Method and apparatus for soldering

Abstract

Abstract PURPOSE: To automatically and efficiently solder the material to be soldered without using soldering iron, by fusing solder jetting the hot air. CONSTITUTION: The material to be soldered is placed at the lower part of the pipe for heater 2 and the lower tip of the positioning rod 8, 8a are contacted with positioning part of the material to be soldered, descending the heater attaching base 5 together with the head base 1. Next, air is sent into the pipe 2 and the material to be soldered is heated blowing above 600°C of hot air heated by the heater 6. Moreover, a fixed amount of stringy solder is drawn out after a few seconds and is contacted with the material to be soldered projecting at a fixed position. The above solder is fused by the hot air and a good soldering is carried out on the material to be soldered. Labor, such as chip exchange etc. is unnecessary by the above method cause soldering iron is not used. COPYRIGHT: (C)1979,JPO&Japio

Inventors

• 👤 Tadayoshi Yamada
• 👤 Yuichi Moriyama
• 👤 Takao Hisakado

Bibliographic Details