Abstract An improved lead frame is provided for the manufacture of high heat dissipating semiconductor devices having a large heat sink metallic portion exposed with plastic encapsulating material partially disposed thereabout. A semiconductor unit is mounted directly on the heat sink such that high heat dissipation is obtained. The lead frame provides for pairs of metallic heat sink portions joined to a interdigitated center lead frame portion such that the interdigitation of the semiconductor device leads associated with each of the opposed heat sink portions provides for a high density lead frame structure from which a minimum of material must be removed in the fabrication process. The center lead frame portion comprises two parallel interconnecting rails or tie bars which provide a dual function in that they provide a mold stop for subsequent plastic encapsulation fabrication steps while simultaneously providing a support for alignment hole means which provide indexing of the lead frame and associated opposed heat sink portions through various automated manufacturing steps. The use of a composite lead frame structure wherein the metallic heat sink portion is joined to the center lead frame structure allows great versatility in the types of material and the types of fabrication steps used to provide a semiconductor device thus allowing manufacture at greatly reduced cost.
A lead frame for the assembly of semiconductor devices comprising: a. a first group of metallic members including a first die mount portion and semiconductor device leads; b. a first metallic interconnecting band attached to said device leads at a point in proximity to said first die mount portion, said attachments holding said device leads in a predetermined alignment; c. a second metallic interconnecting band attached to said device leads, said second interconnecting and spaced away from said first interconnecting band in a direction away from said first die mount portion; b. a second group of metallic members including a second die mount portion and semiconductor device leads wherein said second group of metallic members are attached to and held in alignment by said second interconnecting strip in the vicinity of said second die mount portion and further attached to and held in alignment by said first interconnnecting strip such that said device leads of said first group and said device leads of said second group are interdigitated.
Claim 2
Dependent Claim
168 words
A lead frame for the assembly of semiconductor devices comprising: a. a first group of metallic members including a first die mount portion and semiconductor device leads; b. a first metallic interconnecting band attached to said device leads at a point in proximity to said first die mount portion, said attachments holding said device leads in a predetermined alignment; c. a second metallic interconnecting band attached to said device leads, said second interconnecting and spaced away from said first interconnecting band in a direction away from said first die mount portion; b. a second group of metallic members including a second die mount portion and semiconductor device leads wherein said second group of metallic members are attached to and held in alignment by said second interconnecting strip in the vicinity of said second die mount portion and further attached to and held in alignment by said first interconnnecting strip such that said device leads of said first group and said device leads of said second group are interdigitated.
Claim 3
Dependent Claim
34 words
A lead frame for the assembly of semiconductor devices as recited in claim 1 wherein said device leads and said first and said second interconnecting bands are fabricated by stamping from a continuous strip.
Claim 4
Dependent Claim
34 words
A lead frame for the assembly of semiconductor devices as recited in claim 2 wherein said die mount portion is fabricated as a separate structure and joined to one of said semiconductor device leads.