US5057969A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thin film electronic device
Assignee: International Business Machines Corp
•
Filing: 1990-09-07
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Granted: 1991-10-15
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Expires: 2010-09-07
Abstract
Abstract A thin film electronic package which utilizes a circuitized substrate (e.g., a printed circuit board) having a flexible film carrier electrically coupled thereto. The film carrier includes a dielectric layer (e.g., polyimide) with first and second circuit layers located on opposite sides thereof. These circuit layers are interconnected, electrically, through the dielectric. An electronic device (e.g., semiconductor chip) is electrically connected to bridging portions of the conductive leads of the carrier's first circuit layer, which bridging portions extend across apertures provided within the dielectric. A plurality of solder elements are utilized to provide electrical connection between respective contact locations of the electronic device and respective bridging portions of the first layer's conductive leads.
Inventors
- 👤 Joseph G. Ameen
- 👤 Joseph Funari
- 👤 John A. Goldfuss, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 22:51
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/688; H05K1/18; H05K1/189; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K2203/00; H05K2203/08; H05K2203/087; H05K3/325; H05K3/326; H05K3/3494; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
179 words
An electronic package comprising: a circuitized substrate; a flexible film carrier electrically coupled to said substrate and including a dielectric layer having a first plurality of apertures therein, a first circuit layer located on one side of said dielectric layer and a second circuit layer located on a second side of said dielectric layer opposite said first side and electrically connected to said first layer at selected locations through said dielectric layer, said first circuit layer including a first plurality of conductive leads each having a portion thereof bridging a respective one of said apertures within said dielectric layer; an electronic device including a plurality of contact locations thereon electrically connected to respective ones of said portions of said conductive leads of said first circuit layer which bridge said apertures within said dielectric layer; and a plurality of solder elements, each of said elements providing electrical connection between said contact locations of said electronic device and said respective ones of said portions of said conductive leads of said first circuit layer which bridge said apertures within said dielectric layer.
Claim 2
Dependent Claim
179 words
An electronic package comprising: a circuitized substrate; a flexible film carrier electrically coupled to said substrate and including a dielectric layer having a first plurality of apertures therein, a first circuit layer located on one side of said dielectric layer and a second circuit layer located on a second side of said dielectric layer opposite said first side and electrically connected to said first layer at selected locations through said dielectric layer, said first circuit layer including a first plurality of conductive leads each having a portion thereof bridging a respective one of said apertures within said dielectric layer; an electronic device including a plurality of contact locations thereon electrically connected to respective ones of said portions of said conductive leads of said first circuit layer which bridge said apertures within said dielectric layer; and a plurality of solder elements, each of said elements providing electrical connection between said contact locations of said electronic device and said respective ones of said portions of said conductive leads of said first circuit layer which bridge said apertures within said dielectric layer.
Claim 3
Dependent Claim
34 words
The electronic package according to claim 1 wherein said circuitized substrate comprises a printed circuit board having a plurality of contact sites thereon, said flexible film carrier being electrically connected to said contact sites.
Claim 4
Dependent Claim
103 words
The electronic package according to claim 2 wherein said dielectric layer further includes a second plurality of apertures therein and said first circuit layer further includes a second plurality of conductive leads each having a portion thereof bridging a respective one of said apertures of said second plurality of apertures, and a second plurality of solder elements, each of said elements of said second plurality providing electrical connection between a respective one of said contact sites and a respective one of said portions of said conductive leads of said second plurality of leads which bridge said apertures of said second plurality of apertures.
Claim 5
Dependent Claim
15 words
The electronic package according to claim 1 wherein said dielectric layer is comprised of polymide.
Claim 6
Dependent Claim
22 words
The electronic package according to claim 4 wherein said first and said second circuit layers are each comprised of chromium and copper.
Claim 7
Dependent Claim
28 words
The electronic package according to claim 1 wherein each of said solder elements of said first and second pluralities of solder elements is comprised of tin and lead.
Claim 8
Dependent Claim
37 words
The electronic package according to claim 6 wherein said solder elements of said first plurality are each comprised of 3:97 tin-lead solder and said solder elements of said second plurality are each comprised of 60:40 tin-lead solder.
Claim 9
Dependent Claim
23 words
The electronic package according to claim 1 further including a heat sink member, said electronic device thermally coupled to said heat sink member.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-10-14 | 1995-04-15 | 1995-10-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-10-14 | 1999-04-15 | 1999-10-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-10-14 | 2003-04-15 | 2003-10-15 | $7700.00 | Window Closed / Lapsed |