US5956236A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package support system
Assignee: Round Rock Research LLC
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Filing: 1998-09-14
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Granted: 1999-09-21
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Expires: 2018-09-14
Abstract
Abstract A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card. The packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.
Inventors
- 👤 David J. Corisis
- 👤 Walter L. Moden
- 👤 Terry R. Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:47
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/301; H10; H10W; H10W90/00
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
52 words
A computer system, comprising: a printed circuit board; an integrated circuit device connected to and extending away from said board; and a device arranged to engage said integrated circuit device to prevent relative movement between said board and said integrated circuit device, said device formed at least in part of plastic foam.
Claim 2
Dependent Claim
52 words
A computer system, comprising: a printed circuit board; an integrated circuit device connected to and extending away from said board; and a device arranged to engage said integrated circuit device to prevent relative movement between said board and said integrated circuit device, said device formed at least in part of plastic foam.
Claim 3
Dependent Claim
14 words
The system of claim 1 wherein said foam resiliently engages said integrated circuit device.
Claim 4
Dependent Claim
26 words
The system of claim 1 wherein said device is formed with at least one slot therein, said slot sized to resiliently engage said integrated circuit device.
Claim 5
Dependent Claim
22 words
The system of claim 2 wherein said foam includes adhesive on its bottom to secure said foam to said printed circuit board.
Claim 6
Dependent Claim
11 words
The system of claim 3 wherein said foam is heat expandable.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-09-20 | 2003-03-22 | 2003-09-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-09-20 | 2007-03-22 | 2007-09-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-09-20 | 2011-03-22 | 2011-09-21 | $7700.00 | Window Closed / Lapsed |