Copper heat sinks for electronic devices and method of making same
Abstract
Abstract A copper layer is fabricated according to a method including the initial step of forming a molybdenum-manganese bonding layer. Thereafter a layer containing copper oxide or copper is formed on the bonding layer. If copper oxide is utilized, the substrate is then air dried and heated in a reducing atmosphere to transform the copper oxide layer into elemental copper. The elemental copper layer, whether formed by the reduction of copper oxide or direct application of particulate copper, is then sintered or fused to form a dense coherent structure. In one embodiment of the invention, the copper layer is utilized to bond a metal heat sink member to an electronic component mounting member. In another embodiment of the invention, the copper layer is utilized as a high conductivity lead in an electronic device.
Inventors
- 👤 J Darnell
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1977-08-12 | 1978-02-11 | 1978-08-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-08-12 | 1982-02-11 | 1982-08-13 | $3760.00 | Window Closed / Lapsed |
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