Heat dissipating retainer for electronic package

Claim 1

A retainer for a flat, rectangular package of electronic components, comprising: a generally W-shaped structure having an inner, inverted, U-shaped channel section open at opposite front, back, and bottom ends to receive said flat package of electronic components in frictional engagement under spring tension with sides of said package; said structure further having a pair of outer side walls laterally spaced from said channel section by integral inner bottom walls to dissipate by conduction, convection and radiation heat generated in said package; and wherein said channel section comprises: an upper springy ridge integral with a pair of laterally spaced first inner walls; a pair of outwardly flaring narrow bent wall portions respectively integral with said first inner walls to serve as abutments for limiting insertion of said package into said channel section; and a pair of second inner walls respectively integral with said bent wall portions and with said inner bottom walls, said second inner walls normally being inclined toward each other, and assuming parallel position only when said package is inserted into said channel section while said springy ridge flexes to retain said package in said channel section under said spring tension.