US6429528B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multichip semiconductor package
Assignee: Micron Technology Inc
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Filing: 1998-02-27
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Granted: 2002-08-06
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Expires: 2018-02-27
Abstract
Abstract A multichip semiconductor package, and method of making is provided that has a plurality of semiconductor chips fabricated in electrical isolation one from another integrally on a singular coextensive substrate useful for numerous and varied semiconductor chip applications. The semiconductor chips, instead of being singulated into a plurality of single-chip packages, are kept as integrally formed together and are thereafter electrically connected together so as to form a larger circuit. Encapsulated follows so as to form a single, multichip package. Common signals of the plurality of semiconductor chips are bussed together in electrical common across the substrate to a common electrode suitable for electrically providing the signal to another, external circuit, such as a PWB. The common bussing is achieved by conductive leads disposed across the substrate in pair sets having an extended portion that accommodates the common electrode in contact therewith. The common electrode contacts the conductive lead through an opening formed in the encapsulant that surrounds the substrate. The extended portions of each conductive lead are staggered with respect to the extended portion of the conductive lead in the same, or juxtaposed, pair set. In this manner, multiple electrodes are available for close proximity positioning while, simultaneously, avoiding electrical shorts amongst the pair sets.
Inventors
- 👤 Jerrold L. King
- 👤 Jerry M. Brooks
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:46
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W74/00; H10W74/10; H10W74/111; H10W74/129; H10W90/00; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/851; H10W72/853; H10W72/865; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
130 words
A multichip package, comprising: a plurality of electrically isolated semiconductor chips situated upon a semiconductor substrate that is a unitary, separated piece of a semiconductor wafer; a plurality of conductive leads, not integrally fabricated into the semiconductor substrate, that electrically connect the electrically isolated semiconductor chips on the semiconductor substrate; a compound encapsulating at least a portion of the semiconductor substrate; and a plurality of solder balls for electrically communicating with the semiconductor chips through said compound; wherein each conductive lead has an extended portion of increased surface area on one side thereof that makes contact with a solder ball of the plurality of solder balls and has a linear portion with no extended portion on an opposite side thereof that faces a linear portion of an adjacent conductive lead.
Claim 2
Dependent Claim
130 words
A multichip package, comprising: a plurality of electrically isolated semiconductor chips situated upon a semiconductor substrate that is a unitary, separated piece of a semiconductor wafer; a plurality of conductive leads, not integrally fabricated into the semiconductor substrate, that electrically connect the electrically isolated semiconductor chips on the semiconductor substrate; a compound encapsulating at least a portion of the semiconductor substrate; and a plurality of solder balls for electrically communicating with the semiconductor chips through said compound; wherein each conductive lead has an extended portion of increased surface area on one side thereof that makes contact with a solder ball of the plurality of solder balls and has a linear portion with no extended portion on an opposite side thereof that faces a linear portion of an adjacent conductive lead.
Claim 3
Dependent Claim
22 words
A multichip package according to claim 1 , wherein said solder balls project from the semiconductor chips to extend above said compound.
Claim 4
Dependent Claim
24 words
A multichip package according to claim 2 , wherein said solder balls are arranged linearly across said semiconductor substrate in at least two lines.
Claim 5
Dependent Claim
25 words
A multichip package according to claim 3 , wherein said plurality of conductive leads provide electrical communication between said solder balls and said semiconductor chips.
Claim 6
Dependent Claim
48 words
A multichip package according to claim 1 , wherein: the plurality of electrically isolated semiconductor chips comprise a linear series of adjacent chips; and the plurality of conductive leads run substantially parallel to the linear series of adjacent chips and electrically connect each chip to each adjacent chip.
Claim 7
Dependent Claim
177 words
A multichip semiconductor package, comprising: a plurality of electrically isolated semiconductor chips situated upon a semiconductor substrate that is a unitary, separated piece of a semiconductor wafer, each semiconductor chip having an active device formed thereon; a plurality of bond pads, each bond pad being electrically connected one per each said active device; a plurality of conductive leads, not integrally fabricated into the semiconductor substrate, that electrically connect the electrically isolated semiconductor chips, each conductive lead being electrically connected one per each bond pad; a compound encapsulating at least a portion of the semiconductor substrate, said bond pads, and said conductive leads; and a plurality of solder balls each extending through said compound to make contact with a respective one of said conductive leads; wherein each conductive lead has an extended portion of increased surface area on one side thereof that makes contact with a solder ball of the plurality of solder balls and has a linear portion with no extended portion on an opposite side thereof that faces a linear portion of an adjacent conductive lead.
Claim 8
Dependent Claim
177 words
A multichip semiconductor package, comprising: a plurality of electrically isolated semiconductor chips situated upon a semiconductor substrate that is a unitary, separated piece of a semiconductor wafer, each semiconductor chip having an active device formed thereon; a plurality of bond pads, each bond pad being electrically connected one per each said active device; a plurality of conductive leads, not integrally fabricated into the semiconductor substrate, that electrically connect the electrically isolated semiconductor chips, each conductive lead being electrically connected one per each bond pad; a compound encapsulating at least a portion of the semiconductor substrate, said bond pads, and said conductive leads; and a plurality of solder balls each extending through said compound to make contact with a respective one of said conductive leads; wherein each conductive lead has an extended portion of increased surface area on one side thereof that makes contact with a solder ball of the plurality of solder balls and has a linear portion with no extended portion on an opposite side thereof that faces a linear portion of an adjacent conductive lead.
Claim 9
Dependent Claim
20 words
A multichip package according to claim 6 , wherein said conductive leads are disposed in pairs across said semiconductor substrate.
Claim 10
Dependent Claim
33 words
A multichip package according to claim 7 , wherein each pair of conductive leads has two extended portions of increased surface area to accommodate two solder balls of said plurality of solder balls.
Claim 11
Dependent Claim
145 words
A multichip package, comprising: a plurality of electrically isolated semiconductor chips situated upon a semiconductor substrate that is a unitary, separated piece of a semiconductor wafer; a compound encapsulating at least a portion of said semiconductor substrate; a plurality of electrodes, not integrally fabricated into the unitary, separated piece of the semiconductor wafer, in electrical communication with at least one of said plurality of semiconductor chips through said compound; and a plurality of conductive leads, not integrally fabricated into the unitary, separated piece of the semiconductor wafer; wherein each conductive lead is positioned over the semiconductor substrate and has an extended portion of increased surface area on one side thereof that makes contact with an electrode of said plurality of electrodes and has a linear portion with no extended portion on an opposite side thereof that faces a linear portion of an adjacent conductive lead.
Claim 12
Dependent Claim
145 words
A multichip package, comprising: a plurality of electrically isolated semiconductor chips situated upon a semiconductor substrate that is a unitary, separated piece of a semiconductor wafer; a compound encapsulating at least a portion of said semiconductor substrate; a plurality of electrodes, not integrally fabricated into the unitary, separated piece of the semiconductor wafer, in electrical communication with at least one of said plurality of semiconductor chips through said compound; and a plurality of conductive leads, not integrally fabricated into the unitary, separated piece of the semiconductor wafer; wherein each conductive lead is positioned over the semiconductor substrate and has an extended portion of increased surface area on one side thereof that makes contact with an electrode of said plurality of electrodes and has a linear portion with no extended portion on an opposite side thereof that faces a linear portion of an adjacent conductive lead.
Claim 13
Dependent Claim
22 words
A multichip package according to claim 9 , wherein said conductive lead has an electrode bond area for contacting with said electrode.
Claim 14
Dependent Claim
21 words
A multichip package according to claim 9 , further comprising a wiring bank extending about a periphery of said semiconductor substrate.
Claim 15
Dependent Claim
33 words
A multichip package according to claim 11 wherein said semiconductor substrate further comprises a plurality of wiring banks extending about said periphery and arranged in a plurality of at least two parallel rows.
Claim 16
Dependent Claim
17 words
A multichip package according to claim 9 , wherein said compound encapsulates all of said semiconductor substrate.
Claim 17
Dependent Claim
31 words
The multichip package according to claim 9 , wherein the number of said electrically isolated semiconductor chips on the unitary, separated piece of the semiconductor wafer is not greater than 64.
Claim 18
Dependent Claim
31 words
The multichip package according to claim 9 , wherein the number of said electrically isolated semiconductor chips on the unitary, separated piece of the semiconductor wafer is from 2 to 8.
Claim 19
Dependent Claim
241 words
A multichip package, comprising: a plurality of electrically isolated semiconductor chips in a unitary, separated piece of a semiconductor wafer, each said chip having an electrical device therein; a compound encapsulating at least a portion of said unitary, separated piece; a plurality of electrodes, not integrally fabricated into the unitary, separated piece of the semiconductor wafer, in electrical communication with at least one of said plurality of semiconductor chips through said compound; a plurality of conductive leads, not integrally fabricated into the unitary, separated piece of the semiconductor wafer, electrically connecting between said electrodes and said at least one of said electrically isolated semiconductor chips; a plurality of electrical connections each being in electrical communication with one said electrical device of one of said semiconductor chips; and electrical wiring upon the unitary, separated piece of the semiconductor wafer, not integrally fabricated into the unitary, separated piece of the semiconductor wafer, in electrical communication with said plurality of electrical connections so as to place said electrically isolated semiconductor chips on the unitary, separated piece of the semiconductor wafer in electrical communication one with another; wherein each conductive lead is positioned over the semiconductor substrate and has an extended portion of increased surface area on one side thereof that makes contact with an electrode of said plurality of electrodes and has a linear portion with no extended portion on an opposite side thereof that faces a linear portion of an adjacent conductive lead.
Claim 20
Dependent Claim
241 words
A multichip package, comprising: a plurality of electrically isolated semiconductor chips in a unitary, separated piece of a semiconductor wafer, each said chip having an electrical device therein; a compound encapsulating at least a portion of said unitary, separated piece; a plurality of electrodes, not integrally fabricated into the unitary, separated piece of the semiconductor wafer, in electrical communication with at least one of said plurality of semiconductor chips through said compound; a plurality of conductive leads, not integrally fabricated into the unitary, separated piece of the semiconductor wafer, electrically connecting between said electrodes and said at least one of said electrically isolated semiconductor chips; a plurality of electrical connections each being in electrical communication with one said electrical device of one of said semiconductor chips; and electrical wiring upon the unitary, separated piece of the semiconductor wafer, not integrally fabricated into the unitary, separated piece of the semiconductor wafer, in electrical communication with said plurality of electrical connections so as to place said electrically isolated semiconductor chips on the unitary, separated piece of the semiconductor wafer in electrical communication one with another; wherein each conductive lead is positioned over the semiconductor substrate and has an extended portion of increased surface area on one side thereof that makes contact with an electrode of said plurality of electrodes and has a linear portion with no extended portion on an opposite side thereof that faces a linear portion of an adjacent conductive lead.
Claim 21
Dependent Claim
29 words
The multichip package according to claim 16 , wherein: said conductive leads comprise a plurality of parallel conductive leads; and each said conductive lead has thereon a solder ball.
Claim 22
Dependent Claim
74 words
The multichip package according to claim 17 , wherein said plurality of parallel conductive leads comprise consecutive first, second, third, and fourth leads, wherein the geometric centers of the respective solder balls on the first and third leads form a line that is: perpendicular to said plurality of parallel conductive leads; and parallel to a line that is formed by the geometric centers of the respective solder balls on the second and fourth leads.
Claim 23
Dependent Claim
63 words
The multichip package according to claim 18 , wherein: a tangent to the periphery of the solder ball on the second lead intersects the solder ball on the third lead; and said tangent is parallel to said plurality of parallel conductive leads and is taken at a point on the solder ball on the second lead that is closest to the third lead.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-08-05 | 2006-02-04 | 2006-08-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-08-05 | 2010-02-04 | 2010-08-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-08-05 | 2014-02-04 | 2014-08-06 | $7700.00 | Window Closed / Lapsed |