Semiconductor device with surface mount package adapted for vertical mounting

Claim 2

A semiconductor device comprising: a semiconductor element; a stage having a side and a first edge, the stage supporting the semiconductor element on the side thereof and such that the semiconductor element is vertically oriented relatively to, and disposed above, a horizontally oriented circuit board and with the first edge of the stage facing and displaced from the horizontally oriented circuit board; a stacked layer structure having a plurality of wiring boards arranged in a stacked formation and a plate layer, having a second edge, the stacked layer structure being supported on the side of the stage adjacent the semiconductor element and each of the wiring boards comprising plural wiring lines making corresponding, plural external connections with the semiconductor element; and first supporting members extending, in spaced relationship, from the first edge of the stage and second supporting members extending, in spaced relationship, from the second edge of the plate layer, the first and second supporting members commonly extending toward the circuit board and having respective first and second portions extending in respective and different, first and second directions parallel to the surface of, and contacting, the circuit board thereby to support the semiconductor device in the vertically oriented position thereof above the circuit board.

Claim 3

The semiconductor device as claimed in claim 1, wherein the first direction of the first portions of the first supporting members is opposite to the second direction of the second portions of the second supporting members.

Claim 4

The semiconductor device as claimed in claim 2, wherein: the stage with the stackedlayer structure supported thereon, together, define first and second spaced main surfaces of the semiconductor device; and the respective first and second portions of the first and second support members extend transversely to, and beyond, the corresponding first and second main surfaces of the semiconductor device.

Claim 5

The semiconductor device as claimed in claim 1, wherein: the stage with the stacked layer structure supported thereon, together, define first and second spaced main surfaces of the semiconductor device; and the respective first and second portions of the first and second support members extend transversely to, and beyond, the corresponding first and second spaced main surfaces of the semiconductor device.

Claim 6

The semiconductor device as claimed in claim 1, wherein each of the first and second supporting members has an approximately L-shaped configuration.

Claim 7

The semiconductor device as claimed in claim 1, wherein the stacked layer structure has a window therein, within which the semiconductor element is located and received when the stacked layer structure is supported on the stage having the semiconductor element supported thereon and such that the stacked layer structure is in surrounding relationship relative to the semiconductor element.

Claim 8

The semiconductor device as claimed in claim 1, wherein the first and second portions of the first and second supporting members extend transversely to the corresponding first and second edges, respectively, of the stage and the at least one plate layer.

Claim 9

The semiconductor device as claimed in claim 1, wherein: the semiconductor element has at least two sides; and the plural wiring lines of each wiring board are arranged in plural groups, each group comprising plural wiring lines and disposed to make external connections with the semiconductor element at a corresponding side thereof.

Claim 10

The semiconductor device as claimed in claim 1, wherein each of the wiring lines has an end and the ends of the wiring lines extend beyond the respective first and second edges of the stage and the plate layer.

Claim 11

The semiconductor device as claimed in claim 1, wherein the plate layer is interposed between two wiring boards of the stacked layer structure.

Claim 12

The semiconductor device as claimed in claim 1, wherein: the first supporting members extend from respective, first and second opposite end portions of the stage and define a central portion of the first edge of the stage therebetween; and the second supporting members extend from respective first and second opposite end portions of the second edge of the plate layer and define a central portion of the second edge of the plate layer therebetween.

Claim 13

The semiconductor device as claimed in claim 11, wherein: each wiring board has a respective third edge, corresponding to the first edge of the stage and the second edge of the plate layer, having opposite end portions defining therebetween a central portion, corresponding respectively to the opposite end portions and the central portion of each of the first and second edges; and the wiring lines of each wiring board include end portions extending from the third edge thereof and disposed in spaced relationship along the central portion of the third edge thereof.

Claim 14

The semiconductor device as claimed in claim 1, wherein said wiring lines comprise signal wiring lines which are formed on the plurality of wiring boards and are used to carry signals required for a selected high response.

Claim 15

The semiconductor device as claimed in claim 1, wherein said stage comprises a metallic plate.

Claim 16

The semiconductor device as claimed in claim 1, wherein the plate layer comprises a metallic plate.

Claim 17

The semiconductor device as claimed in claim 1, wherein each of the first and second supporting members is an integral portion of the respectively corresponding stage and the plate layer.

Claim 18

The semiconductor device as claimed in claim 1, wherein the wiring lines comprise approximately cylindrical portions which are of a length, and are disposed, so as to contact the circuit board when the semiconductor device is supported thereon.

Claim 19

The semiconductor device as claimed in claim 1, wherein the wiring lines comprise lead-shaped portions.

Claim 20

The semiconductor device as claimed in claim 1, wherein said semiconductor element comprises a semiconductor chip.

Claim 21

A semiconductor device comprising: a semiconductor element; a stage having a side and a first edge, the stage supporting the semiconductor element on the side thereof and the semiconductor element thereby being vertically oriented relatively to, and disposed above, a horizontally oriented circuit board; a stacked layer structure having a plurality of wiring boards and a plate layer arranged in a stacked formation and having a second edge, the stacked layer structure being supported on the side of the stage adjacent the semiconductor element and each of the wiring boards comprising plural wiring lines making corresponding, plural external connections with the semiconductor element; and first supporting members extending, in spaced relationship, from the first edge of the stage and second supporting members extending, in spaced relationship, from the second edge of the stacked layer structure, the first and second supporting members extending toward the circuit board and having respective first and second portions extending in respective, different first and second directions parallel to the surface of and contacting the circuit board thereby to support the stage with the semiconductor element and the stacked layer structure in the vertically oriented position thereof above the circuit board.

Claim 22

A semiconductor device comprising: a semiconductor element; a stage having a side and a first edge, the stage supporting the semiconductor element on the side thereof and the semiconductor element thereby being vertically oriented relatively to, and disposed above, a horizontally oriented circuit board; a stacked layer structure having a plurality of wiring boards and a plate layer arranged in a stacked formation and having a second edge, the stacked layer structure being supported on the side of the stage adjacent the semiconductor element and each of the wiring boards comprising plural wiring lines making corresponding, plural external connections with the semiconductor element; and first supporting members extending, in spaced relationship, from the first edge of the stage and second supporting members extending, in spaced relationship, from the second edge of the stacked layer structure, the first and second supporting members extending toward the circuit board and having respective first and second portions extending in respective, different first and second directions parallel to the surface of and contacting the circuit board thereby to support the stage with the semiconductor element and the stacked layer structure in the vertically oriented position thereof above the circuit board.

Claim 23

A semiconductor device having first and second parallel main surfaces of a common, generally rectangular configuration of length and height dimensions substantially greater than a thickness dimension between the first and second parallel main surfaces, comprising: a stage of said generally rectangular configuration and having a semiconductor element mounting position thereon; a stacked layer structure comprising a plurality of wiring boards, each of said plurality of wiring boards having said generally rectangular configuration, and said plurality of wiring boards being arranged in parallel and stacked relationship, said stacked layer structure further having a plate layer of said generally rectangular configuration, said stacked layer structure defining a central window therein and being secured to the stage with the window disposed in surrounding relationship relative to the semiconductor element mounting position of the stage; said stage further comprising respective first supporting members extending from opposite end portions of the first edge of the stage and the first supporting members including corresponding, first terminal portions extending transversely to the parallel main surfaces; and said stacked layer structure further comprising respective second supporting members extending from opposite end portions of the second edge of the stacked layer structure and the second supporting members including corresponding, second terminal portions extending transversely to the parallel main surfaces.

Claim 24

A semiconductor device having first and second parallel main surfaces of a common, generally rectangular configuration of length and height dimensions substantially greater than a thickness dimension between the first and second parallel main surfaces, comprising: a stage of said generally rectangular configuration and having a semiconductor element mounting position thereon; a stacked layer structure comprising a plurality of wiring boards, each of said plurality of wiring boards having said generally rectangular configuration, and said plurality of wiring boards being arranged in parallel and stacked relationship, said stacked layer structure further having a plate layer of said generally rectangular configuration, said stacked layer structure defining a central window therein and being secured to the stage with the window disposed in surrounding relationship relative to the semiconductor element mounting position of the stage; said stage further comprising respective first supporting members extending from opposite end portions of the first edge of the stage and the first supporting members including corresponding, first terminal portions extending transversely to the parallel main surfaces; and said stacked layer structure further comprising respective second supporting members extending from opposite end portions of the second edge of the stacked layer structure and the second supporting members including corresponding, second terminal portions extending transversely to the parallel main surfaces.