semiconductor module with stacked semiconductor devices according to claim 11, further comprising: a mounting substrate having a main surface and a plurality of terminals on said main surface to be electrically connected to said outer portions of said leads; wherein said stacked semiconductor devices are mounted on said main surface of said substrate.
Claim 15
Dependent Claim
28 words
A semiconductor module with stacked semiconductor devices according to claim 12, wherein said main surface of said pellet is substantially perpendicular to said main surface of said substrate.
Claim 16
Dependent Claim
72 words
A semiconductor module with stacked semiconductor devices according to claim 11, further comprising: a radiating plate having a first surface portion fixed to said rear surface of said pellet, a second surface portion opposite to said first surface portion of said radiating plate and an end surface portion extending between said first and second surface portions, wherein said second surface portion is exposed from said concave portion of said resin mold member.
Claim 17
Dependent Claim
78 words
A semiconductor module with stacked semiconductor devices according to claim 14, wherein said plurality of outer leads protrude outwardly from one side of said resin mold member, and wherein an end portion of said radiating plate, including an extension of said first surface portion, an extension of said second surface portion and said end surface portion, is arranged to project from said resin mold member in an opposite direction to a direction in which said outer leads protrude.
Claim 18
Dependent Claim
54 words
A semiconductor module with stacked semiconductor devices according to claim 15, further comprising: a mounting substrate having a main surface and a plurality of terminals on said main surface to be electrically connected to said outer portions of said leads; wherein said stacked semiconductor devices are mounted on said main surface of said substrate.
Claim 19
Dependent Claim
28 words
A semiconductor module with stacked semiconductor devices according to claim 16, wherein said main surface of said pellet is substantially perpendicular to said main surface of said substrate.
Claim 20
Dependent Claim
54 words
A semiconductor module with stacked semiconductor devices according to claim 11, further comprising: an insulating film inserted between said main surface of said pellet and a part of said inner portions of said leads; wherein said inner portions of said leads are fixed to said main surface of said pellet through said insulating film.
Claim 21
Dependent Claim
54 words
A semiconductor module with stacked semiconductor devices according to claim 18, further comprising: a mounting substrate having a main surface and a plurality of terminals on said main surface to be electrically connected to said outer portions of said leads, wherein said stacked semiconductor devices are mounted on said main surface of said substrate.
Claim 22
Dependent Claim
28 words
A semiconductor module with stacked semiconductor devices according to claim 19, wherein said main surface of said pellet is substantially perpendicular to said main surface of said substrate.
Claim 23
Dependent Claim
72 words
A semiconductor module with stacked semiconductor devices according to claim 18, further comprising: a radiating plate having a first surface portion fixed to said rear surface of said pellet, a second surface portion opposite to said first surface portion of said radiating plate, and an end surface portion extending between said first and second surface portions, wherein said second surface portion is exposed from said concave portion of said resin mold member.
Claim 24
Dependent Claim
78 words
A semiconductor module with stacked semiconductor devices according to claim 24, wherein said plurality of outer leads protrude outwardly from one side of said resin mold member, and wherein an end portion of said radiating plate, including an extension of said first surface portion, an extension of said second surface portion and said end surface portion, is arranged to project from said resin mold member in an opposite direction to a direction in which said outer leads protrude.
Claim 25
Dependent Claim
54 words
A semiconductor module with stacked semiconductor devices according to claim 22, further comprising: a mounting substrate having a main surface and a plurality of terminals on said main surface to be electrically connected to said outer portions of said leads, wherein said stacked semiconductor devices are mounted on said main surface of said substrate.
Claim 26
Dependent Claim
28 words
A semiconductor module with stacked semiconductor devices according to claim 23, wherein said main surface of said pellet is substantially perpendicular to said main surface of said substrate.
Claim 27
Dependent Claim
61 words
A semiconductor module with stacked semiconductor devices according to claim 11, wherein said outer lead portions of said leads each comprise a first portion extending away from said pellet, a second portion extending from said first portion in a substantially parallel direction to said side surface of said pellet, and a third portion extending from said second portion toward said pellet.
Claim 28
Dependent Claim
31 words
A semiconductor module with stacked semiconductor devices according to claim 25, wherein said third portions of said upper semiconductor device are connected to said first portions of said lower semiconductor device.
Claim 29
Dependent Claim
54 words
A semiconductor module with stacked semiconductor devices according to claim 26, further comprising: a mounting substrate having a main surface and a plurality of terminals on said main surface to be electrically connected to said outer portions of said leads; wherein said stacked semiconductor devices are mounted on said main surface of said substrate.
Claim 30
Dependent Claim
72 words
A semiconductor module with stacked semiconductor devices according to claim 25, further comprising: a radiating plate having a first surface portion fixed to said rear surface of said pellet, a second surface portion opposite to said first surface portion of said radiating plate, and an end surface portion extending between said first and second surface portions, wherein said second surface portion is exposed from said concave portion of said resin mold member.
Claim 31
Dependent Claim
78 words
A semiconductor module with stacked semiconductor devices according to claim 28, wherein said plurality of outer leads protrude outwardly from one side of said resin mold member, and wherein an end portion of said radiating plate, including an extension of said first surface portion, an extension of said second surface portion and said end surface portion, is arranged to project from said resin mold member in an opposite direction to a direction in which said outer leads protrude.
Claim 32
Dependent Claim
72 words
A semiconductor module with stacked semiconductor devices according to claim 25, further comprising: a radiating plate having a first surface portion fixed to said rear surface of said pellet, a second surface portion opposite to said first surface portion of said radiating plate, and an end surface portion extending between said first and second surface portions, wherein said second surface portion is exposed from said concave portion of said resin mold member.
Claim 33
Dependent Claim
54 words
A semiconductor module with stacked semiconductor devices according to claim 30, wherein said plurality of outer leads protrude outwardly from one side of said resin mold member, and said radiating plate is arranged to project from said resin mold member in a direction substantially perpendicular to a direction in which said outer leads protrude.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-11-29 | 1997-05-31 | 1997-11-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-11-29 | 2001-05-31 | 2001-11-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-11-29 | 2005-05-31 | 2005-11-30 | $7700.00 | Window Closed / Lapsed |