US3698074A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Contact bonding and packaging of integrated circuits
Assignee: Motorola Solutions Inc
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Filing: 1970-06-29
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Granted: 1972-10-17
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Expires: 1990-06-29
Abstract
Abstract Wire bonding is eliminated in the assembly of microelectronic devices, by a process involving the direct bonding of circuit electrodes to an unsupported metallic sheet-frame member having a plurality of inwardly extending leads. A single-step vibratory pressure welding technique is employed for the simultaneous bonding of all leads to a semiconductor integrated circuit chip. Lateral confinement of the leads during the bonding steps causes a buckling action to introduce a small but critical loop in each lead to ensure clearance between the lead fingers and the perimeter of the semiconductor chip, whereby electrical shorting is avoided. The loop also provides a structural flexibility in the leads, which tends to protect the bonding sites from excessive stresses. Subsequently, the first frame member including the bonded circuit is attached, preferably by resistance welding, to a second lead frame member of heavier gage and increased dimensions, suitable for connection with external circuitry. Excess portions of the first frame member are then removed, providing a completed assembly for packaging; e.g., plastic encapsulation or hermetic sealing, as in a ceramic-glass flat package.
Inventors
- 👤 Robert W Helda
- 👤 Harry J Geyer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 07:37
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/442; H10W70/464; H10W70/466; H10W72/00; H10W72/071; H10W72/077; H10W72/50; H10W72/551; H10W72/552; H10W72/5524; H10W72/701; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49169; Y10T29/49799; Y10T29/4981; Y10T29/53; Y10T29/5313; Y10T29/53174; Y10T29/53178
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
371 words
A method using assembly apparatus for attaching each of a plurality of semiconductor chips to corresponding independent groups of conductive portions with a continuous strip-like member, each semiconductor chip having a plurality of contact pads located within the lateral dimensions of the chip, said method comprising providing a flexible strip-like member having a plurality of spaced apart independent groups over the length of said member, each group comprising a plurality of conductive portions with each conductive portion having an inner end portion and each said group including an excess portion of the strip-like member outwardly of the conductive portions, positioning a group of conductive portions of the strip-like member in the assembly apparatus, providing a plurality of such semiconductor chips, with each chip adapted to be attached to an independent group of conductive portions of said striplike member at contact pads on said chip, aligning a semiconductor chip at its contact pads with respect to corresponding inner end portions each being spaced apart from one another in a predetermined pattern corresponding to the pattern in which the contact pads are placed on the semiconductor chip, maintaining in engagement with one another the contact pads on the semiconductor chip and a group of conductive portions with each inner end portion of a conductive portion in the group in alignment with and in engagement with a contact pad, attaching together by a substantially simultaneous operation said inner end portions of a group of conductive portions and said contact pads of a semiconductor chip in an electrical and mechanical connection within the lateral dimensions of the chip thereby to provide an independent assembly of a semiconductor chip and the conductive portions of a group, and any excess portion of the strip-like member with each group of conductive portions adapted to ultimately be removed so that the conductive portions each then serve as an independent electrical connection from a semiconductor chip contact pad, encapsulating said independent assembly so as to provide a round configuration for the external packaging for an encapsulated device, and severing the excess portion of the striplike member from said independent assembly to provide a useable encapsulated semiconductor device with conductive portions protruding from the encapsulation for electrical connections from said device.
Claim 2
Independent Claim
371 words
A method using assembly apparatus for attaching each of a plurality of semiconductor chips to corresponding independent groups of conductive portions with a continuous strip-like member, each semiconductor chip having a plurality of contact pads located within the lateral dimensions of the chip, said method comprising providing a flexible strip-like member having a plurality of spaced apart independent groups over the length of said member, each group comprising a plurality of conductive portions with each conductive portion having an inner end portion and each said group including an excess portion of the strip-like member outwardly of the conductive portions, positioning a group of conductive portions of the strip-like member in the assembly apparatus, providing a plurality of such semiconductor chips, with each chip adapted to be attached to an independent group of conductive portions of said striplike member at contact pads on said chip, aligning a semiconductor chip at its contact pads with respect to corresponding inner end portions each being spaced apart from one another in a predetermined pattern corresponding to the pattern in which the contact pads are placed on the semiconductor chip, maintaining in engagement with one another the contact pads on the semiconductor chip and a group of conductive portions with each inner end portion of a conductive portion in the group in alignment with and in engagement with a contact pad, attaching together by a substantially simultaneous operation said inner end portions of a group of conductive portions and said contact pads of a semiconductor chip in an electrical and mechanical connection within the lateral dimensions of the chip thereby to provide an independent assembly of a semiconductor chip and the conductive portions of a group, and any excess portion of the strip-like member with each group of conductive portions adapted to ultimately be removed so that the conductive portions each then serve as an independent electrical connection from a semiconductor chip contact pad, encapsulating said independent assembly so as to provide a round configuration for the external packaging for an encapsulated device, and severing the excess portion of the striplike member from said independent assembly to provide a useable encapsulated semiconductor device with conductive portions protruding from the encapsulation for electrical connections from said device.
Claim 3
Dependent Claim
471 words
A fabricating method utilizing fabricating equipment for making electrical connections without the use of fine wires from the multiple contact portions on a semiconductor integrated circuit unit to the outside of a device which utilizes said integrated citcuit unit, said method comprising providing two frame membErs each having conductive portions therewith, with the area occupied by the conductive portions of the first frame member being smaller in area dimension than the dimension of the area occupied by the conductive portions of the second frame member and the first frame member being of material which is more flexible than the material of the second frame member, with each said frame member being originally independent of the other and being originally capable of independent handling in practicing said fabricaring method, said first frame member having a plurality of conductive portions therewith, each of which conductive portion is separated at its inner end from adjacent inner ends of said conductive portions and all said conductive portions are provided in a pattern at said inner ends corresponding to the pattern of the contact portions on the integrated circuit unit, aligning said semiconductor unit and first frame member at said inner ends of said conductive portions of said first frame member and said corresponding multiple contact portions of said unit, providing two fabricating equipment means with one of said two means having a friction surface thereon for engagement with said inner end of each conductive portion in said first frame member, maintaining said contact portions and said inner ends in aligned engagement with one another, attaching substantially simultaneously, said aligned inner ends and said contact portions to provide an assembly of the first frame member and an integrated circuit unit which assembly is capable of independent handling, said second frame member having a plurality of conductive portions each of which is free at its inner end with respect to each other said inner ends, aligning the conductive portions of said first frame member at the outer end portion of each of its said conductive portions and the conductive portions of said second frame member at the inner end of each of said second frame member conductive portions, attaching in a substantially simultaneous operation said aligned conductive portions of said first and second frame members, severing from said first frame member a portion of each conductive portion thereof at a place laterally outwardly of the place of attachment of the respective conductive portions of said first and said second frame members, encapsulating the combination of an integrated circuit unit and the conductive portions of a first frame member with said conductive portions of said second frame member, and severing excess portions of said second frame member to provide a completed encapsulated integrated circuit with conductive portions of said second frame member being the leads from said circuit.
Claim 4
Dependent Claim
471 words
A fabricating method utilizing fabricating equipment for making electrical connections without the use of fine wires from the multiple contact portions on a semiconductor integrated circuit unit to the outside of a device which utilizes said integrated citcuit unit, said method comprising providing two frame membErs each having conductive portions therewith, with the area occupied by the conductive portions of the first frame member being smaller in area dimension than the dimension of the area occupied by the conductive portions of the second frame member and the first frame member being of material which is more flexible than the material of the second frame member, with each said frame member being originally independent of the other and being originally capable of independent handling in practicing said fabricaring method, said first frame member having a plurality of conductive portions therewith, each of which conductive portion is separated at its inner end from adjacent inner ends of said conductive portions and all said conductive portions are provided in a pattern at said inner ends corresponding to the pattern of the contact portions on the integrated circuit unit, aligning said semiconductor unit and first frame member at said inner ends of said conductive portions of said first frame member and said corresponding multiple contact portions of said unit, providing two fabricating equipment means with one of said two means having a friction surface thereon for engagement with said inner end of each conductive portion in said first frame member, maintaining said contact portions and said inner ends in aligned engagement with one another, attaching substantially simultaneously, said aligned inner ends and said contact portions to provide an assembly of the first frame member and an integrated circuit unit which assembly is capable of independent handling, said second frame member having a plurality of conductive portions each of which is free at its inner end with respect to each other said inner ends, aligning the conductive portions of said first frame member at the outer end portion of each of its said conductive portions and the conductive portions of said second frame member at the inner end of each of said second frame member conductive portions, attaching in a substantially simultaneous operation said aligned conductive portions of said first and second frame members, severing from said first frame member a portion of each conductive portion thereof at a place laterally outwardly of the place of attachment of the respective conductive portions of said first and said second frame members, encapsulating the combination of an integrated circuit unit and the conductive portions of a first frame member with said conductive portions of said second frame member, and severing excess portions of said second frame member to provide a completed encapsulated integrated circuit with conductive portions of said second frame member being the leads from said circuit.
Claim 5
Dependent Claim
47 words
In a method as defined in claim 2, said encapsulating being the securing together of a pair of ceramic members and sealing said ceramic members to maintain the same to package said combination of an integrated circuit and the conductive portions of first and second frame members.
Claim 6
Dependent Claim
47 words
In a method as defined in claim 1 with said encapsulating including the placing to the top and to the bottom respectively of said independent assembly, of a pair of insulating discs of round configuration, and securing said discs together to seal said assembly in said package.
Claim 7
Dependent Claim
38 words
In a method as defined in claim 1, said encapsulating including covering said independent assembly on top and bottom and all sides, and with said conductive portions protruding from the sides of said external packaging of round configuration.
References Cited (Backward Citations)
US3270399A
Cited
US3195026A
Cited
US3341649A
Cited
US3262022A
Cited
US3374537A
Cited
US3387359A
Cited
US3440027A
Cited
US3469684A
Cited
US3421204A
Cited
US3483308A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-10-17 | 1976-04-17 | 1976-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-10-17 | 1980-04-17 | 1980-10-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-10-17 | 1984-04-17 | 1984-10-17 | $7700.00 | Window Closed / Lapsed |