US4849856A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic package with improved heat sink
Assignee: International Business Machines Corp
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Filing: 1988-07-13
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Granted: 1989-07-18
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Expires: 2008-07-13
Abstract
Abstract An electronic package including a first substrate (e.g., printed circuit board), a semiconductor device (e.g., silicon chip), a second circuitized substrate (e.g. polyimide having chrome-copper chrome circuitry thereon) and a heat sink (e.g., extruded aluminum or copper). The heat sink includes pliant members (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.
Inventors
- 👤 Joseph Funari
- 👤 Mary C. Green
- 👤 Scott D. Reynolds
- 👤 Bahgat G. Sammakia
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 14:40
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
158 words
An electronic package comprising: a first circuitized substrate; a semiconductor device electrically coupled to said first circuitized substrate; a second circuitized substrate of flexible nature electrically connected to said first circuitized substrate and said semiconductor device for providing said electrical coupling between said first circuitized substrate and said semiconductor device; and a heat sink positioned on said first circuitized substrate and having said semiconductor device attached thereto at a location between said heat sink and said first circuitized substrate, said heat sink including integral pliant means for positioning said heat sink on said first circuitized substrate and for enabling said heat sink to be depressed a predetermined distance relative to said first circuitized substrate without damaging said semiconductor device, said pliant means engaging a surface of said first circuitized substrate at a spaced location from said second circuitized substrate such that said pliant means does not contact said second circuitized substrate during said depression of said heat sink.
Claim 2
Dependent Claim
158 words
An electronic package comprising: a first circuitized substrate; a semiconductor device electrically coupled to said first circuitized substrate; a second circuitized substrate of flexible nature electrically connected to said first circuitized substrate and said semiconductor device for providing said electrical coupling between said first circuitized substrate and said semiconductor device; and a heat sink positioned on said first circuitized substrate and having said semiconductor device attached thereto at a location between said heat sink and said first circuitized substrate, said heat sink including integral pliant means for positioning said heat sink on said first circuitized substrate and for enabling said heat sink to be depressed a predetermined distance relative to said first circuitized substrate without damaging said semiconductor device, said pliant means engaging a surface of said first circuitized substrate at a spaced location from said second circuitized substrate such that said pliant means does not contact said second circuitized substrate during said depression of said heat sink.
Claim 3
Dependent Claim
34 words
The electronic package according to claim 1 wherein said first circuitized substrate is a printed circuit board having circuitry located on a surface thereof, said second circuitized substrate being electrically connected to said circuitry.
Claim 4
Dependent Claim
39 words
The electronic package according to claim 1 wherein said second circuitized substrate comprises a flexible, electrically insulative member having circuitry located thereon, said circuitry of said second substrate being electrically connected to corresponding contact locations on said semiconductor device.
Claim 5
Dependent Claim
39 words
The electronic package according to claim 1 wherein said pliant means comprises a plurality of leg members spacedly located on said heat sink and extending therefrom, each of said leg members being securely positioned on said first circuitized substrate.
Claim 6
Dependent Claim
31 words
The electronic package according to claim 4 wherein the number of said leg members is four, each of said leg members being located at a respective corner of said heat sink.
Claim 7
Dependent Claim
23 words
The electronic package according to claim 4 wherein each of said leg members is securely positioned on said first circuitized substrate using solder.
Claim 8
Dependent Claim
24 words
The electronic package according to claim 4 wherein each of said leg members is securely positioned on said first circuitized substrate using an adhesive.
Claim 9
Dependent Claim
23 words
The electronic package according to claim 7 wherein each of said leg members includes a bifurcated end portion defining and internal slot therein.
Claim 10
Dependent Claim
38 words
The electronic package according to claim 8 wherein said adhesive is located substantially within said internal slot and atop an upper surface of each of said leg members to fixedly secure said leg members to said first substrate.
Claim 11
Dependent Claim
22 words
The electronic package according to claim 8 wherein each of said leg members includes a body portion having a substantially tapered configuration.
Claim 12
Dependent Claim
19 words
The electronic package according to claim 8 wherein each of said leg members further comprises a bifurcated body portion.
Claim 13
Dependent Claim
17 words
The electronic package according to claim 7 wherein each of said leg members includes an aperture therein.
Claim 14
Dependent Claim
35 words
The electronic package according the claim 12 wherein said adhesive is located within said aperture and atop an upper surface of each of said leg members to fixedly secure said leg members to said substrate.
Claim 15
Dependent Claim
21 words
The electronic package according to claim 4 wherein each of said leg members comprises flange member projecting from said heat sink.
Claim 16
Dependent Claim
37 words
The electronic package according to claim 1 wherein said heat sink further includes integral stop means for engaging said first circuitized substrate during said depressing of said heat sink to limit the movement of said heat sink.
Claim 17
Dependent Claim
16 words
The electronic package according to claim 1 wherein said heat sink is comprised of metallic material.
Claim 18
Dependent Claim
21 words
The electronic package according to claim 16 wherein said metallic material is selected from the group consisting of aluminum and copper.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-07-17 | 1993-01-16 | 1993-07-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-07-17 | 1997-01-16 | 1997-07-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-07-17 | 2001-01-16 | 2001-07-18 | $7700.00 | Window Closed / Lapsed |