US4066204A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process and device for unsoldering semiconductor modules in the flip-chip technique
Assignee: Siemens AG
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Filing: 1976-06-14
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Granted: 1978-01-03
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Expires: 1996-06-14
Abstract
Abstract A method and device for unsoldering semiconductor modules which are soldered onto terminal surfaces of a carrier by terminals pads composed of soft solder is disclosed herein. A suction cup is placed onto a semiconductor module to be unsoldered and the terminal pads are melted. The suction cup is raised together with the semiconductor module, and, with a burst of compressed air, the semiconductor module is removed. The suction cup is then lowered onto the terminal surfaces and soft solder residues are melted and sucked away.
Inventors
- 👤 Oskar Wirbser
- 👤 Nikolaus Ernst
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 05:15
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
114 words
A method in the flip-chip technique for unsoldering semiconductor modules which are soldered onto terminal surfaces of a carrier by terminal pads composed of soft solder, comprising the steps of: a. placing a suction cup with a base forming a filter onto the semiconductor module to be unsoldered such that the module is drawn against the filter when suction is applied; b. melting the terminal pads with heat supplied through the suction cup and the semiconductor module; c. raising the suction cup together with the semiconductor module; d. removing the semiconductor module; e. placing the suction cup onto the terminal surfaces; and f. melting and sucking away remaining soft solder residues through the filter.
Claim 2
Independent Claim
114 words
A method in the flip-chip technique for unsoldering semiconductor modules which are soldered onto terminal surfaces of a carrier by terminal pads composed of soft solder, comprising the steps of: a. placing a suction cup with a base forming a filter onto the semiconductor module to be unsoldered such that the module is drawn against the filter when suction is applied; b. melting the terminal pads with heat supplied through the suction cup and the semiconductor module; c. raising the suction cup together with the semiconductor module; d. removing the semiconductor module; e. placing the suction cup onto the terminal surfaces; and f. melting and sucking away remaining soft solder residues through the filter.
Claim 3
Dependent Claim
23 words
The method of claim 1 in which the semiconductor module is removed by an impulse of compressed air channelled into the suction cup.
Claim 4
Independent Claim
124 words
A device in the flip-chip technique for unsoldering semiconductor wafers which are soldered onto terminal surfaces of a carrier by terminal pads composed of soft solder, comprising a. a suction cup having a downwardly facing open end formed to closely surround one of the semiconductor wafers; b. a sheet-like filtering base having a plurality of aperture means for passing solder therethrough mounted within said suction cup at said open end; c. a vertically aligned tube connected to said suction cup; d. heating means connected to said suction cup; e. carrier means connected to said tube for vertical movement of said tube and suction cup; f. suction means connected to said tube; and g. a solder separator connected between said tube and said suction means.
Claim 5
Independent Claim
124 words
A device in the flip-chip technique for unsoldering semiconductor wafers which are soldered onto terminal surfaces of a carrier by terminal pads composed of soft solder, comprising a. a suction cup having a downwardly facing open end formed to closely surround one of the semiconductor wafers; b. a sheet-like filtering base having a plurality of aperture means for passing solder therethrough mounted within said suction cup at said open end; c. a vertically aligned tube connected to said suction cup; d. heating means connected to said suction cup; e. carrier means connected to said tube for vertical movement of said tube and suction cup; f. suction means connected to said tube; and g. a solder separator connected between said tube and said suction means.
Claim 6
Dependent Claim
18 words
The device of claim 3 in which a flexible tube connects between said tube and said suction means.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-01-02 | 1981-07-04 | 1982-01-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-01-02 | 1985-07-04 | 1986-01-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-01-02 | 1989-07-04 | 1990-01-03 | $7700.00 | Window Closed / Lapsed |