US5786985A — Semiconductor device and semiconductor device unit

Claim 1

Independent Claim 212 words

A semiconductor device adapted to be surface mounted on a circuit substrate in an approximate vertical position, said semiconductor device comprising: a semiconductor chip; a stage having a first surface and a second surface opposite to the first surface, said semiconductor chip being directly mounted on the first surface and said second surface defining a back plane of the semiconductor device such that substantially none of the semiconductor device extends beyond the second surface; a resin package encapsulating said semiconductor chip with the second surface of the stage not being covered by the encapsulation, said resin package having upper and lower surfaces and side surfaces extending from the upper to the lower surfaces, one of the side surfaces of the resin package being substantially planar, to match the second surface of the stage and enable stacking of semiconductor devices; a plurality of leads respectively having one end electrically connected to said semiconductor chip and another end extending downwardly from the lower surface of said resin package and being curved for surface mounting connection on a circuit substrate; an upper extension, provided on said stage, extending upwardly from the upper surface of said resin package; and a side extension, provided on said stage, extending sideways from the side surface of said resin package.

Claim 2

Dependent Claim 212 words

A semiconductor device adapted to be surface mounted on a circuit substrate in an approximate vertical position, said semiconductor device comprising: a semiconductor chip; a stage having a first surface and a second surface opposite to the first surface, said semiconductor chip being directly mounted on the first surface and said second surface defining a back plane of the semiconductor device such that substantially none of the semiconductor device extends beyond the second surface; a resin package encapsulating said semiconductor chip with the second surface of the stage not being covered by the encapsulation, said resin package having upper and lower surfaces and side surfaces extending from the upper to the lower surfaces, one of the side surfaces of the resin package being substantially planar, to match the second surface of the stage and enable stacking of semiconductor devices; a plurality of leads respectively having one end electrically connected to said semiconductor chip and another end extending downwardly from the lower surface of said resin package and being curved for surface mounting connection on a circuit substrate; an upper extension, provided on said stage, extending upwardly from the upper surface of said resin package; and a side extension, provided on said stage, extending sideways from the side surface of said resin package.

Claim 3

Dependent Claim 17 words

The semiconductor device as claimed in claim 1, wherein said upper extension has at least one hole.

Claim 4

Dependent Claim 22 words

The semiconductor device as claimed in claim 1, which further comprises: bonding means bonding said stage with respect to said resin package.

Claim 5

Dependent Claim 21 words

The semiconductor device as claimed in claim 1, which further comprises: at least one radiator groove provided on said resin package.

Claim 6

Dependent Claim 35 words

The semiconductor device as claimed in claim 1 which further comprises: a pair of vertical portions provided vertically on both sides of said stage; and a positioning groove provided between said pair of vertical portions.

Claim 7

Dependent Claim 29 words

The semiconductor device as claimed in claim 1, wherein ends of said leads extending downwardly from the lower surface of said resin package are held by said resin package.

Claim 8

Dependent Claim 27 words

The semiconductor device as claimed in claim 1, wherein ends of said leads extending downwardly from the lower surface of said resin package have an approximate L-shape.

Claim 9

Dependent Claim 27 words

The semiconductor device as claimed in claim 1, wherein ends of said leads extending downwardly from the lower surface of said resin package have a straight shape.

Claim 10

Dependent Claim 145 words

A semiconductor device adapted to be mounted on a circuit substrate in an approximate vertical position, said semiconductor device comprising: a semiconductor chip; a stage having a first surface and a second surface opposite to the first surface, said semiconductor chip being mounted on the first surface; a resin package encapsulating said semiconductor chip, said resin package having upper and lower surfaces and side surfaces; a plurality of leads respectively having one end electrically connected to said semiconductor chip and another end extending downwardly from the lower surface of said resin package; an upper extension, provided on said stage, extending upwardly from the upper surface of said resin package; a pair of vertical portions provided vertically on both sides of said stage; a positioning groove provided between said pair of vertical portions; and a positioning hole provided in each of said pair of vertical portions.

Claim 11

Dependent Claim 145 words

A semiconductor device adapted to be mounted on a circuit substrate in an approximate vertical position, said semiconductor device comprising: a semiconductor chip; a stage having a first surface and a second surface opposite to the first surface, said semiconductor chip being mounted on the first surface; a resin package encapsulating said semiconductor chip, said resin package having upper and lower surfaces and side surfaces; a plurality of leads respectively having one end electrically connected to said semiconductor chip and another end extending downwardly from the lower surface of said resin package; an upper extension, provided on said stage, extending upwardly from the upper surface of said resin package; a pair of vertical portions provided vertically on both sides of said stage; a positioning groove provided between said pair of vertical portions; and a positioning hole provided in each of said pair of vertical portions.

Claim 12

Dependent Claim 126 words

A semiconductor device unit comprising: a holder having an upper portion with an opening; and a plurality of semiconductor devices arranged in parallel at approximately vertical positions within said holder, each of said semiconductor devices comprising: a semiconductor chip; a stage having a first surface and a second surface opposite to the first surface, said semiconductor chip being mounted on the first surface; a resin package encapsulating said semiconductor chip, said resin package having upper and lower surfaces and side surfaces; a plurality of leads respectively having one end electrically connected to said semiconductor chip and another end extending downwardly from the lower surface of said resin package; and an upper extension, provided on said stage, extending upwardly from the upper surface of said resin package.

Claim 13

Dependent Claim 126 words

A semiconductor device unit comprising: a holder having an upper portion with an opening; and a plurality of semiconductor devices arranged in parallel at approximately vertical positions within said holder, each of said semiconductor devices comprising: a semiconductor chip; a stage having a first surface and a second surface opposite to the first surface, said semiconductor chip being mounted on the first surface; a resin package encapsulating said semiconductor chip, said resin package having upper and lower surfaces and side surfaces; a plurality of leads respectively having one end electrically connected to said semiconductor chip and another end extending downwardly from the lower surface of said resin package; and an upper extension, provided on said stage, extending upwardly from the upper surface of said resin package.

Claim 14

Dependent Claim 36 words

The semiconductor device unit as claimed in claim 10, which further comprises: a cap closing the opening of said holder and making contact with the upper extension of each of said semiconductor devices within said holder.

Claim 15

Dependent Claim 25 words

The semiconductor device unit as claimed in claim 11, wherein said holder and said cap are made of a material having a good heat conductance.

Claim 16

Dependent Claim 27 words

The semiconductor device unit as claimed in claim 10, which further comprises: holding means holding said semiconductor devices within said holder by engaging with said semiconductor devices.

Claim 17

Dependent Claim 38 words

The semiconductor device unit as claimed in claim 10, wherein said holder has an outer wall portion, and said semiconductor device unit further comprises at least one radiator fin provided on the outer wall portion of said holder.

Claim 18

Dependent Claim 33 words

The semiconductor device unit as claimed in claim 10, which further comprises: engaging claws provided on said holder and holding said semiconductor devices by engaging with the bottom surface of each resin package.

Claim 19

Dependent Claim 38 words

The semiconductor device unit as claimed in claim 11, wherein said cap has an upper surface portion, and said semiconductor device unit further comprises at least one radiator fin provided on the upper surface portion of said cap.

Claim 20

Dependent Claim 96 words

The semiconductor device unit as claimed in claim 10, wherein: each of said semiconductor devices further comprise: pair of vertical portions provided vertically on both sides of said stage; and a positioning groove provided between said pair of vertical portions, and said holder comprises: an upper surface portion; and a pair of side surface portions provided on both sides of said upper surface portion, said upper surface portion fitting into the positioning groove of each of said semiconductor devices to collectively position said semiconductor devices, said side surface portions sandwiching said semiconductor devices in parallel arrangement.

Claim 21

Dependent Claim 28 words

The semiconductor device unit as claimed in claim 10, which further comprises: a bonding agent having a high heat conduction and holding at least adjacent semiconductor devices together.

Claim 22

Dependent Claim 25 words

The semiconductor device unit as claimed in claim 18, wherein said bonding agent is selected from a group consisting of thermoplastic materials and silicon grease.

Claim 23

Dependent Claim 173 words

A semiconductor device unit comprising: at least one positioning shaft; and a plurality of semiconductor devices arranged in parallel at approximately vertical positions, each of said semiconductor devices comprising: a semiconductor chip; a stage having a first surface and a second surface opposite to the first surface, said semiconductor chip being mounted on the first surface; a resin package encapsulating said semiconductor chip, said resin package having upper and lower surfaces and side surfaces; a plurality of leads respectively having one end electrically connected to said semiconductor chip and another end extending downwardly from the lower surface of said resin package; an upper extension, provided on said stage, extending upwardly from the upper surface of said resin package; a pair of vertical portions provided vertically on both sides of said stage; a positioning groove provided between said pair of vertical portions; and a positioning hole provided in each of said pair of vertical portions, said positioning shaft penetrating the positioning hole in each of said semiconductor devices to collectively position said semiconductor devices.

Claim 24

Dependent Claim 173 words

A semiconductor device unit comprising: at least one positioning shaft; and a plurality of semiconductor devices arranged in parallel at approximately vertical positions, each of said semiconductor devices comprising: a semiconductor chip; a stage having a first surface and a second surface opposite to the first surface, said semiconductor chip being mounted on the first surface; a resin package encapsulating said semiconductor chip, said resin package having upper and lower surfaces and side surfaces; a plurality of leads respectively having one end electrically connected to said semiconductor chip and another end extending downwardly from the lower surface of said resin package; an upper extension, provided on said stage, extending upwardly from the upper surface of said resin package; a pair of vertical portions provided vertically on both sides of said stage; a positioning groove provided between said pair of vertical portions; and a positioning hole provided in each of said pair of vertical portions, said positioning shaft penetrating the positioning hole in each of said semiconductor devices to collectively position said semiconductor devices.

Claim 25

Dependent Claim 28 words

The semiconductor device unit as claimed in claim 20, which further comprises: a bonding agent having a high heat conduction and holding at least adjacent semiconductor devices together.

Claim 26

Dependent Claim 25 words

The semiconductor device unit as claimed in claim 21, wherein said bonding agent is selected from a group consisting of thermoplastic materials and silicon grease.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2001-07-27	2002-01-26	2002-07-28	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2005-07-27	2006-01-26	2006-07-28	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2009-07-27	2010-01-26	2010-07-28	$7700.00	Window Closed / Lapsed

Semiconductor device and semiconductor device unit

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