US5989941A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Encapsulated integrated circuit packaging
Assignee: Micron Technology Inc
•
Filing: 1997-12-12
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Granted: 1999-11-23
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Expires: 2017-12-12
Abstract
Abstract An encapsulated integrated circuit package uses a heat dissipating dam which is secured about the die to the die support. A dam constrains the outward movement of liquid glob top material during the manufacturing process. In addition, the dam provides heat dissipating properties for the integrated circuit package and may improve the structural integrity of the package as well. The dam may be efficiently applied to the die support using automated techniques, such as adhesive tape bonding.
Inventors
- 👤 Richard W. Wensel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 23:47
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
62 words
A method of forming an encapsulated packaging comprising the steps of: securing a die to a die mounting; wire bonding said die; coating a metal on one side of a film; applying adhesive to the other side; forming a central aperture in said film to form a dam; securing the metallic dam around said die; and encapsulating said die with an encapsulant.
Claim 2
Independent Claim
62 words
A method of forming an encapsulated packaging comprising the steps of: securing a die to a die mounting; wire bonding said die; coating a metal on one side of a film; applying adhesive to the other side; forming a central aperture in said film to form a dam; securing the metallic dam around said die; and encapsulating said die with an encapsulant.
Claim 3
Dependent Claim
23 words
The method of claim 1 including applying an adhesive to said dam and adhesively securing said dam to said mounting around said die.
Claim 4
Dependent Claim
23 words
The method of claim 2 including the step of applying adhesive tape to said dam to adhesively secure said dam to said mounting.
Claim 5
Dependent Claim
15 words
The method of claim 3 including the step of dissipating heat through said metallic dam.
Claim 6
Dependent Claim
15 words
The method of claim 4 including the step of constraining said encapsulant using said dam.
Claim 7
Dependent Claim
25 words
The method of claim 1 including the steps of forming a roll of metal coated film, unwinding said roll, and severing dams from said roll.
Claim 8
Independent Claim
58 words
A method of forming dams for encapsulated integrated circuit packages comprising the steps of: coating a film on one said with a layer of heat dissipating material; coating the other side of said film with adhesive; forming a roll of said film; and severing sections of said film to form dams for controlling the spreading of an encapsulant.
Claim 9
Independent Claim
58 words
A method of forming dams for encapsulated integrated circuit packages comprising the steps of: coating a film on one said with a layer of heat dissipating material; coating the other side of said film with adhesive; forming a roll of said film; and severing sections of said film to form dams for controlling the spreading of an encapsulant.
Claim 10
Dependent Claim
13 words
The method of claim 7 including coating the film with a metallic layer.
References Cited (Backward Citations)
US5441918A
Cited
US5696033A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-22 | 2003-05-24 | 2003-11-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-22 | 2007-05-24 | 2007-11-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-22 | 2011-05-24 | 2011-11-23 | $7700.00 | Window Closed / Lapsed |