Method and apparatus for soldering and desoldering leadless semiconductor modules for printed wiring boards

Claim 1

A device for soldering semiconductor modules having contact pads on the bottom thereof to and desoldering them from leaded terminal surfaces on a printed wiring board, said device comprising: (a) a housing member having a longitudinally extending bore therethrough defined by a wall, said bore having a first opening adjacent one end of said housing adapted to enclose said module while said module is on said leaded terminal surfaces, (b) an inner member slidable in said bore, (c) means for supplying air under pressure between said wall and said inner member, said inner member having a passageway connecting an intake port at one end of said inner member to a source of vacuum connected to an exhaust port at the other end of said inner member, and (d) means for heating said air under pressure as it passes between and contacts said wall and said inner member to thereby melt said leaded terminal surfaces to enable soldering or desoldering of said module when said first opening of said housing member is brought to a position adjacent said module.

Claim 2

A device for soldering semiconductor modules having contact pads on the bottom thereof to and desoldering them from leaded terminal surfaces on a printed wiring board, said device comprising: (a) a housing member having a longitudinally extending bore therethrough defined by a wall, said bore having a first opening adjacent one end of said housing adapted to enclose said module while said module is on said leaded terminal surfaces, (b) an inner member slidable in said bore, (c) means for supplying air under pressure between said wall and said inner member, said inner member having a passageway connecting an intake port at one end of said inner member to a source of vacuum connected to an exhaust port at the other end of said inner member, and (d) means for heating said air under pressure as it passes between and contacts said wall and said inner member to thereby melt said leaded terminal surfaces to enable soldering or desoldering of said module when said first opening of said housing member is brought to a position adjacent said module.

Claim 9

A device for soldering semiconductor modules having contact pads on the bottom thereof and desoldering them from leaded terminal surfaces on a printed wiring board, said device comprising: (a) a housing member having a longitudinally exteding bore therethrough defined by a wall, said bore having a first opening adjacent one end of said housing adapted to enclose said module while said module is on sAid leaded terminal surfaces, (b) an inner member slidable in said bore, said housing having a second opening communicating with said bore adjacent the other end of said housing, said inner member extending through said second opening, (c) plate means attached to said inner member adjacent said port at the other end thereof, (d) guide means extending between said housing member and said plate means, (e) resilient means on said guide means to bias said plate means away from said housing member, (f) means for supplying air under pressure between said wall and said inner member, said inner member having a passageway connecting an intake port at one end of said inner member to a source of vacuum connected to an exhaust port at the other end of said inner member for drawing said air under pressure through said port, and (g) means for heating said air under pressure as it passes between said wall and said inner member to thereby melt said leaded terminal surfaces to enable soldering or desoldering of said module when said first opening of said housing member is brought to a position adjacent said module.

Claim 10

A device for soldering semiconductor modules having contact pads on the bottom thereof and desoldering them from leaded terminal surfaces on a printed wiring board, said device comprising: (a) a housing member having a longitudinally exteding bore therethrough defined by a wall, said bore having a first opening adjacent one end of said housing adapted to enclose said module while said module is on sAid leaded terminal surfaces, (b) an inner member slidable in said bore, said housing having a second opening communicating with said bore adjacent the other end of said housing, said inner member extending through said second opening, (c) plate means attached to said inner member adjacent said port at the other end thereof, (d) guide means extending between said housing member and said plate means, (e) resilient means on said guide means to bias said plate means away from said housing member, (f) means for supplying air under pressure between said wall and said inner member, said inner member having a passageway connecting an intake port at one end of said inner member to a source of vacuum connected to an exhaust port at the other end of said inner member for drawing said air under pressure through said port, and (g) means for heating said air under pressure as it passes between said wall and said inner member to thereby melt said leaded terminal surfaces to enable soldering or desoldering of said module when said first opening of said housing member is brought to a position adjacent said module.

Claim 11

A device for soldering semiconductor modules having contact pads on the bottom thereof to and desoldering them from leaded terminal surfaces on a printed wiring board, said device comrising: (a) a housing member having a longitudinally extending bore therethrough defined by a wall, said bore having a first opening adjacent one end of said housing adapted to enclose said module while said module is on said leaded terminal surfaces, (b) an inner member slidable in said bore, (c) means for supplying air under pressure between said wall and said inner member, said inner member having a passageway connecting an intake port at one end of said inner member to a source of vacuum connected to an exhaust port at the other end of said inner member for drawing said air under pressure through said port, and (d) means for heating said air under pressure as it passes between said wall and said inner member to thereby melt said leaded terminal surfaces to enable soldering or desoldering of said module when said first opening of said housing member is brought to a position adjacent said module, said means for heating said air under pressure being at least one electrical resistance means secured to said inner member and extending longitudinally thereof to a point adjacent to said port at said one end thereof, said electrical resistance means being so constructed that heat radiated thereby gradually decreases in amount from a maximum adjacent said intake port to a minimum adjacent to said exhaust port.

Claim 12

A device for soldering semiconductor modules having contact pads on the bottom thereof to and desoldering them from leaded terminal surfaces on a printed wiring board, said device comrising: (a) a housing member having a longitudinally extending bore therethrough defined by a wall, said bore having a first opening adjacent one end of said housing adapted to enclose said module while said module is on said leaded terminal surfaces, (b) an inner member slidable in said bore, (c) means for supplying air under pressure between said wall and said inner member, said inner member having a passageway connecting an intake port at one end of said inner member to a source of vacuum connected to an exhaust port at the other end of said inner member for drawing said air under pressure through said port, and (d) means for heating said air under pressure as it passes between said wall and said inner member to thereby melt said leaded terminal surfaces to enable soldering or desoldering of said module when said first opening of said housing member is brought to a position adjacent said module, said means for heating said air under pressure being at least one electrical resistance means secured to said inner member and extending longitudinally thereof to a point adjacent to said port at said one end thereof, said electrical resistance means being so constructed that heat radiated thereby gradually decreases in amount from a maximum adjacent said intake port to a minimum adjacent to said exhaust port.